JPH0367454U - - Google Patents
Info
- Publication number
- JPH0367454U JPH0367454U JP12916989U JP12916989U JPH0367454U JP H0367454 U JPH0367454 U JP H0367454U JP 12916989 U JP12916989 U JP 12916989U JP 12916989 U JP12916989 U JP 12916989U JP H0367454 U JPH0367454 U JP H0367454U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- pellets
- semiconductor pellets
- positioning
- positioning means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000008188 pellet Substances 0.000 claims description 6
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
Description
第１図は、本考案の第１の実施例の分解状態を
示す断面図、第２図は同実施例の一部拡大断面図
、第３図は、本考案の第２の実施例の要部の分解
状態を示す断面図、第４図は、同実施例の要部の
一部拡大断面図である。
１……半導体ペレツト、２……マイナス電極板
、２Ａ……溝、３……プラス側電極板、４……パ
ツケージ、５……キヤツプ、６……位置決め板、
６Ａ……孔。
FIG. 1 is a sectional view showing an exploded state of the first embodiment of the present invention, FIG. 2 is a partially enlarged sectional view of the same embodiment, and FIG. 3 is a main part of the second embodiment of the present invention. FIG. 4 is a partially enlarged sectional view of the main part of the same embodiment. DESCRIPTION OF SYMBOLS 1... Semiconductor pellet, 2... Negative electrode plate, 2A... Groove, 3... Positive side electrode plate, 4... Package, 5... Cap, 6... Positioning plate,
6A...hole.
Claims (1)
レツトに加圧接触して当該複数の半導体ペレツト
を並列接続するための一対の電極部材と、前記複
数の半導体ペレツトのそれぞれを位置決めするた
めの位置決め手段とを備えたことを特徴とする半
導体装置。 ２ 前記位置決め手段は、前記一対の電極部材の
いずれか一方または双方に形成した複数の凹所で
あることを特徴とする請求項第１に記載の半導体
装置。 ３ 前記位置決め手段は、前記各半導体ペレツト
を入れる複数の孔を形成した位置決め板であるこ
とを特徴とする請求項第１項記載の半導体装置。[Claims for Utility Model Registration] 1. A plurality of semiconductor pellets, a pair of electrode members for connecting the plurality of semiconductor pellets in parallel by pressurizing contact with the plurality of semiconductor pellets, and each of the plurality of semiconductor pellets. and positioning means for positioning the semiconductor device. 2. The semiconductor device according to claim 1, wherein the positioning means is a plurality of recesses formed in one or both of the pair of electrode members. 3. The semiconductor device according to claim 1, wherein the positioning means is a positioning plate having a plurality of holes into which the semiconductor pellets are placed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12916989U JPH0367454U (en) | 1989-11-06 | 1989-11-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12916989U JPH0367454U (en) | 1989-11-06 | 1989-11-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0367454U true JPH0367454U (en) | 1991-07-01 |
Family
ID=31676825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12916989U Pending JPH0367454U (en) | 1989-11-06 | 1989-11-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0367454U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008261179A (en) * | 2007-04-13 | 2008-10-30 | Artrock:Kk | Tile panel and connecting member for the same |
-
1989
- 1989-11-06 JP JP12916989U patent/JPH0367454U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008261179A (en) * | 2007-04-13 | 2008-10-30 | Artrock:Kk | Tile panel and connecting member for the same |
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