JPH0364037A - Semiconductor measuring device - Google Patents

Abstract

PURPOSE:To make common use of a socket adapter and a handler by equalizing each external shape of sockets and each width of outer leads in ICs of a DIP and a SOP and disposing each lead in a row side to side in such a way that they are parallel to each other. CONSTITUTION:Each external shape 2a of mainframes of sockets of each IC for measuring electrical characteristics is made up by an insulating material and has the same width 2c and height 2d. Further, they have respective outer leads to transmit electrical signals for measuring the electrical characteristics and, having the same lead width 2w, each lead is disposed in a row side to side in such a way that they are parallel to each other. In the case of ICs of DIP and SOP, when their circuits are identical and only packages of them are different, these sockets can be installed directly to a performance board 2. Socket adapters are thus omitted.

Description

[Detailed description of the invention] [Industrial application field]

This invention is a dual infin package C or below NXP
) IC and two-way flat package C below so
Called p) of IC! Regarding improvements to improve the compatibility of the 9IC characteristic measurement socket, in particular, by using this socket as a carrier socket, the compatibility of the DIP C and EIOPIC rail-type measurement handlers has been improved, and the performance board for the tester has been improved. and DIPIC and His. This invention relates to an improvement in the common use or omission of a socket adapter for connecting a PIC measurement socket. [Prior art] Figure 4 (1) is a perspective view of a DIPIC, and (2) is a perspective view of a DIP
The perspective view of the socket body for measuring the electrical characteristics of IC (1) is shown. (3) Perspective view of 5OPIC, (4) 5OPI
The perspective view of the socket body for measuring electrical characteristics of C(3) is shown. The external shapes (2a) and (4a) of these sockets are made of insulating material, and the width (2C), width (4c), and height (2
d) and the height (4d) are different from each other. (2b
), (4b) are external leads for transmitting electrical signals for measuring the agC characteristics of each IC (1) (3). The external leads (2h) are arranged in parallel on the left and right, and the external leads (4b) are staggered and arranged in parallel on the left and right, and the lead widths are (2w), (4w+), (4W2).
are different from each other. In addition, (1) in Fig. 5 is a cross-sectional view of the rail-type measurement handler of D-engine PIC (la), and (2) is a cross-sectional view of the D-engine PIC (la).
A cross-sectional view of the rail-type measurement handler of XC (2a) is shown. (la) is the DrP IC under test, (2a) is the sap
The IC to be measured is shown. These handlers are (1c) and (2
c) Upper rail, (1d) and (2d) lower rail, (1
Measurement part e) and (2e) IC stopper to be measured (1g
) and (2g), a separate stopper for feeding the ICs under test one by one to the measurement sections (1b) and (2h), an IC socket for electrically measuring the ICs to be measured at the measurement sections (1b) and (2h), (1h). and (2h) where the IC is ejected after the measurement is completed. Then, the IC to be measured (la) or (2a) flows from the upper right of the figure between the upper and lower rails, and the IC to be measured flows through the separation stopper (Ig) (2g).
(la) (2a) is sent one by one to the measuring section, and the IC is stopped by a stopper (Is) (2e). An IC socket (lb) connected to an electrical measuring device (not shown)
) The IC stopped by the stopper (le) (2e) is inserted into (2b), and after the measurement is completed, it is pulled out from the socket and ejected to the ejection section (lh) (2h). The shape of the top and bottom rails and the spacing between the top and bottom rails are based on the IC being measured.
It's different for each. That is, a rail handler is required for each IC to be measured. (1) and (2) in Fig. 6 respectively show a socket adapter for DIPIC socket and a socket adapter for 5OPIC socket, and they are made of a board made of Gauss Ebony resin, etc., and pattern wiring and performance using through holes and solder on the top and bottom of the board. External lead (6) connected to board (3)
It consists of The through hole is provided for connection to the lead of the IC socket, and the pattern wiring is provided for connection to the external lead. (4) shows the IEX-like circuit part wired on the performance board, and (5) shows the cable that connects the performance board and the measuring instrument. In order to apply the IE electrical circuit processing and shaping to the IC under test through the socket adapter and IC socket, and to apply the electric signal of the IC under test to the electric circuit on the board through the IC socket and socket adapter. It performs the role of processing and transmitting it to the measuring instrument. A socket adapter is required for each socket of the IC to be measured. [Problems to be Solved by the Invention] Conventional DIPKC and 5OPIC measurement sockets were constructed as described above, so the external dimensions were different and the width of the external lead for electrical connection and the width of the left and right leads were different. Because the arrangement is different, when using it as an ICC handler measurement socket, it is necessary to make a socket insertion positioning jig for each socket for the IC under test, and when connecting the socket for the IC under test to the performance board, There were problems such as the need for socket adapters depending on the socket. Hajita, conventional D engineering P4C and 5OPIC! The rail handler used to automatically measure atmospheric characteristics is
Since the shapes of the ICs are different, it is necessary to measure each IC, which is also an economical problem. Furthermore, there was a problem in that a socket adapter was required for each of the DIPIC and 5OPIC on the conventional performance board. This invention was made to solve the above-mentioned problems, and aims to enable the socket insertion positioning jig to be shared in the ICC handler, and the socket adapter to be shared or omitted. Using the socket as a carrier socket, I made a handler that flows this carrier socket, and the DIPIC is also 80
The aim is to be able to measure PIC using a common handler. Furthermore, the socket adapter can be made into one common socket adapter by using the above socket,
Alternatively, the purpose is to omit the synkerato adapter by directly connecting the socket to the performance board. [Means for Solving the Problem] The socket according to claim 1 for measuring DIPIC and 8OPIC according to the present invention has the same external height and width, and has an external lead for electrical connection. They are arranged in parallel in a row on the left and right with the same width. Further, the rail type hand wot'i of claim 2 for automatic electrical characteristics of the DIPIC and 80PIC' according to the present invention
% The socket of claim 1 is used as a carrier socket so that it can be used for both DIP and 8OPIC. Furthermore, the socket adapter 1 according to claim 3 for DIPIC and 5apIC according to the present invention can be used in common with both DIP and 8OPIC by using the socket according to claim 1, or can be omitted. [Function] The measurement inspection socket, measurement handler, and socket adapter of the semiconductor measurement device according to the present invention have the above-described configuration, and the measurement socket has the same external characteristics, allowing the socket adapter to be used in common even in irregularly shaped packages. Handlers can be shared. [5j! Embodiment] Hereinafter, an embodiment of the present invention will be explained with reference to the figures. (1) and (3) in Fig. 1 are DIPIC, 5, respectively.
OPIC is shown, and (2) and (4) show the main body of an IC socket for measuring electrical characteristics, which is an embodiment of the present invention. The outer shape of each socket (2a) is made of insulating material and has a width (
2c) and the same height (2d). Keita, t9C
It has external leads for transmitting electrical signals for measuring physical characteristics, the lead width (2w) is the same, and the leads are arranged in parallel rows on the left and right. FIG. 2 is a sectional view of a rail-type handler for automatically performing both DIP and Sop ICot atmospheric measurements, which is an embodiment of the present invention. In the figure, (la) is the first
With the carrier socket in which the IC to be measured is inserted into the socket described in the example shown in the figure, the upper rail (lc) and the (1d
) This carrier socket flows between the lower rails and becomes blue.
The carrier sockets are sent one by one to the measuring section by the separate section (Ig), and the carrier sockets are stopped by the stopper (le). The carrier socket into which this IC is inserted is connected to a socket connected to a measuring device, and the electrical characteristics are measured. After measurement, the carrier socket is (1
b) Discharged to the discharge section. That is, in this embodiment, both DIP and SOP ICs to be measured can be measured together with a carrier socket using a common handler. FIG. 3(1) is a perspective view of a socket adapter which is an embodiment of the present invention. In the figure, the Gauss epoxy resin board shown in (la) has a through hole (1b) for mounting the socket shown in Fig. 1, a pattern layout M (lc), and a glue board for connecting to the performance board (2). It consists of part (1d). Conventional socket adapters include DIPIC and s. Since sockets are different for each PIC, two types of socket adapters with the above-mentioned through holes and pattern wiring are required for each socket, but in this embodiment, one type of socket adapter can be used in common. Incidentally, if the DIPIC and 80PIC have the same IC circuit and differ only in package, the socket shown in FIG. 1 can be directly attached to the performance board (2). That is, the socket adapter can be omitted.

【Effect of the invention】

As described above, according to the present invention, DIPIC and 80P
By making the outer shape and external lead width of the IC socket the same and arranging the leads in parallel on the left and right, the socket can be standardized and manufactured at low cost, and the measuring device using this socket can be manufactured at low cost. Further, according to the invention of claim 2, DIPIC and 5QPI
By using the socket of claim 1 as a carrier socket for each measurement handler in C, if the handler is manufactured according to the outer shape of this socket, one unit can be used in common, making the handler manufacturing inexpensive. Space can be saved. According to the invention of claim 3, since the socket of claim 1 can be mounted, only one type of socket adapter is required for each of the conventional DIPIC and 5OPIC sockets, so that the manufacturing cost of the socket adapter can be reduced.

[Brief explanation of drawings]

Figures 1 (a) (C) > and (b) (d) show BIPIC and! which are an embodiment of this invention. Developed front view and developed side view of electrical measurement socket for 9'0 PIC,
Figure 2 shows the B I P I C & and 5 OPI of this invention.
FIG. 3 is a cross-sectional view illustrating the operating state of an automatic measuring rail type handler which is an embodiment of the common use; FIG. 3 is an exploded perspective view of a socket adapter which is an embodiment of the present invention; and FIG.
)(b) is the conventional EIPIC socket) &5OPI
Perspective views of the C socket, Figures 5(a) and 5(b)
is a sectional view illustrating the operating state of the conventional automatic measurement rail type handler for OB I P I C> and 5 OPIC,
Figure 6 (a) and (b) are conventional 0BIPIC and 5OP
FIG. 2 is an exploded perspective view of an IC socket adapter. In the figure, (1) is DIPIC, (2) is DIPIC
(2a) is the external shape of the socket (2b)
is the external lead, (2C) is the width of the socket outline (2a),
(2d) is the height of the socket outline (2a), (3) is S
OPIC, (0 indicates 5 OPIC socket.

Claims (3)

[Claims] (1) The measurement and inspection sockets of the dual in-line package IC and the two-way flat package IC were made to have the same external dimensions, and the width of the external leads for electrical connection were the same and were arranged in parallel in a row on the left and right. A semiconductor measuring device characterized by having a socket provided with a lead. (2) In measuring the electrical characteristics of dual in-line package ICs and two-way flat package ICs, the socket for rail-type measurement used in each is used as a carrier socket, and the IC to be measured is placed in the carrier socket. 2. The semiconductor measuring device according to claim 1, further comprising a common rail-type measuring handler mounted on the semiconductor measuring device. (3) In measuring the electrical characteristics of dual-inline package ICs and two-way flat package ICs, claim 1 provides respective socket adapters for connecting a performance board for a tester and a socket for an IC to be measured.
2. The semiconductor measuring device according to claim 1, wherein said socket is used as an IC socket to be measured so that it can be shared or omitted.