JPH0362789B2 - - Google Patents
Info
- Publication number
- JPH0362789B2 JPH0362789B2 JP30614387A JP30614387A JPH0362789B2 JP H0362789 B2 JPH0362789 B2 JP H0362789B2 JP 30614387 A JP30614387 A JP 30614387A JP 30614387 A JP30614387 A JP 30614387A JP H0362789 B2 JPH0362789 B2 JP H0362789B2
- Authority
- JP
- Japan
- Prior art keywords
- magnetic
- target
- plate
- magnetron sputtering
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 11
- 230000000694 effects Effects 0.000 description 8
- 239000000696 magnetic material Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 230000003628 erosive effect Effects 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000011651 chromium Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910000889 permalloy Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30614387A JPH01147063A (ja) | 1987-12-03 | 1987-12-03 | マグネトロン・スパッタ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30614387A JPH01147063A (ja) | 1987-12-03 | 1987-12-03 | マグネトロン・スパッタ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01147063A JPH01147063A (ja) | 1989-06-08 |
| JPH0362789B2 true JPH0362789B2 (enrdf_load_html_response) | 1991-09-27 |
Family
ID=17953572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30614387A Granted JPH01147063A (ja) | 1987-12-03 | 1987-12-03 | マグネトロン・スパッタ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01147063A (enrdf_load_html_response) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19622607B4 (de) * | 1996-06-05 | 2007-12-27 | Oerlikon Deutschland Holding Gmbh | Sputterkathode |
| DE19622606C2 (de) * | 1996-06-05 | 2002-02-28 | Applied Films Gmbh & Co Kg | Sputterkathode |
| DE19747923C2 (de) * | 1997-10-30 | 2002-09-12 | Leybold Systems Gmbh | Sputterkathode |
| DE19754986C2 (de) * | 1997-12-11 | 2002-09-12 | Leybold Systems Gmbh | Sputterkathode |
| US7485210B2 (en) * | 2004-10-07 | 2009-02-03 | International Business Machines Corporation | Sputtering target fixture |
| DE102007060306B4 (de) | 2007-11-29 | 2011-12-15 | W.C. Heraeus Gmbh | Magnetische Shunts in Rohrtargets |
| EP2067874B1 (de) | 2007-11-29 | 2011-03-02 | W.C. Heraeus GmbH | Magnetische Shunts in Rohrtargets |
| US20110108416A1 (en) * | 2009-11-10 | 2011-05-12 | Cheng-Tsung Liu | Magnetron sputter |
| WO2012102092A1 (ja) * | 2011-01-24 | 2012-08-02 | 日立金属株式会社 | マグネトロンスパッタリング用磁場発生装置 |
| US9378934B2 (en) | 2011-05-30 | 2016-06-28 | Hitachi Metals, Ltd. | Racetrack-shaped magnetic-field-generating apparatus for magnetron sputtering |
| KR102023521B1 (ko) | 2012-01-30 | 2019-09-20 | 히타치 긴조쿠 가부시키가이샤 | 마그네트론 스퍼터링용 자장 발생 장치 |
| TW201335405A (zh) * | 2012-02-24 | 2013-09-01 | Sumika Technology Co Ltd | 複合式靶材及其製作方法 |
| WO2015090373A1 (en) * | 2013-12-17 | 2015-06-25 | Applied Materials, Inc. | Electrode assembly for deposition apparatus and method for assembling said electrode assembly |
-
1987
- 1987-12-03 JP JP30614387A patent/JPH01147063A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01147063A (ja) | 1989-06-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4162954A (en) | Planar magnetron sputtering device | |
| US5262030A (en) | Magnetron sputtering cathode with electrically variable source size and location for coating multiple substrates | |
| JP5835235B2 (ja) | マグネトロンスパッタリング用磁場発生装置 | |
| US4461688A (en) | Magnetically enhanced sputtering device having a plurality of magnetic field sources including improved plasma trapping device and method | |
| JPH0362789B2 (enrdf_load_html_response) | ||
| EP2625934B1 (en) | Improved multipole magnet | |
| EP0192331A1 (en) | Electromagnet | |
| JPS61229226A (ja) | アクチユエ−タ | |
| GB2147916A (en) | Cathodic evaporation of ferromagnetic targets | |
| JPS593546B2 (ja) | スパツタ装置 | |
| WO2013115030A1 (ja) | マグネトロンスパッタリング用磁場発生装置 | |
| JPH0774439B2 (ja) | マグネトロンスパッタ装置 | |
| JPH04187766A (ja) | マグネトロン・スパッタリング装置用磁気回路装置 | |
| JP2649436B2 (ja) | Ｍｒｉ用磁界発生装置 | |
| JP2942301B2 (ja) | 電子銃磁界補正用フェンス装置 | |
| JPH03183123A (ja) | スパッタリング装置 | |
| JPH0241585B2 (enrdf_load_html_response) | ||
| JPS6142903Y2 (enrdf_load_html_response) | ||
| JPH10323002A (ja) | リニアモータ | |
| EP0031647B1 (en) | Bubble memory structure | |
| JP2005276768A (ja) | 磁場分布制御方法、磁場発生装置および加速器 | |
| JPH0463273A (ja) | マグネトロンスパッター装置 | |
| JPH04183858A (ja) | マグネトロンスパッタカソード | |
| JPH0641737A (ja) | マグネトロンスパッタ装置 | |
| JPH0463274A (ja) | マグネトロンスパッター装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |