JPH0358407A - Manufacture of semiconductor device - Google Patents

Abstract

PURPOSE:To facilitate production control by a method wherein an alphanumeric or symbolic code representing the type code of chip is marked on at least one chip. CONSTITUTION:When chips of type codes 001, 002, 003, 004 and 005 are produced at the ratio of 2:4:3:2:1, type code 001 is allotted to chips No.1 and 2, code 002 to ships No.3 to 6, code 003 to chips No.7 to 9, code No.004 to chips No.10 and 11, and code 005 to chip No.12. The above-mentioned arrangement information is recorded in the arrangement information chip 2 (chip No.0) of a semiconductor substrate 1, and an arrangement information recording chip indication mark 3 and the type code 4 for each chip are recorded on the arrangement information recording chip 2. By recording the arrangement information on the specific chip when a plurality of chips of different types are manufactured in a mingled state on the semiconductor substrate, the degree of freedom of the chip arrangement in a wafer chip can be ensured by suppressing the information load of a host computer to the minimum.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to a method for manufacturing a semiconductor device of a wide variety of products in small quantities.

BACKGROUND ART In recent years, the scale of integration of LSIs has become enormous, and customization of logic circuits in particular has progressed, reaching a level called system-on-chip.

As high-mix, low-volume production progresses, the loft size becomes extremely small even when one product is produced in one lot, leading to an increase in cost.

The method of mixing multiple different chips on a single semiconductor substrate (wafer), which was primarily considered as a research and development method, is being considered at production sites using the following method, but it has not yet seen the light of day. .

The first method selects a predetermined chip arrangement.

The second method is to pattern a type code for each chip and produce it while recognizing this pattern.

The third method is to use a host computer to manage production based on wafer numbers.

[Problem to be solved by the invention]

The mixed product stocking described in the previous section had the following problems. With the l'th fixed chip arrangement, the production volume cannot be flexibly controlled.

If the type code of the second chip must be identified each time, production efficiency will be extremely reduced.

Relying on a third host computer increases the information processing load on the host computer and goes beyond the practical and economical range.

[Means to solve the problem]

The method for manufacturing a semiconductor device of the present invention is a method for manufacturing a semiconductor device in which different chips are mixed on a semiconductor substrate.
Production control is performed by marking at least 61 chips with alphanumeric characters or symbols indicating the chip type code.

L Embodiment] An embodiment of the present invention will be described with reference to FIGS. 1 and 2. For example, product code 001.002, 003, 004, 0
It is assumed that five types of chips of 05 are produced at a ratio of 2:4:3:2:1, respectively.

Chip no. Chip No. 1-2 has code 001.
Code 002 for chips No. 3-6, code 003 for chips No. 7-9, chip 7N 0 . 1 0-l1 has code 004, 7N1). 12 has code O 0 5
varieties have been assigned.

This array information is recorded on the array information chip 2 (chip No. O) of the semiconductor substrate 1 in FIG.

On the array information recording chip 2, as shown in FIG. 2, an array information recording chip display mark 3 and a type code 4 for each chip are recorded.

As a recording method, in addition to printing using the Fusei Tregis I process, it can also be engraved with a laser marker.

In each process, information on chip 0 is first read, each chip is processed in accordance with its type code, and then sent to the next process.

Similarly, test processes such as sorting and inspection can be programmed for each chip.

Here, the product code is a number, but alphanumeric characters can also be used.

Furthermore, a reduced version of the barcode including guard bars, prefix characters and check characters may be substituted.

(Effects of the invention) As a method for manufacturing chips of different types on a semiconductor substrate (wafer), by recording the arrangement information on a specific chip, the information load on the host computer is minimized. The degree of freedom in chip arrangement within the wafer nut 1 can be ensured by suppressing the number of chips.

[Brief explanation of drawings]

FIG. 1 is a plan view showing a semiconductor substrate (wafer) according to an embodiment of the present invention, and FIG. 2 is a plan view showing an array information recording chip therein. 1... Semiconductor substrate (wafer), 2... Array information recording chip, 3... Array information recording chip display mark, 4
... Variety code.

Claims (1)

[Claims] A method for manufacturing a semiconductor device in which different chips are mixed on a semiconductor substrate, characterized in that alphanumeric characters or symbols indicating a chip type code are written on at least one chip to record the arrangement of the chips. Method.