JPH0358181B2 - - Google Patents
Info
- Publication number
- JPH0358181B2 JPH0358181B2 JP4687983A JP4687983A JPH0358181B2 JP H0358181 B2 JPH0358181 B2 JP H0358181B2 JP 4687983 A JP4687983 A JP 4687983A JP 4687983 A JP4687983 A JP 4687983A JP H0358181 B2 JPH0358181 B2 JP H0358181B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- brazing
- lead frame
- ceramic package
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005219 brazing Methods 0.000 claims description 63
- 239000000919 ceramic Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000008602 contraction Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4687983A JPS59172254A (ja) | 1983-03-19 | 1983-03-19 | フラットタイプのセラミックパツケ−ジにおけるリ−ドフレ−ムのろう付け方法およびそのリ−ドフレ−ム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4687983A JPS59172254A (ja) | 1983-03-19 | 1983-03-19 | フラットタイプのセラミックパツケ−ジにおけるリ−ドフレ−ムのろう付け方法およびそのリ−ドフレ−ム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59172254A JPS59172254A (ja) | 1984-09-28 |
| JPH0358181B2 true JPH0358181B2 (enrdf_load_html_response) | 1991-09-04 |
Family
ID=12759639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4687983A Granted JPS59172254A (ja) | 1983-03-19 | 1983-03-19 | フラットタイプのセラミックパツケ−ジにおけるリ−ドフレ−ムのろう付け方法およびそのリ−ドフレ−ム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59172254A (enrdf_load_html_response) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2608287B2 (ja) * | 1987-06-12 | 1997-05-07 | イビデン 株式会社 | 黒鉛製治具 |
-
1983
- 1983-03-19 JP JP4687983A patent/JPS59172254A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59172254A (ja) | 1984-09-28 |
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