JPH0366110A - Manufacture of lead type chip coil - Google Patents
Manufacture of lead type chip coilInfo
- Publication number
- JPH0366110A JPH0366110A JP20233989A JP20233989A JPH0366110A JP H0366110 A JPH0366110 A JP H0366110A JP 20233989 A JP20233989 A JP 20233989A JP 20233989 A JP20233989 A JP 20233989A JP H0366110 A JPH0366110 A JP H0366110A
- Authority
- JP
- Japan
- Prior art keywords
- core
- lead terminal
- lead
- terminal plate
- coil element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 238000004804 winding Methods 0.000 claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 6
- 229920005989 resin Polymers 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 23
- 239000004020 conductor Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 3
- 230000013011 mating Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract description 8
- 239000003566 sealing material Substances 0.000 abstract description 6
- 230000002093 peripheral effect Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 239000000843 powder Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Abstract
Description
【発明の詳細な説明】
イ１発明の目的
〔産業上の利用分野〕
本発明は口字形磁性コアを用いた表面実装用の有り−ド
型チップコイルの製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (1) Object of the Invention [Field of Industrial Application] The present invention relates to a method for manufacturing a dovetail chip coil for surface mounting using a square-shaped magnetic core.
断面が方形である高い比透磁率特性を持っ口字形磁性コ
ア（以下コアと称す）を用いた従来の表面実装用の有り
−ド型チップコイルは、コアの表面に絶縁処理を施して
、一方の対向辺部に所要の巻線を巻き回してコイル素子
を作り、巻線を施さないコア両辺部にフォーク形状のリ
ードフレーム端子をその分岐端部により挟着して取り付
け、巻線の端部をフレーム端子にからげて半田付けし接
続した後、フレーム端子の端部を露出させてコイル素子
を樹脂封止材により封止し、露出端子を表面実装が可能
な所要の形に成形した構造であった。Conventional dovetail chip coils for surface mounting use a square-shaped magnetic core (hereinafter referred to as the core) with a square cross section and high relative magnetic permeability characteristics. A coil element is created by winding the required winding wire around the opposite sides of the core, and a fork-shaped lead frame terminal is attached to both sides of the core where no winding is applied by sandwiching the fork-shaped lead frame terminals between the branched ends of the core. is connected to the frame terminal by soldering, the end of the frame terminal is exposed, the coil element is sealed with a resin sealant, and the exposed terminal is molded into the required shape that can be surface mounted. Met.
リードフレーム端子によりコアを堅く挟着するためには
、コアの外形寸法を精度よく仕上げる必要があり、また
コ、イルの巻線端部をフレーム端子にからげる作業は厄
介であり、自動化が困難であるので製造費用が多くなる
という問題があり、口字形コアには基板に係合する小凹
部を設け、基板にはＬ字形のリード用端子板を取り付け
る矩形穴と、巻線端部を基板裏面に取り付けた半田付ラ
ンドに接続する貫通孔を取り付けてあり、巻線端部とリ
ード用端子板は基板上の半田付ランド上で接続する。In order to securely clamp the core between the lead frame terminals, the external dimensions of the core must be finished with high accuracy, and the work of connecting the winding ends of the coils and coils to the frame terminals is cumbersome and cannot be automated. Since it is difficult, there is a problem that the manufacturing cost increases, so the mouth-shaped core has a small recess that engages with the board, and the board has a rectangular hole to attach an L-shaped lead terminal plate and a winding end. A through hole is attached to connect to the soldering land attached to the back of the board, and the winding end and the lead terminal plate are connected on the soldering land on the board.
口０発明の構成
〔課題を解決するための手段〕
本発明は、外周辺縁に上下、並びに対向辺に一対の４個
の係合用小凹部を設けた口字形コアを用いたコイル素子
を用い、表面実装に適するリード用端子板と、コアの小
凹部に係合するコア支持片を内周辺に設けた額縁形のリ
ードスルー型の絶縁基板とを組み合せたことを特徴とす
る。本発明の額縁形のリードスルー型の絶縁基板は基板
上に巻線端部を接続する貫通孔と、Ｌ字形のリード用端
子板を取り付ける矩形孔を設け、貫通孔と矩形孔は基板
裏面の半田付ランドにより接続されているため、巻線端
部とリード用端子板ばからげを必要とせず接続出来る。Configuration of the Invention [Means for Solving the Problems] The present invention uses a coil element that uses a mouth-shaped core with a pair of four small engagement recesses provided on the upper and lower edges of the outer periphery and on opposite sides. , is characterized by a combination of a lead terminal board suitable for surface mounting and a frame-shaped lead-through type insulating substrate having a core support piece on the inner periphery that engages with a small recess of the core. The frame-shaped lead-through type insulating substrate of the present invention has a through hole for connecting the winding ends on the substrate and a rectangular hole for attaching an L-shaped lead terminal plate, and the through hole and the rectangular hole are provided on the back side of the substrate. Since the connection is made with a soldered land, the connection can be made without the need to separate the winding end and the lead terminal plate.
即ち本発明は、外周辺縁の互いに対向する４箇所に、そ
れぞれ小凹部を設けた口字形磁性コアに巻線を施したコ
イル素子と、複数個のリード用端子板と、前記口字形磁
性コアを同心に遊挿する額縁形であり、前記巻線の端部
を挿通する貫通孔と前記リード用端子板を挿通する矩形
孔との間を接続する中継用導体が設けられ、内周面に前
記小凹部に係合するコア支持片が突設された額縁形絶縁
基板とを組合せ、前記リード用端子板の端部を露出させ
て、前記コイル素子並びに額縁形絶縁基板を樹脂により
封止成形したことを特徴とする有リード型チップコイル
の製造方法。That is, the present invention includes a coil element in which wires are wound around a mouth-shaped magnetic core having small recesses provided at four opposing locations on the outer periphery, a plurality of lead terminal plates, and the mouth-shaped magnetic core. A relay conductor is provided on the inner peripheral surface to connect between the through hole through which the end of the winding is inserted and the rectangular hole through which the lead terminal board is inserted. The coil element and the frame-shaped insulating substrate are combined with a picture frame-shaped insulating substrate having a protruding core support piece that engages with the small recess, and the ends of the lead terminal plate are exposed, and the coil element and the picture-frame-shaped insulating substrate are sealed and molded with resin. A method for manufacturing a leaded chip coil characterized by the following.
本発明に用いる額縁型絶縁基板は、コア支持片でコアの
小凹部を支持してコイル素子を支持し。The frame-type insulating substrate used in the present invention supports the coil element by supporting the small recess of the core with the core support piece.
また基板の貫通孔に通した巻線端部と、基板の矩形孔に
通したリード用端子板を共通の中継用導体に半田付けに
より接合して接続する。Further, the winding end passed through the through hole of the board and the lead terminal plate passed through the rectangular hole of the board are joined and connected to a common relay conductor by soldering.
以下、本発明の一実施例を図面を用い説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第１図は本発明の有リード型チップコイルの正面断面図
を示す。１は平面形状が口字形磁性コアで、高い比透磁
率特性を持つ金属磁性材料の微粉末を成形した圧粉磁心
、又は焼結した高い比透磁率特性を持つフェライトコア
である。２は額縁形の絶縁基板である。３は銅板等の良
導体で作られたリード端子板であり、４は樹脂の封止材
である。FIG. 1 shows a front sectional view of a leaded chip coil of the present invention. Reference numeral 1 denotes a magnetic core having a square-shaped planar shape, which is a powder magnetic core formed from fine powder of a metal magnetic material having a high relative magnetic permeability characteristic, or a sintered ferrite core having a high relative magnetic permeability characteristic. 2 is a frame-shaped insulating substrate. 3 is a lead terminal board made of a good conductor such as a copper plate, and 4 is a resin sealing material.
コア１は、第２図に示すように方形断面を持つ口字形で
対向短辺部外側面の下部辺縁の中央部に角形のコアｌの
上下の方向性をなくすために上部、下部辺縁にも設けた
小凹部１１がそれぞれ設けられたものである。１個の巻
線５がコアｌの両長辺部に連続的に巻き回されてノーマ
ルモートチ寓−クコイル素子が作られる。As shown in Fig. 2, the core 1 has a rectangular cross-section and has an upper and lower edge in the center of the lower edge of the outer surface of the opposite short side to eliminate the vertical directionality of the square core l. A small recess 11 is also provided in each of the holes. One winding 5 is continuously wound around both long sides of the core 1 to form a normal motor chain coil element.
額縁形絶縁基板（以下基板と称す〉２は、その中央角孔
がコア１の底面外形より一回り大きい寸法のもので、角
孔の短辺壁面中央部にコア１の小凹部１１に係合する一
対のコア支持片２１が設けられている。基板２の両短辺
部には中央部にリード用端子板３を通す矩形孔２２が形
成され、対角部に巻線５の端部を通す貫通孔２３が形成
されており、底面に矩形孔２２と貫通孔２３とに亘る図
示しない半田付ランドの中継用導体が設けられている。The frame-shaped insulating substrate (hereinafter referred to as the substrate) 2 has a central square hole that is slightly larger than the outer diameter of the bottom surface of the core 1, and is engaged with the small recess 11 of the core 1 at the center of the short side wall of the square hole. A pair of core support pieces 21 are provided on both short sides of the board 2. A rectangular hole 22 through which the lead terminal plate 3 is passed is formed in the center of both short sides of the board 2, and a rectangular hole 22 through which the lead terminal plate 3 is passed is formed in the diagonal part. A through hole 23 is formed, and a relay conductor for a soldering land (not shown) extending between the rectangular hole 22 and the through hole 23 is provided on the bottom surface.
第３図はこのようなコア１のコイル素子および基板２と
リード用端子板３とを組み合せた形状を示す。FIG. 3 shows the shape of a combination of the coil element of the core 1, the substrate 2, and the lead terminal plate 3. As shown in FIG.
基板２の中央角孔に上方からコイル素子を小凹部１１と
コア支持片２１を係合させて納め入れ、貫通孔２３に通
した巻線５の端部と、矩形孔２２に水平部を外方に向け
て下方から通したＬ字形のリード用端子板３とを半田付
ランドに半田付けにより接合して組み上げる。Insert the coil element into the central square hole of the substrate 2 from above by engaging the small recess 11 and the core support piece 21, and insert the end of the winding 5 passed through the through hole 23 and the horizontal part into the rectangular hole 22. An L-shaped lead terminal plate 3 passed through from below toward the direction is assembled by joining it to the soldering land by soldering.
小凹部１１の深さはコイル素子の底面が基板２の底面よ
り下方に突出しないように基板２の厚さより若干小さく
設定されている。The depth of the small recess 11 is set to be slightly smaller than the thickness of the substrate 2 so that the bottom surface of the coil element does not protrude below the bottom surface of the substrate 2.
封止材４による成形体の外観を第３図に鎖線で示す。封
止材４は、第１図に示すように、リード一
用端子板３の水平部の底部および端部を露出させてコイ
ル素子および基板２を樹脂により封止し、リード用端子
板３の水平部底面がそのまま表面実装用リードとなるチ
ップコイルを形成している。The appearance of the molded body formed by the sealing material 4 is shown by a chain line in FIG. As shown in FIG. 1, the sealing material 4 exposes the bottom and ends of the horizontal portion of the lead terminal plate 3 and seals the coil element and the substrate 2 with resin. The bottom surface of the horizontal portion directly forms a chip coil that serves as a lead for surface mounting.
リード用端子板３はその水平部を封止材４の成形体の側
面から露出されて表面実装が可能な形に成形してもよい
。The lead terminal plate 3 may be molded into a shape in which the horizontal portion thereof is exposed from the side surface of the molded body of the sealing material 4 and surface mounting is possible.
なお、本発明の実施例はリード用端子板を対向辺に１ケ
づつ取り付けた例で説明したが、１つの辺に２ケづつ取
り付け、コアの両辺に夫々同方向に巻線を施して夫々の
巻線端末をリード用端子板に接続することによりコモン
モードチョークコイルを構成出来る。The embodiment of the present invention has been described with an example in which one lead terminal plate is attached to each opposite side, but two lead terminal plates are attached to each side, and wires are wound in the same direction on both sides of the core, respectively. A common mode choke coil can be constructed by connecting the winding terminals to the lead terminal board.
ハ１発明の効果
〔５ｈ明の効果〕
本発明によるチップコイルは、口字形磁性コアの小凹部
と額縁形絶縁基板のコア支持片を係合してコイル素子と
基板とを組み付け、基板にリードスルー型の中継用導体
を取り付けてコアとリードフレーム端子の装着作業をな
くし、巻線の端部のからげ作業をなくしたので、コアの
外形寸法を精度よく仕上げる必要がなく加工費が削減で
き、単純な作業だけで組立てでき、従って従来より安価
な有リード型チップコイルを提供出来る。C1 Effects of the invention [5h Effects of light] The chip coil according to the present invention engages the small recess of the mouth-shaped magnetic core with the core support piece of the frame-shaped insulating substrate to assemble the coil element and the substrate, and leads to the substrate. By attaching a through-type relay conductor, the work of attaching the core and lead frame terminals is eliminated, and the work of tying the ends of the windings is eliminated, so there is no need to accurately finish the external dimensions of the core, reducing processing costs. Therefore, it is possible to provide a leaded chip coil that can be assembled by simple operations and is therefore cheaper than the conventional one.
第１図は本づ６明の有リード型チップコイルの一実施例
を示す正面断面図。
第２図は本発明の有リード型チップコイルの分解斜視図
。
第３図は本発明の有り−ド型チップコイルの封止前の組
立状態を示す外観斜視図。
１・・・口字形磁性コア、２・・・額縁形絶縁基板、３
・・・リード用端子板、４・・・封止材、５・・・巻線
、１１・・・小凹部、２１・・・コア支持片、２２・・
・矩形孔、２３・・・貫通孔。FIG. 1 is a front sectional view showing one embodiment of the leaded chip coil of Honzu6mei. FIG. 2 is an exploded perspective view of the leaded chip coil of the present invention. FIG. 3 is an external perspective view showing the assembled state of the doped chip coil of the present invention before sealing. 1... Mouth-shaped magnetic core, 2... Frame-shaped insulating substrate, 3
... Lead terminal plate, 4... Sealing material, 5... Winding wire, 11... Small recess, 21... Core support piece, 22...
- Rectangular hole, 23... through hole.
Claims (1)
凹部を設けたロ字形磁性コアに巻線を施したコイル素子
と、複数個のリード用端子板と、前記ロ字形磁性コアを
同心に遊挿する額縁形であり、前記巻線の端部を挿通す
る貫通孔と前記リード用端子板を挿通する矩形孔との間
を接続する中継用導体が設けられ、内周面に前記小凹部
に係合するコア支持片が突設された額縁形絶縁基板とを
組合せ、前記リード用端子板の端部を露出させて、前記
コイル素子並びに額縁形絶縁基板を樹脂により封止成形
したことを特徴とする有リード型チップコイルの製造方
法。1. A coil element in which wires are wound around a square-shaped magnetic core with small recesses provided at four opposing locations on the outer periphery, a plurality of lead terminal plates, and the square-shaped magnetic core are loosely inserted concentrically. A relay conductor is provided to connect between the through hole through which the end of the winding is inserted and the rectangular hole through which the lead terminal plate is inserted, and a relay conductor is provided on the inner circumferential surface that engages with the small recess. The coil element and the frame-shaped insulating substrate are combined with a picture-frame-shaped insulating substrate on which a mating core support piece is protruded, and the ends of the lead terminal plates are exposed, and the coil element and the picture-frame-shaped insulating substrate are sealed and molded with resin. A method for manufacturing a leaded chip coil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20233989A JP2873378B2 (en) | 1989-08-03 | 1989-08-03 | Leaded chip coil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20233989A JP2873378B2 (en) | 1989-08-03 | 1989-08-03 | Leaded chip coil |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0366110A true JPH0366110A (en) | 1991-03-20 |
| JP2873378B2 JP2873378B2 (en) | 1999-03-24 |
Family
ID=16455905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20233989A Expired - Fee Related JP2873378B2 (en) | 1989-08-03 | 1989-08-03 | Leaded chip coil |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2873378B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015005579A (en) * | 2013-06-19 | 2015-01-08 | 株式会社タムラ製作所 | Reactor and manufacturing method for reactor |
| US9174953B2 (en) | 2009-12-18 | 2015-11-03 | Janssen Pharmaceutica Nv | Bicyclic thiazoles as allosteric modulators of mGluR5 receptors |
-
1989
- 1989-08-03 JP JP20233989A patent/JP2873378B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9174953B2 (en) | 2009-12-18 | 2015-11-03 | Janssen Pharmaceutica Nv | Bicyclic thiazoles as allosteric modulators of mGluR5 receptors |
| JP2015005579A (en) * | 2013-06-19 | 2015-01-08 | 株式会社タムラ製作所 | Reactor and manufacturing method for reactor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2873378B2 (en) | 1999-03-24 |
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