JPH0361335U - - Google Patents
Info
- Publication number
- JPH0361335U JPH0361335U JP12350089U JP12350089U JPH0361335U JP H0361335 U JPH0361335 U JP H0361335U JP 12350089 U JP12350089 U JP 12350089U JP 12350089 U JP12350089 U JP 12350089U JP H0361335 U JPH0361335 U JP H0361335U
- Authority
- JP
- Japan
- Prior art keywords
- pilot
- sealing device
- hole
- pilot pin
- lower mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12350089U JPH0361335U (fi) | 1989-10-20 | 1989-10-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12350089U JPH0361335U (fi) | 1989-10-20 | 1989-10-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0361335U true JPH0361335U (fi) | 1991-06-17 |
Family
ID=31671474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12350089U Pending JPH0361335U (fi) | 1989-10-20 | 1989-10-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0361335U (fi) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008266848A (ja) * | 2007-04-24 | 2008-11-06 | Ｊａｐｃｏｎ Ｅｎｔｅｒｐｒｉｓｅ有限会社 | ブラジャー |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62212112A (ja) * | 1986-03-14 | 1987-09-18 | Matsushita Electric Works Ltd | 電子部品封止成形における成形金型装置へのリ−ドフレ−ム投入装置 |
-
1989
- 1989-10-20 JP JP12350089U patent/JPH0361335U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62212112A (ja) * | 1986-03-14 | 1987-09-18 | Matsushita Electric Works Ltd | 電子部品封止成形における成形金型装置へのリ−ドフレ−ム投入装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008266848A (ja) * | 2007-04-24 | 2008-11-06 | Ｊａｐｃｏｎ Ｅｎｔｅｒｐｒｉｓｅ有限会社 | ブラジャー |