JPH0357175B2 - - Google Patents
Info
- Publication number
- JPH0357175B2 JPH0357175B2 JP59073987A JP7398784A JPH0357175B2 JP H0357175 B2 JPH0357175 B2 JP H0357175B2 JP 59073987 A JP59073987 A JP 59073987A JP 7398784 A JP7398784 A JP 7398784A JP H0357175 B2 JPH0357175 B2 JP H0357175B2
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- heat resistance
- strength
- present
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 description 16
- 239000000956 alloy Substances 0.000 description 16
- 239000000463 material Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000000203 mixture Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910001096 P alloy Inorganic materials 0.000 description 1
- 229910006414 SnNi Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Conductive Materials (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7398784A JPS60218442A (ja) | 1984-04-13 | 1984-04-13 | リ−ドフレ−ム用銅合金 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7398784A JPS60218442A (ja) | 1984-04-13 | 1984-04-13 | リ−ドフレ−ム用銅合金 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60218442A JPS60218442A (ja) | 1985-11-01 |
| JPH0357175B2 true JPH0357175B2 (US20090163788A1-20090625-C00002.png) | 1991-08-30 |
Family
ID=13533967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7398784A Granted JPS60218442A (ja) | 1984-04-13 | 1984-04-13 | リ−ドフレ−ム用銅合金 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60218442A (US20090163788A1-20090625-C00002.png) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0816255B2 (ja) * | 1986-04-10 | 1996-02-21 | 古河電気工業株式会社 | 電子機器用銅合金 |
| JP2542370B2 (ja) * | 1986-09-30 | 1996-10-09 | 古河電気工業株式会社 | 半導体リ−ド用銅合金 |
| DE3854682T2 (de) * | 1987-05-26 | 1996-04-25 | Nippon Steel Corp | Eisen-Kupfer-Chrom-Legierung für einen hochfesten Leiterrahmen oder ein Steckstiftgitter und Verfahren zu ihrer Herstellung. |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58124254A (ja) * | 1982-01-20 | 1983-07-23 | Nippon Mining Co Ltd | 半導体機器のリ−ド材用銅合金 |
| JPS599144A (ja) * | 1982-07-05 | 1984-01-18 | Furukawa Electric Co Ltd:The | 半導体機器のリ−ド材用銅合金 |
| JPS59145746A (ja) * | 1983-12-13 | 1984-08-21 | Nippon Mining Co Ltd | 半導体機器のリ−ド材用銅合金 |
-
1984
- 1984-04-13 JP JP7398784A patent/JPS60218442A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58124254A (ja) * | 1982-01-20 | 1983-07-23 | Nippon Mining Co Ltd | 半導体機器のリ−ド材用銅合金 |
| JPS599144A (ja) * | 1982-07-05 | 1984-01-18 | Furukawa Electric Co Ltd:The | 半導体機器のリ−ド材用銅合金 |
| JPS59145746A (ja) * | 1983-12-13 | 1984-08-21 | Nippon Mining Co Ltd | 半導体機器のリ−ド材用銅合金 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60218442A (ja) | 1985-11-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |