JPH0362918A - Formation of strip-like electrode - Google Patents

Abstract

PURPOSE:To provide a strip-like electrode forming method which is especially suitable for electronic components characterized by many kinds and the small amount of production by aligning the position of the electrode forming part of an electronic component to the position of one through slit formed in a slit plate every time, sequentially applying paste on every specified number of the strip shaped electrodes, and forming the electrodes. CONSTITUTION:The position of the electrode forming part of an end surface 41 is aligned on the position of a through slit 30. An electronic component 4 is set on a slit plate 3. When a compressing plate 60 of a compressing means 6 is pushed down so as to increase the pressure in a paste tank 1, part of paste bath 2 rises up through the slit 30 as shown by an arrow in response to the increased value of the internal pressure. The paste is applied on the first electrode forming part of the component 4. The electronic part 4 can be moved up and down and right and left through a holding means. The paste on the slit plate 3 is returned into the tank 1, and the part 4 is lifted. The component 4 is slightly moved leftward at said retreated position. Then the component 4 is lowered, and the second electrode forming part is aligned with the position of the through slit 30. The paste 2 is attached to the second electrode forming part by the same way, and the electrode is formed.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for forming a strip-shaped electrode on at least one end surface of an electronic component, in which a plurality of strip-shaped electrodes are formed at an arbitrary pitch on the end surface.

Conventional Drilling Techniques There are two methods for forming this type of strip-shaped electrode as described below. The first formation method takes the form of applying a plurality of electrode pastes to the electrode formation site of the electronic component by screen printing.

On the other hand, the second forming method, as shown in FIG.
The electrode paste 2, which is a part of the electrode paste bath 2, is applied to the corresponding area to form a band-shaped electrode 40.

To explain in more detail, an electrode 40 is provided on the upper end surface of the paste tank 1.
A slit plate 3 is attached, in which the same number of through slits 30 as the electrodes 40 are formed, each having a width corresponding to the width of the through slits 3 (see FIG. 2(a)).
Set the electronic component 4 on the slit plate 3 from above so that each electrode forming part is located at the position 0 (see FIG. 2(b)), and then apply pressure using a pressure means (not shown). The inside of the paste tank 1 is pressurized through the through slits 30... to raise the electrode paste 2, thereby applying the electrode paste 2 to the electrode formation site (see Fig. 2(c)).
. When the coating process is completed, the electronic component 4 is retracted above the slit plate 3 (see FIG. 2(d)), and then the electrode paste 2 is dried at a predetermined position, and the strip electrode (
An electronic component 4 having a plurality of external electrodes 40 is obtained (see FIG. 2(e)).

However, when using the first and second methods above, it is necessary to prepare a screen or slit plate 3 in which the same number of through slits with the same width as the electrodes are formed at the same pitch. Therefore, it has the disadvantage that it is not suitable for the recent manufacturing method of electronic components, which tends to produce high-mix, low-volume production.

That is, each time the type of electronic component or the number of electrodes changes, the screen or slit plate 3 must be replaced with a corresponding one, which becomes a bottleneck in improving manufacturing efficiency.

The present invention has been made in order to eliminate the drawbacks of such conventional methods, and is applicable even when the types of electronic parts and the number of electrodes are different, and is particularly suitable for electronic parts produced in high-mix, low-volume production. The purpose is to provide a method for forming.

To solve this problem, the present invention provides a method for forming a band-shaped electrode on at least one end surface of an electronic component, in which a plurality of band-shaped electrodes are formed at an arbitrary pitch on the end surface, the width dimension corresponding to the width dimension of the electrode. A slit sheet with a predetermined number of through slits formed therein is positioned above the electrode paste bath, and then, the electrode forming portion of the electronic component is aligned with the position of the through slits, and the electrode paste bath is pushed upward through the through slits. By this, an electrode paste bath is applied to the electrode formation site, and after application, the electronic component is separated from the slit plate,
Thereafter, the next electrode formation site and the through slit were aligned, and an electrode paste bath was applied to the site, and if necessary, the same procedure was repeated to form a plurality of electrodes. It is characterized by

In addition, a recessed part is provided on one side or both sides of the through-slit of the slit plate, and when applying an electrode paste bath to the next electrode formation site, the existing electrode paste bath applied part is moved into the recessed part. It is characterized by being positioned above the .

Raw - Once this happens, a portion of the electrode paste bath that is forced upward will rise through the through slit and adhere to the electrode formation site positioned at this position, which will cause the first
The coating process for the second electrode will now be performed.

Then, from this state, the electronic component is evacuated upward, and from then on, the electrode formation site and the through slit are aligned with each other as described in the next section, and the same procedure is repeated 100 times. electrodes will be formed.

In addition, especially when a recess is provided on one side of the through slit, contact between the previously formed electrode and the slit plate is avoided, so the electrode paste before drying may flow or the slit may be scraped off. There will be no problems such as Therefore, when such a recess is provided, there is no risk of damage to subsequent electrodes, which is convenient for improving the quality of electronic components.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings. FIG. 1 is a process diagram showing a method for forming a strip-shaped electrode according to the present invention.

In carrying out the method of the present invention, first, a paste tank 1 shown in FIG. 1(a) is prepared. This paste tank 1 has a box shape with an open top end, and an electrode paste bath 2 is filled inside. A slit plate 3 is fixed to the upper end of the paste tank 1. A penetrating slit 30 is formed at a predetermined position on the slit plate 3 and is long in the front-rear direction of the paper. The depth dimension (front and back dimension) of the through slit 30 is one end surface 4 of the electronic component 4.
The width dimension B2 is set to a dimension corresponding to the width dimension B of the strip electrode 40 formed in the final step shown in FIG. 1(f).

In addition, a recess 31 is formed in a portion of the slit plate 3 corresponding to the left side in the figure of the position where the through slit 30 is formed, which is one step lower than other portions. This recess 31 has a function of improving the quality of the electronic component 4, the details of which will be described later.

Further, on the right side of the paste tank 1, a pressurizing means 6 is arranged in series to increase the pressure inside the paste tank 1 and raise the electrode paste bath 2 using Pascal's principle.

The procedure for carrying out the method of the present invention using such a paste tank 1 is as follows. As shown in Figure 1(b),
With the electrode forming portion of the end surface 41 aligned with the position of the through slit 30, the electronic component 4 is placed on the slit plate 3 from above. When the setting operation is completed, the pressure plate 60 of the pressure means 6 is pushed down to increase the pressure inside the paste tank 1. Then, Figure 1 (C)
As shown by the arrow mark in , a part of the electrode paste bath 2, that is, the electrode paste 2 moves through the through slit 3 in response to the increase in internal pressure.
0 and is applied to the first electrode formation site of the electronic component 4.

In this coating process, the electrode paste 2 is applied to both front and rear surfaces 42.4 adjacent to the end surface 41 in the thickness direction due to its fluidity.
It will wrap around the end of 2.

Therefore, as shown in FIG. 1(f), the electrode paste 2 is adhered and formed not only on the end surface 41 but also on the corners of both the front and rear surfaces 42, thereby forming the strip electrode 40.

Note that the electronic component 4 is movable vertically and horizontally via a gripping means (not shown) that grips it, and the electrode paste 2 on the slit plate 3 is returned to the paste tank 1 and the first When the first coating process is completed, Figure 1 (d)
), it is raised to a retracted position corresponding to the upper position of the slit plate 3. The operation of raising the electronic component 4 may be performed before returning the electrode paste 2 into the paste tank 1, or without returning the electrode paste 2 into the paste tank 1, use a paste scraper as shown below.
The electrode paste 2 may be scraped off.

That is, when the paste remains on the slit plate 3 and is dirty, the paste on the slit plate 3 is scraped off with a paste scraper. Of course, this operation is not necessary if the top of the slit plate 3 is not dirty.

Then, at this retracted position, the electronic component 4 is moved slightly to the left, and then, as shown in FIG.
is lowered to insert the second electrode forming part into the through slit 3.
Align to the 0 position.

Thus, when a second coating process is performed in this state in the same manner as described above, the electrode paste 2 is deposited on the second electrode formation site.

Note that at this time, the first electrode forming portion 4a is located in the recess 31.
The slit plate 3 is located above the slit plate 3 and is kept in a non-contact state 6c. Therefore, for the reason stated in the above-mentioned operation section, this will not flow sideways in the longitudinal direction of the end face 41 or be scraped off, so the quality of the electronic component 4 obtained in the final process can be significantly improved. Ru.

In this way, when providing the recess 31 in the slit plate 3,
This is preferable in terms of improving the quality of the electronic component 4, but if a material with low fluidity is used as the electrode paste 2, the recess 31 may not be provided.

Then, by repeating the steps shown in FIG. 1(d), FIG. 1(e), and FIG. 1(C) a necessary number of times, the electrode paste 2 is deposited and formed on a new electrode formation site each time. It turns out. Incidentally, in the illustrated example, since three strip electrodes 40 are formed on the end surface 41, the same coating process as described above is performed three times.

When the above coating process is completed, the electronic component 4 is raised again, and then transferred to a predetermined position and the electrode paste 2 is dried, forming the three strip electrodes shown in FIG. 1(f). An electronic component 4 in which 40 . . . is formed is obtained.

Although the illustrated embodiment is as described above, the method of the present invention can be modified in various ways as described below. That is, in the above embodiment, the electronic component 4 was moved up and down and left and right to perform the application process of the electrode paste 2, but the slit plate 3 and the paste tank 1 were moved up and down and left and right. Alternatively, the coating process may be performed by moving the paste tank 1 up and down and moving the slit plate 3 in the left-right direction without fixing the slit plate 3 to the paste tank 1.

Further, in the above embodiment, the coating process for one electronic component 4 was illustrated, but a large number of electronic components arranged on a similar slit plate 3
It is also possible to process multiple items simultaneously using .

Further, in the above embodiment, the inside of the paste tank 1 is pressurized by the pressurizing means, but the inside of the paste tank 1 is pressurized by the pressure reducing means.
The electrode paste 2 may be raised by reducing the pressure above the electrode.

Further, in the above embodiment, electrodes are formed only on one side of the electronic component 4, but the present invention can be similarly applied to electronic components that require electrodes to be formed on both sides.
It goes without saying that the electronic component is not limited to an electronic component having a single function (for example, a single capacitor), but can also be applied to a composite electronic component in which a capacitor is combined with a resistor or inductance.

Further, in the present invention, two or more electrodes may be formed at one time, and the electrode forming portion may be at least an end face of the electronic component, and may be formed only on one of the end face and its adjacent face. .

In the case of the above-described method of the present invention, the electrode forming portion of the electronic component is aligned each time with the position of one through slit formed in the three/tooth plate, and strip electrodes are sequentially applied at a constant rate of 4°. Since this process is adopted, the same slit plate can be used to form electrodes even for electronic components with different electrode formation pitches or different numbers of electrodes. Therefore, the frequency of replacing the slit plate etc. can be reduced accordingly, and manufacturing efficiency can be improved.

Furthermore, for the same reason, this method is particularly effective when forming strip electrodes on electronic components that are produced in a wide variety of small quantities, and has the advantage of being able to immediately respond to changes in the design of the formation position of the strip electrodes.

Moreover, especially when using the method of the present invention according to claim 2,
Since contact between the previously formed electrode and the slit plate is avoided, problems such as flow of the electrode paste and damage to the electrode can be reliably prevented.

Therefore, the quality of electronic components can be significantly improved.

[Brief explanation of drawings]

FIG. 1 is a process diagram showing a method for forming a strip-shaped electrode according to the present invention. FIG. 2 is a process diagram showing a conventional method. DESCRIPTION OF SYMBOLS 1... Paste tank, 2... Electrode paste bath (electrode paste), 3... Slit plate, 30... Penetration slit, 31... Recessed part, 4... Electronic component, 40... Strip electrode.

Claims (2)

[Claims] (1) A method for forming a band-shaped electrode on at least one end surface of an electronic component, in which a plurality of band-shaped electrodes are formed at an arbitrary pitch on the end surface, and a predetermined number of through-slits having a width corresponding to the width of the electrode are formed. By positioning the slit plate above the electrode paste bath, then aligning the electrode forming portion of the electronic component with the position of the through slit, and pushing the electrode paste bath upward through the through slit,
An electrode paste bath is applied to the electrode formation site, and after application, the electronic component is once separated from the slit plate, and then the next electrode formation site and the through slit are aligned,
1. A method for forming a band-shaped electrode, characterized in that a plurality of electrodes are formed by applying an electrode paste bath to the region and repeating the same procedure if necessary. (2) A recessed part is provided on one side or both sides of the through-slit in the slit plate, and when applying an electrode paste bath to the next electrode formation site, the existing electrode paste bath application area can be used. 2. The method of forming a strip electrode according to claim 1, wherein the strip electrode is positioned above the recess.