JPH0362958A - Heat-pipe accommodating type mounting board - Google Patents

Abstract

PURPOSE:To provide uniform, sufficient heat radiating property by forming a hollow part in a board, using the hollow part as a heat pipe, inserting heat pipe containers into the hollow part, converting the containers into heat pipes, making the heat pipes extrude from the side surface of the board, and obtaining heat radiating parts. CONSTITUTION:Element 1 such as ICs and LSIs are mounted on a substrate 2. A flat plate which comprises aluminum, copper and the like and has excellent heat conductivity is used as the material of the board. The inside of the board 2 is made to be a hollow part 3. Actuating liquid is sealed into the hollow part, and a heat pipe is provided. Heat pipe containers comprising copper, aluminum and the like as the other bodies are inserted into the side surface of the hollow part. The containers are made to be heat pipes. Thus, plurality of the heat pipes 4 and 4' are obtained. The heat pipes are made to extrude from the side surface of the board, and heat radiating parts 5 and 5, are obtained. Fins are provided on the radiating parts 5 as required, and the heat radiating property is enhanced. Namely, since the entire hollow part in the board is made to be the heat pipe, the soaking of the entire board is achieved. The heat is guided to the outside of the board through the independently provided other heat pipes. Therefore, the heat in the entire board is averaged, and the heat radiation is effectively performed.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to mounting boards such as ICs and LSIs, and relates to a heat pipe that can efficiently dissipate heat generated from elements such as IC5LSIs by using a heat pipe. This relates to a built-in mounting board.

[Conventional technology and its issues]

In the electronics field, substrates on which IC5LSTs and the like are mounted are becoming increasingly denser due to the demands of the era of lighter, thinner, shorter, and smaller designs, and the amount of heat generated per unit area of substrates is increasing.

Furthermore, the amount of heat generated by the element itself is increasing, and measures to dissipate this heat have become an important issue.

These heat radiation methods include heat sinks made of metal such as aluminum, forced air cooling, methods using refrigerants, methods using heat pipes, and the like.

However, heat sinks made of metal such as aluminum may not be able to dissipate heat completely, so forced air cooling or using refrigerants may
As the equipment becomes larger and more complex, noise from other fans and the like becomes a problem, which increases costs.

In the case of heat pipes, there are two methods: attaching the heat pipe directly to one element to dissipate heat, and embedding the heat pipe in the board, but the former only increases the heat dissipation area of one element. As a design, it is difficult to standardize, and it has a strong meaning as a temporary emergency measure. Regarding the latter, heat dissipation is uneven between the heat pipe part and other parts of the board, making it impossible to equalize the temperature of the entire board, resulting in a lack of heat dissipation from the entire system, and heat dissipation is a problem especially in high-density packaging. It has become.

[Problems to be Solved by the Invention] The present invention has been made as a result of studies on the above-mentioned problems, and it solves the uneven heat dissipation in parts of the substrate and provides uniform and sufficient heat dissipation over the entire substrate. We have developed a mounting board with a built-in heat pipe.

[Means and effects for solving the problem] The present invention uses a thermally conductive flat plate as a substrate material, makes the inside of the substrate hollow, turns it into a heat pipe, and inserts a heat pipe container into the hollow. This is a mounting board with a built-in heat pipe, characterized in that the heat pipe is formed into a heat pipe, and the heat pipe is made to protrude from the side surface of the board to serve as a heat dissipation section.

That is, the present invention is applicable to ICXL, for example, as shown in FIG.
A substrate (2) is made of a flat plate with good thermal conductivity, such as aluminum or copper, on which an element (1) such as an SI is mounted, and a cavity (3) is formed inside this cavity. At the same time, a separate piece of copper is placed on the side of this cavity.
Insert a heat pipe container made of aluminum etc.
Multiple heat pipes (4), (4'
), . . . These heat pipes are made to protrude from the side surface of the board to form heat dissipation parts (5), (5'), and are used as a heat pipe built-in mounting board.

Further, if necessary, fins are provided in the heat dissipating portion (5) to improve heat dissipation. According to the above structure, since the entire cavity inside the board is made into a heat pipe, the temperature of the entire board is equalized, and the heat is further led out to the outside of the board by an independent heat pipe. This effectively dissipates heat while averaging the heat of the entire board. Therefore, it is possible to freely mount elements at any position on the substrate. This heat pipe built-in mounting board can be manufactured by making a hollow inside of a flat plate by machining and then sealing it with a plate, or by forming a thin plate into a box shape by welding, or by casting. It can be produced by various methods.

In addition, as a means for cooling the heat dissipation section, in addition to natural air cooling by attaching fins or air cooling such as a fan, a cooling device such as water cooling or cooling using a refrigerant may be installed. Furthermore, miniaturization is possible by using a micro heat pipe as the heat pipe.

〔Example] An embodiment of the present invention will be described below.

As shown in Figure 1, 150mm x 150mm, thickness 3n
+m aluminum substrate (2) was formed into a box shape with a cavity (3) by welding a thin aluminum plate.

A 2-square copper heat pipe container with a length of 250 m+a is inserted into the side surface of this board to form a heat pipe, and a large number of heat pipes (4) are provided. (not shown) was established. I on this board
A mounting board with a built-in heat pipe was manufactured by mounting the C element (1). This board was found to have better heat uniformity over the entire board compared to a conventional board with embedded heat pipes.

〔effect〕

As explained above, according to the present invention, it is possible to obtain a mounting board with a built-in heat pipe that has excellent heat uniformity and heat dissipation properties, and has a significant industrial effect.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a mounting board with built-in heat pipes showing one embodiment of the present invention. DESCRIPTION OF SYMBOLS 1...Element, 2...Substrate, 3...Cavity, 4
．． 4'4''...Heat pipe, s, 5.'5τ
...Heat radiation part.

Claims (2)

[Claims] (1) A thermally conductive flat plate is used as a substrate material, the inside of the substrate is made into a cavity, and this is made into a heat pipe, and a heat pipe container is inserted into the side of the cavity to make it into a heat pipe,
A mounting board with a built-in heat pipe, characterized in that the heat pipe protrudes from a side surface of the board to serve as a heat dissipation section. (2) The heat pipe built-in mounting board according to claim 1, wherein a fin is provided in the heat dissipation section.