JPH0361334U - - Google Patents
Info
- Publication number
- JPH0361334U JPH0361334U JP12184389U JP12184389U JPH0361334U JP H0361334 U JPH0361334 U JP H0361334U JP 12184389 U JP12184389 U JP 12184389U JP 12184389 U JP12184389 U JP 12184389U JP H0361334 U JPH0361334 U JP H0361334U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- resin solution
- substrate
- spatula
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000007790 scraping Methods 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は、本考案の一実施例を示す樹脂封止装
置の模式図である。 １……基板、２……半導体チツプ、３……枠、
４……樹脂溶体、５……デイスペンスシリンジ、
６……へら、７……受け皿、８……制御装置、９
……樹脂溶体供給機構、１０……掻き取り機構。
置の模式図である。 １……基板、２……半導体チツプ、３……枠、
４……樹脂溶体、５……デイスペンスシリンジ、
６……へら、７……受け皿、８……制御装置、９
……樹脂溶体供給機構、１０……掻き取り機構。
Claims (1)
- 枠体に囲まれるとともに基板に搭載された半導
体チツプに樹脂溶体を滴下するデイスペンスリン
ジと、前記半導体チツプ上に盛付けされた前記樹
脂溶体を所定の高さに削り取るへらと、このへら
と前記基板と一方向に相対的に移動させる駆動機
構とを有することを特徴とする樹脂封止装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12184389U JPH0361334U (ja) | 1989-10-17 | 1989-10-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12184389U JPH0361334U (ja) | 1989-10-17 | 1989-10-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0361334U true JPH0361334U (ja) | 1991-06-17 |
Family
ID=31669865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12184389U Pending JPH0361334U (ja) | 1989-10-17 | 1989-10-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0361334U (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008303515A (ja) * | 2007-06-11 | 2008-12-18 | Pip Fujimoto Co Ltd | くつ下及びその製造方法 |
| JP2009144273A (ja) * | 2007-12-12 | 2009-07-02 | Takaho Inoo | 靴下の締付部 |
| KR101025164B1 (ko) * | 2003-10-10 | 2011-03-31 | 가부시키가이샤 시마세이키 세이사쿠쇼 | 돌기부를 구비하는 통모양 편성포의 편성방법 및돌기부를 구비하는 통모양 편성포 |
-
1989
- 1989-10-17 JP JP12184389U patent/JPH0361334U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101025164B1 (ko) * | 2003-10-10 | 2011-03-31 | 가부시키가이샤 시마세이키 세이사쿠쇼 | 돌기부를 구비하는 통모양 편성포의 편성방법 및돌기부를 구비하는 통모양 편성포 |
| JP2008303515A (ja) * | 2007-06-11 | 2008-12-18 | Pip Fujimoto Co Ltd | くつ下及びその製造方法 |
| JP2009144273A (ja) * | 2007-12-12 | 2009-07-02 | Takaho Inoo | 靴下の締付部 |
| JP4600855B2 (ja) * | 2007-12-12 | 2010-12-22 | 隆穂 猪尾 | 靴下の締付部 |