JPH0356051Y2 - - Google Patents

Info

Publication number
JPH0356051Y2
JPH0356051Y2 JP1985092649U JP9264985U JPH0356051Y2 JP H0356051 Y2 JPH0356051 Y2 JP H0356051Y2 JP 1985092649 U JP1985092649 U JP 1985092649U JP 9264985 U JP9264985 U JP 9264985U JP H0356051 Y2 JPH0356051 Y2 JP H0356051Y2
Authority
JP
Japan
Prior art keywords
resin material
resin
sliding
pressure
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985092649U
Other languages
English (en)
Japanese (ja)
Other versions
JPS622247U (enEXAMPLES
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985092649U priority Critical patent/JPH0356051Y2/ja
Priority to US06/796,814 priority patent/US4723899A/en
Publication of JPS622247U publication Critical patent/JPS622247U/ja
Application granted granted Critical
Publication of JPH0356051Y2 publication Critical patent/JPH0356051Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1985092649U 1984-11-12 1985-06-19 Expired JPH0356051Y2 (enEXAMPLES)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1985092649U JPH0356051Y2 (enEXAMPLES) 1985-06-19 1985-06-19
US06/796,814 US4723899A (en) 1984-11-12 1985-11-12 Molding apparatus for enclosing semiconductor chips with resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985092649U JPH0356051Y2 (enEXAMPLES) 1985-06-19 1985-06-19

Publications (2)

Publication Number Publication Date
JPS622247U JPS622247U (enEXAMPLES) 1987-01-08
JPH0356051Y2 true JPH0356051Y2 (enEXAMPLES) 1991-12-16

Family

ID=30649633

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985092649U Expired JPH0356051Y2 (enEXAMPLES) 1984-11-12 1985-06-19

Country Status (1)

Country Link
JP (1) JPH0356051Y2 (enEXAMPLES)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6054845A (ja) * 1983-09-06 1985-03-29 東洋製罐株式会社 接着構造物

Also Published As

Publication number Publication date
JPS622247U (enEXAMPLES) 1987-01-08

Similar Documents

Publication Publication Date Title
US4723899A (en) Molding apparatus for enclosing semiconductor chips with resin
CN100515717C (zh) 树脂封装方法
CA2022060C (en) Multi-level stacked mold system
JPH0422415B2 (enEXAMPLES)
US5204122A (en) Mold for use in resin encapsulation molding
WO2001039953A1 (en) Shutheight adjuster for a sprue bar
JPH0356051Y2 (enEXAMPLES)
KR20010021240A (ko) 수지밀봉장치
EP0554662B1 (en) Hydraulically operated machine for producing a formed product, having mold closing and clamping cylinders
JPH0238447Y2 (enEXAMPLES)
EP1504871B1 (en) Machine for the injection-molding of soles, technical articles and the like
KR100443316B1 (ko) 반도체 패키지 몰딩장치
JPH10135260A (ja) 電子部品の樹脂封止成形方法及び金型装置
JPH08174605A (ja) 成形装置
KR900001657B1 (ko) 반도체 수지밀봉용 성형장치
JP3739430B2 (ja) マルチプランジャ型のプランジャ等圧装置
JP2002331543A (ja) インサート射出成形品の射出成形方法、及びその装置
JPH01169936A (ja) 半導体素子の樹脂封止成形方法及び装置
JPH0356341Y2 (enEXAMPLES)
JPH0432755Y2 (enEXAMPLES)
JP2002321263A (ja) 射出成形金型および射出成形方法
KR200165886Y1 (ko) 반도체 패키지의 몰딩장치
JP3640053B2 (ja) マルチ式トランスファ成形装置
JP2772486B2 (ja) 電子部品の樹脂封止成形用金型
JPH058253A (ja) 電子部品の樹脂封止成形装置