JPH0363946U - - Google Patents

Info

Publication number
JPH0363946U
JPH0363946U JP1989124531U JP12453189U JPH0363946U JP H0363946 U JPH0363946 U JP H0363946U JP 1989124531 U JP1989124531 U JP 1989124531U JP 12453189 U JP12453189 U JP 12453189U JP H0363946 U JPH0363946 U JP H0363946U
Authority
JP
Japan
Prior art keywords
frame
semiconductor chips
upper lid
electronic components
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989124531U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0530363Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989124531U priority Critical patent/JPH0530363Y2/ja
Publication of JPH0363946U publication Critical patent/JPH0363946U/ja
Application granted granted Critical
Publication of JPH0530363Y2 publication Critical patent/JPH0530363Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/075Connecting or disconnecting of bond wires
    • H10W72/07541Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07553Controlling the environment, e.g. atmosphere composition or temperature changes in shapes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1989124531U 1989-10-26 1989-10-26 Expired - Lifetime JPH0530363Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989124531U JPH0530363Y2 (https=) 1989-10-26 1989-10-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989124531U JPH0530363Y2 (https=) 1989-10-26 1989-10-26

Publications (2)

Publication Number Publication Date
JPH0363946U true JPH0363946U (https=) 1991-06-21
JPH0530363Y2 JPH0530363Y2 (https=) 1993-08-03

Family

ID=31672442

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989124531U Expired - Lifetime JPH0530363Y2 (https=) 1989-10-26 1989-10-26

Country Status (1)

Country Link
JP (1) JPH0530363Y2 (https=)

Also Published As

Publication number Publication date
JPH0530363Y2 (https=) 1993-08-03

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