JP3336346B2 - Chip inductance element - Google Patents

Chip inductance element

Info

Publication number
JP3336346B2
JP3336346B2 JP17565497A JP17565497A JP3336346B2 JP 3336346 B2 JP3336346 B2 JP 3336346B2 JP 17565497 A JP17565497 A JP 17565497A JP 17565497 A JP17565497 A JP 17565497A JP 3336346 B2 JP3336346 B2 JP 3336346B2
Authority
JP
Japan
Prior art keywords
base
metal plate
inductance element
chip inductance
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP17565497A
Other languages
Japanese (ja)
Other versions
JPH1126254A (en
Inventor
勉 小柳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumida Corp
Original Assignee
Sumida Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumida Corp filed Critical Sumida Corp
Priority to JP17565497A priority Critical patent/JP3336346B2/en
Publication of JPH1126254A publication Critical patent/JPH1126254A/en
Application granted granted Critical
Publication of JP3336346B2 publication Critical patent/JP3336346B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、基板面に実装可能
な小型のチップインダクタンス素子に関し、特に構造が
簡単で安価なチップインダクタンス素子に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a small chip inductance element which can be mounted on a substrate surface, and more particularly to a simple and inexpensive chip inductance element.

【0002】[0002]

【従来の技術】電子機器に使用される小型のチップイン
ダクタンス素子としては、従来から種々の提案がなされ
ている。例えば実公平7−23929号公報に記載され
たチップインダクタンス素子は図6に示すように構成さ
れている。
2. Description of the Related Art Various small chip inductance elements used in electronic equipment have been proposed in the past. For example, the chip inductance element described in Japanese Utility Model Publication No. 7-23929 is configured as shown in FIG.

【0003】図6において、コア1には端面と周面とを
有する2つの鍔部2と1つのコイル巻回部3とが同心上
に一体に形成されている。一方の鍔部2の端面には直径
上に形成された比較的広い仕切部4を介して、両側にそ
れぞれ断面が円弧状の凹部5が形成されている。また凹
部5と仕切部4とにより区画された四隅には平面状の隅
部6が形成され、仕切部4と隅部6とは同一平面上に位
置している。さらに仕切部4の凹部5に隣接する側面に
は阻止壁7が設けられており、仕切部4を除く凹部5及
び隅部6の表面は連続した電極層8で被覆されている。
In FIG. 6, a core 1 has two flanges 2 each having an end surface and a peripheral surface and one coil winding portion 3 formed concentrically and integrally. An arc-shaped concave portion 5 is formed on each side of the end face of one flange 2 via a relatively wide partition 4 formed on the diameter. Plane corners 6 are formed at four corners defined by the recess 5 and the partition 4, and the partition 4 and the corner 6 are located on the same plane. Further, a blocking wall 7 is provided on a side surface of the partition portion 4 adjacent to the concave portion 5, and the surfaces of the concave portion 5 and the corner portion 6 excluding the partition portion 4 are covered with a continuous electrode layer 8.

【0004】 上記のように構成されたチップインダク
タンス素子において、コイル巻回部3に巻回されたコイ
ルの両端の端末部9は、それぞれ仕切部4で区画された
両側の凹部5の表面の電極層8に接続されている。この
ためチップインダクタンス素子を基板表面に実装すると
き、基板面と鍔部2の端面との間に隙間が形成され、溶
融半田の逃げの役割を果す。また1対のコイルの端末部
9は阻止壁7により隔離され、溶融半田の流出が阻止さ
れて、端末部9の短絡が防止できる。
In the chip inductance element configured as described above, the terminal portions 9 at both ends of the coil wound around the coil winding portion 3 are connected to the electrodes on the surfaces of the concave portions 5 on both sides partitioned by the partition portions 4. Connected to layer 8. Therefore, when the chip inductance element is mounted on the surface of the substrate, a gap is formed between the substrate surface and the end surface of the flange portion 2, and plays a role of escaping the molten solder. Further, the terminal portions 9 of the pair of coils are isolated by the blocking wall 7, so that the outflow of the molten solder is prevented, and the short circuit of the terminal portions 9 can be prevented.

【0005】[0005]

【発明が解決しようとする課題】しかしながら上記のよ
うに構成された従来のチップインダクタンス素子におい
ては、コア1の一方の鍔部2の端面に複雑な形状の仕切
部4や凹部5を形成しなければならず、しかも電極層8
で被覆しなければならないため、コスト高になるという
問題があった。
However, in the conventional chip inductance element configured as described above, the partition 4 and the recess 5 having a complicated shape must be formed on the end face of the one flange 2 of the core 1. And the electrode layer 8
In this case, there is a problem that the cost is increased because of the necessity of coating.

【0006】本発明はこのような状況に鑑みてなされた
もので、簡単な構造で安価なチップインダクタンス素子
を提供することを目的とする。
The present invention has been made in view of such circumstances, and has as its object to provide an inexpensive chip inductance element with a simple structure.

【0007】[0007]

【課題を解決するための手段】本発明に係るチップイン
ダクタンス素子は、コイルが巻装され両端に鍔部を有す
るコアと、該コアが載設される板状の基体と、前記基体
における底面において、該基体の第1の側部から対向す
る第2の側部へ向けて形成された溝部と、前記基体の側
部に密接すると共に板厚方向に前記基体を挟持するよう
に前記側部における両端部に位置付けられた一対の挟持
部と、この一対の挟持部を結合すると共に中央部におい
て前記基体の溝部に嵌合する突出部を備える連結部とを
有する一対の金属板端子とを具備し、前記一対の金属板
端子それぞれを前記基体の第1の側部と第2の側部に設
け、前記コイルから引き出された両端の端末部をそれぞ
れ別の金属板端子の前記突出部に電気的に接続したこと
を特徴とする。
Means for Solving the Problems A chip-in according to the present invention
The ductance element includes a core wound with a coil and having flanges at both ends, a plate-shaped base on which the core is mounted, and the base
At the bottom surface of the substrate, facing the first side of the base.
A groove formed toward the second side portion, and a side of the base.
So that it is in close contact with the
A pair of pinches positioned at both ends of the side portion
Part and the pair of holding parts, and
And a connecting portion having a protruding portion fitted into the groove portion of the base.
Having a pair of metal plate terminals having
Each terminal is provided on a first side and a second side of the base.
Each end of the coil pulled out from the coil
It is characterized by being electrically connected to the protruding portion of another metal plate terminal .

【0008】[0008]

【0009】本発明のチップインダクタンス素子におい
ては、基体に金属板端子を嵌合させたので、コアに電極
を形成したり複雑な加工をする必要がなくなり、コスト
の低減を図ることができる。
In the chip inductance element according to the present invention , since the metal plate terminal is fitted to the base, it is not necessary to form an electrode on the core or perform complicated processing, and the cost can be reduced.

【0010】本発明のチップインダクタンス素子におい
ては、金属板端子の両端に形成された挾持部を介して金
属板端子を基体に保持することができ、中央に形成され
た突出部を基体に形成された溝部に嵌合させることによ
り、金属板端子を基体に取り付ける際の位置決めが確実
となり、かつ強固に取り付けることができる。また、コ
イル両端の端末部を溝部を通して金属板端子に導くこと
ができ、接続が容易となる。
In the chip inductance element of the present invention , the metal plate terminal can be held on the base via the holding portions formed at both ends of the metal plate terminal, and the protrusion formed at the center is formed on the base. By fitting the metal plate terminal into the base, the positioning at the time of mounting the metal plate terminal on the base body is ensured, and the metal plate terminal can be firmly mounted. In addition, the terminal portions at both ends of the coil can be guided to the metal plate terminals through the groove portions, thereby facilitating connection .

【0011】[0011]

【発明の実施の形態】以下、本発明のチップインダクタ
ンス素子の実施の形態の構成例を図面を参照して説明す
る。図1は本発明のチップインダクタンス素子の構成例
を示す組立正面図、図2は図1の上面図、図3は図1の
下面図である。また図4は図1の基体11の上面図、図
5は図1の金属板端子14の形状を示す斜視図である。
これらの図において、図6に示す従来例の部分に対応す
る部分には同一の符号を付してあり、その説明は適宜省
略する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A configuration example of a preferred embodiment of a chip inductance element according to the present invention will be described below with reference to the drawings. FIG. 1 is an assembly front view showing a configuration example of a chip inductance element of the present invention, FIG. 2 is a top view of FIG. 1, and FIG. 3 is a bottom view of FIG. 4 is a top view of the base 11 of FIG. 1, and FIG. 5 is a perspective view showing the shape of the metal plate terminal 14 of FIG.
In these figures, portions corresponding to those of the conventional example shown in FIG. 6 are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

【0012】図1乃至図3において、コア1は従来例と
同様に上下一対の鍔部2とコイル巻回部3とが同心上に
一体に形成されてなっている。ただし鍔部2の端面には
図6に示すような仕切部4、凹部5、隅部6、阻止壁
7、電極層8は形成されておらず、単純な平面となって
いる。コア1は絶縁性を有する角板状の基体11上に載
設されている。
1 to 3, the core 1 has a pair of upper and lower flange portions 2 and a coil winding portion 3 formed concentrically and integrally as in the conventional example. However, the end face of the flange 2 is not formed with the partition 4, the recess 5, the corner 6, the blocking wall 7, and the electrode layer 8 as shown in FIG. The core 1 is mounted on a square plate-shaped base 11 having an insulating property.

【0013】基体11は図4に示すように、対向する2
辺の中央には断面が矩形状の溝部12が切り込み形成さ
れている。また基体11の上面中心にはコア1の下部鍔
部2の端面中心に形成された図示しない円形の凸部が嵌
合位置決めされる円形の凹部13が形成されている。さ
らに基体11の対向する2辺にはそれぞれ金属板端子1
4が嵌合装着されている。金属板端子14の長手方向の
位置は溝部12の内周の外側に突出して形成された凸部
12aによって位置決めされる。
As shown in FIG. 4, the base 11
At the center of the side, a groove 12 having a rectangular cross section is cut and formed. A circular concave portion 13 is formed at the center of the upper surface of the base 11 so that a circular convex portion (not shown) formed at the center of the end surface of the lower flange portion 2 of the core 1 is fitted and positioned. Further, metal plate terminals 1 are provided on two opposite sides of the base 11, respectively.
4 is fitted and mounted. The position of the metal plate terminal 14 in the longitudinal direction is determined by a protrusion 12 a formed to protrude outside the inner periphery of the groove 12.

【0014】金属板端子14は、図5に示すように、長
手方向の中央部には内側に突出した突出部14bが形成
されており、その両側部には断面がコ字状に折り曲げ形
成された挾持部14aが設けられている。そして金属板
端子14を基体11の対向する2辺に嵌合装着したと
き、突出部14bは基体11の溝部12に嵌合し位置決
めされ、また挾持部14aは溝部12の角部に形成され
た凸部12aと、基体11の両側に形成された突条部1
2bとの間に位置決め固定され、基体11の両面を挾持
するようになっている、
As shown in FIG. 5, the metal plate terminal 14 has a protruding portion 14b which protrudes inward at the center in the longitudinal direction, and has a U-shaped cross section on both sides. A holding portion 14a is provided. When the metal plate terminal 14 is fitted and mounted on two opposing sides of the base 11, the protruding portion 14b is fitted and positioned in the groove 12 of the base 11, and the holding portion 14a is formed at a corner of the groove 12. A convex portion 12a and a ridge portion 1 formed on both sides of the base 11
2b between the base 11 and the base 11 so as to sandwich both sides of the base 11.

【0015】本実施の形態に示したチップインダクタン
ス素子によれば、コイル端末部9が接続される金属板端
子14をコア1が載設された基体11の対向する2辺に
嵌着するようにしたので、コア1の鍔部端面に複雑な加
工をする必要がなく、また高価な電極層を形成する必要
もなくなり、構造を簡単とし低コストとすることができ
る。また金属板端子14は基体11の対向する2辺に別
々に装着してあるので、半田付け時に金属板端子14が
矩絡することがない。
According to the chip inductance element shown in the present embodiment, the metal plate terminal 14 to which the coil end portion 9 is connected is fitted to two opposing sides of the base 11 on which the core 1 is mounted. Therefore, there is no need to perform complicated processing on the end face of the flange portion of the core 1, and it is not necessary to form an expensive electrode layer, so that the structure can be simplified and the cost can be reduced. Further, since the metal plate terminals 14 are separately mounted on two opposing sides of the base 11, the metal plate terminals 14 are not entangled at the time of soldering.

【0016】[0016]

【発明の効果】以上説明したように、本発明のチップイ
ンダクタンス素子によれば、基体の対向する第1の側部
と第2の側部にコイルの両端が接続される金属板端子を
嵌着したので、構造を簡単としコストの低減を図ること
ができる。
As described above, according to the chip inductance element of the present invention, the opposing first side portion of the base is provided.
Since the metal plate terminals to which both ends of the coil are connected are fitted to the second side and the second side , the structure can be simplified and the cost can be reduced.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明のチップインダクタンス素子の実施の形
態の構成例を示す組立正面図である。
FIG. 1 is an assembly front view showing a configuration example of an embodiment of a chip inductance element of the present invention.

【図2】図1の上面図である。FIG. 2 is a top view of FIG.

【図3】図1の下面図である。FIG. 3 is a bottom view of FIG. 1;

【図4】図1の基体の構成を示す上面図である。FIG. 4 is a top view showing the configuration of the base body of FIG.

【図5】図1の金属板端子の形状を示す斜視図である。FIG. 5 is a perspective view showing a shape of the metal plate terminal of FIG. 1;

【図6】従来のチップインダクタンス素子の一例の構成
を示す斜視図である。
FIG. 6 is a perspective view showing a configuration of an example of a conventional chip inductance element.

【符号の説明】[Explanation of symbols]

1 コア 2 鍔部 3 コイル巻回部(コイル) 9 コイル端末部 11 基体 12 溝部 14 金属板端子 14a 挾持部 14b 突出部 DESCRIPTION OF SYMBOLS 1 Core 2 Flange part 3 Coil winding part (coil) 9 Coil terminal part 11 Base 12 Groove part 14 Metal plate terminal 14a Clamping part 14b Projection

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7,DB名) H01F 27/29 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 7 , DB name) H01F 27/29

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 コイルが巻装され両端に鍔部を有するコ
アと、 該コアが載設される板状の基体と、前記基体における底面において、該基体の第1の側部か
ら対向する第2の側部へ向けて形成された溝部と、 前記基体の側部に密接すると共に板厚方向に前記基体を
挟持するように前記側部における両端部に位置付けられ
た一対の挟持部と、この一対の挟持部を結合すると共に
中央部において前記基体の溝部に嵌合する突出部を備え
る連結部とを有する一対の金属板端子とを具備し、 前記一対の金属板端子それぞれを前記基体の第1の側部
と第2の側部に設け、前記コイルから引き出された両端
の端末部をそれぞれ別の金属板端子の前記突出部に電気
的に接続した ことを特徴とするチップインダクタンス素
子。
1. A core on which a coil is wound and having flanges at both ends, a plate-shaped base on which the core is mounted, and a first side of the base on a bottom surface of the base.
A groove portion formed toward the second side of Luo opposing said substrate in the thickness direction as well as in close contact with the side of the base body
Positioned at both ends of the side so as to pinch
And a pair of holding portions and the pair of holding portions
A projection is provided at a central portion to fit into the groove of the base.
And a pair of metal plate terminals each having a connecting portion, wherein each of the pair of metal plate terminals is a first side portion of the base.
And both ends provided on the second side and drawn out of the coil
Terminals of each metal plate terminal
A chip inductance element characterized by being electrically connected .
JP17565497A 1997-07-01 1997-07-01 Chip inductance element Expired - Lifetime JP3336346B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17565497A JP3336346B2 (en) 1997-07-01 1997-07-01 Chip inductance element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17565497A JP3336346B2 (en) 1997-07-01 1997-07-01 Chip inductance element

Publications (2)

Publication Number Publication Date
JPH1126254A JPH1126254A (en) 1999-01-29
JP3336346B2 true JP3336346B2 (en) 2002-10-21

Family

ID=15999887

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17565497A Expired - Lifetime JP3336346B2 (en) 1997-07-01 1997-07-01 Chip inductance element

Country Status (1)

Country Link
JP (1) JP3336346B2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4696884B2 (en) * 2005-12-05 2011-06-08 株式会社村田製作所 Wire wound electronic component and method of manufacturing the same
US7986208B2 (en) * 2008-07-11 2011-07-26 Cooper Technologies Company Surface mount magnetic component assembly
US20100277267A1 (en) * 2009-05-04 2010-11-04 Robert James Bogert Magnetic components and methods of manufacturing the same
TWI447759B (en) * 2009-05-04 2014-08-01 Cooper Technologies Co Surface mount magnetic component assembly
JP5997679B2 (en) * 2013-10-31 2016-09-28 東光株式会社 Coil parts
JP7288297B2 (en) * 2018-10-30 2023-06-07 太陽誘電株式会社 Coil parts and electronic equipment

Also Published As

Publication number Publication date
JPH1126254A (en) 1999-01-29

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