JPH0363826B2 - - Google Patents
Info
- Publication number
- JPH0363826B2 JPH0363826B2 JP60134972A JP13497285A JPH0363826B2 JP H0363826 B2 JPH0363826 B2 JP H0363826B2 JP 60134972 A JP60134972 A JP 60134972A JP 13497285 A JP13497285 A JP 13497285A JP H0363826 B2 JPH0363826 B2 JP H0363826B2
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- outer case
- cooling tank
- semiconductor
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13497285A JPS61292347A (ja) | 1985-06-19 | 1985-06-19 | 半導体装置の冷却構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13497285A JPS61292347A (ja) | 1985-06-19 | 1985-06-19 | 半導体装置の冷却構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61292347A JPS61292347A (ja) | 1986-12-23 |
| JPH0363826B2 true JPH0363826B2 (enrdf_load_stackoverflow) | 1991-10-02 |
Family
ID=15140908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13497285A Granted JPS61292347A (ja) | 1985-06-19 | 1985-06-19 | 半導体装置の冷却構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61292347A (enrdf_load_stackoverflow) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5254380A (en) * | 1975-10-27 | 1977-05-02 | Amp Inc | Improved liquid cooling device |
-
1985
- 1985-06-19 JP JP13497285A patent/JPS61292347A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61292347A (ja) | 1986-12-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4253515A (en) | Integrated circuit temperature gradient and moisture regulator | |
| KR950014046B1 (ko) | 최적화된 히트 파이프 및 전자회로 일체형 조립체 | |
| EP1336204B1 (en) | Thermoelectric module with integrated heat exchanger and method of use | |
| JP2000310459A (ja) | 半導体製造工程設備用熱電冷却温度調節装置 | |
| JPH0334562A (ja) | 電子デバイスの温度制御装置 | |
| US3406753A (en) | Peg type heat exchangers for thermoelectric devices | |
| JP2001024127A (ja) | 局所湿度調節システム、電子デバイス・アセンブリ及びその製造方法 | |
| EP1172873A2 (en) | Fuel cell system having cooling apparatus | |
| CN115371287B (zh) | 一种高制冷功率密度的紧凑型热电半导体制冷模组 | |
| CN210579772U (zh) | 一种隔热结构及液冷板 | |
| US4899211A (en) | Semiconductor cooling mechanisms | |
| JPH0363826B2 (enrdf_load_stackoverflow) | ||
| CN118983282A (zh) | 一种倒装芯片结构 | |
| CN218447884U (zh) | 一种低温超导芯片传热结构 | |
| RU2180421C2 (ru) | Осушитель воздуха герметичных отсеков космических аппаратов | |
| JPH05343751A (ja) | 熱発電装置 | |
| CN115420128A (zh) | 一种基于玻璃吸液芯的陶瓷均热板结构和制备方法 | |
| JPS6144450Y2 (enrdf_load_stackoverflow) | ||
| JPH06120383A (ja) | 半導体冷却装置 | |
| JPH0442931Y2 (enrdf_load_stackoverflow) | ||
| JPH04196154A (ja) | 半導体冷却装置 | |
| JP2581283B2 (ja) | 超電導コイル用電流リード | |
| CN210663443U (zh) | 半导体制冷模组及半导体制冷装置 | |
| JPH06268285A (ja) | ガスレ−ザ管装置 | |
| CN219329949U (zh) | 一种自冷型散热器 |