JPH0356144U - - Google Patents
Info
- Publication number
- JPH0356144U JPH0356144U JP11627489U JP11627489U JPH0356144U JP H0356144 U JPH0356144 U JP H0356144U JP 11627489 U JP11627489 U JP 11627489U JP 11627489 U JP11627489 U JP 11627489U JP H0356144 U JPH0356144 U JP H0356144U
- Authority
- JP
- Japan
- Prior art keywords
- signal wiring
- ceramic
- semiconductor chip
- gold
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 230000008018 melting Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11627489U JPH0356144U (US20110009641A1-20110113-C00256.png) | 1989-10-02 | 1989-10-02 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11627489U JPH0356144U (US20110009641A1-20110113-C00256.png) | 1989-10-02 | 1989-10-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0356144U true JPH0356144U (US20110009641A1-20110113-C00256.png) | 1991-05-30 |
Family
ID=31664557
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11627489U Pending JPH0356144U (US20110009641A1-20110113-C00256.png) | 1989-10-02 | 1989-10-02 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0356144U (US20110009641A1-20110113-C00256.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009166901A (ja) * | 2009-03-16 | 2009-07-30 | Mochida Pharmaceut Co Ltd | スティック型包装体 |
-
1989
- 1989-10-02 JP JP11627489U patent/JPH0356144U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009166901A (ja) * | 2009-03-16 | 2009-07-30 | Mochida Pharmaceut Co Ltd | スティック型包装体 |