JPH0355988B2 - - Google Patents
Info
- Publication number
- JPH0355988B2 JPH0355988B2 JP13378282A JP13378282A JPH0355988B2 JP H0355988 B2 JPH0355988 B2 JP H0355988B2 JP 13378282 A JP13378282 A JP 13378282A JP 13378282 A JP13378282 A JP 13378282A JP H0355988 B2 JPH0355988 B2 JP H0355988B2
- Authority
- JP
- Japan
- Prior art keywords
- optical
- transmission line
- optical transmission
- package
- optical semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000003287 optical effect Effects 0.000 claims description 43
- 230000005540 biological transmission Effects 0.000 claims description 23
- 239000004065 semiconductor Substances 0.000 claims description 21
- 239000013307 optical fiber Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Light Receiving Elements (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Optical Couplings Of Light Guides (AREA)
Description
【発明の詳細な説明】
(1) 発明の技術分野
本発明は光伝送路付光半導体を収容したパツケ
ージの改良に関するものである。DETAILED DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to an improvement in a package containing an optical semiconductor with an optical transmission line.
(2) 従来技術と問題点
第１図は光通信に用いられる光伝送路付光半導
体集積回路の構造を示す図である。この光半導体
集積回路はプレーナ構造の半導体１に受光素子
２、発光素子２ａ、IC３等を形成し、パツケー
ジ４の中に収容し光伝送路５をパツケージの蓋
４′に垂直に取着している。このような構造の光
半導体集積回路はプリント板６に搭載したとき、
光フアイバ等を用いた光伝送路５を急激に曲げる
ことができないのでその実装高さＨが著しく大と
なる欠点があつた。(2) Prior Art and Problems FIG. 1 is a diagram showing the structure of an optical semiconductor integrated circuit with an optical transmission line used in optical communication. This optical semiconductor integrated circuit includes a semiconductor 1 having a planar structure, on which a light receiving element 2, a light emitting element 2a, an IC 3, etc. are formed, and the circuit is housed in a package 4, and an optical transmission path 5 is vertically attached to a lid 4' of the package. There is. When the optical semiconductor integrated circuit having such a structure is mounted on the printed board 6,
Since the optical transmission line 5 using an optical fiber or the like cannot be sharply bent, the mounting height H becomes extremely large.
(3) 発明の目的
本発明は上記従来の欠点に鑑み、実装高さの低
い光伝送路付光半導体パツケージを提供すること
を目的とするものである。(3) Object of the Invention In view of the above-mentioned conventional drawbacks, it is an object of the present invention to provide an optical semiconductor package with an optical transmission line that has a low mounting height.
(4) 発明の構成
そしてこの目的は本発明によれば、光フアイバ
等の光伝送路を備えた光半導体素子用のパツケー
ジにおいて、封止を行なうための蓋の裏面に光伝
送路と光半導体素子間の光を伝送するためのミラ
ーを設けたことを特徴とする光伝送路付光半導体
パツケージを提供することによつて達成される。(4) Structure of the Invention According to the present invention, in a package for an optical semiconductor element equipped with an optical transmission path such as an optical fiber, the optical transmission path and the optical semiconductor are provided on the back side of a lid for sealing. This is achieved by providing an optical semiconductor package with an optical transmission line, which is characterized by being provided with a mirror for transmitting light between elements.
(5) 発明の実施例 以下本発明実施例を図面によつて詳述する。(5) Examples of the invention Embodiments of the present invention will be described in detail below with reference to the drawings.
第２図は本発明による光伝送路付光半導体パツ
ケージの構造を説明するための図である。同図に
おいて、７は光半導体集積回路、８はその受光素
子、９は受光用光伝送路、１０はパツケージ、１
１はその蓋をそれぞれ示す。 FIG. 2 is a diagram for explaining the structure of an optical semiconductor package with an optical transmission line according to the present invention. In the figure, 7 is an optical semiconductor integrated circuit, 8 is its light receiving element, 9 is an optical transmission line for light reception, 10 is a package, 1
1 indicates the lid, respectively.
本実施例は、図に示す如く先端を斜に研磨した
光伝送路９の先端と光半導体集積回路７とをパツ
ケージ１０に収容して同一平面に固定し、蓋１１
の裏面には光伝送路９から出た光１２が反射して
受光素子８に入射するようにミラー１３を設けた
ものである。 In this embodiment, as shown in the figure, the tip of an optical transmission line 9 whose tip is obliquely polished and an optical semiconductor integrated circuit 7 are housed in a package 10 and fixed on the same plane.
A mirror 13 is provided on the back surface of the mirror 13 so that the light 12 emitted from the optical transmission path 9 is reflected and incident on the light receiving element 8.
このように構成された本実施例は光伝送路９が
光半導体集積回路７の表面と平行に配置できるの
でパツケージ１０の実装高さH′を従来に比して
著しく低くすることができる。また光伝送路９と
光半導体集積回路７とを同一平面上に取着できる
ので組立が容易となる利点も生ずる。 In this embodiment configured as described above, the optical transmission line 9 can be arranged parallel to the surface of the optical semiconductor integrated circuit 7, so that the mounting height H' of the package 10 can be made significantly lower than in the conventional case. Further, since the optical transmission line 9 and the optical semiconductor integrated circuit 7 can be mounted on the same plane, there is an advantage that assembly is easy.
第３図は他の実施例を示す図である。同図にお
いて第２図と同一部分は同一符号を付して示し
た。なお１４及び１５はミラーである。 FIG. 3 is a diagram showing another embodiment. In this figure, the same parts as in FIG. 2 are designated by the same reference numerals. Note that 14 and 15 are mirrors.
本実施例は蓋１１の裏面に45゜に傾けてミラー
１４，１５を設け光伝送路９から出た光１２を２
回反射させて受光素子８に導くようにしたもので
あり、その効果は前実施例と全く同様である。 In this embodiment, mirrors 14 and 15 are provided on the back surface of the lid 11 at an angle of 45 degrees, and the light 12 emitted from the optical transmission line 9 is divided into two.
The light is reflected twice and guided to the light receiving element 8, and the effect is exactly the same as in the previous embodiment.
なお、第２図及び第３図に示した実施例は受光
用として説明したが、受光素子８を発光素子とす
れば送光用にも用いられることは勿論であり、同
様の効果を期待することができる。 Although the embodiments shown in FIGS. 2 and 3 have been described as being for light reception, if the light receiving element 8 is used as a light emitting element, it can of course also be used for light transmission, and similar effects are expected. be able to.
(6) 発明の効果
以上、詳細に説明したように本発明の光伝送路
付光半導体パツケージは、パツケージの蓋の裏面
にミラーを設ける簡単な構成により、その実装高
さを従来に比して著しく低下することを可能とし
た効果大なるものである。(6) Effects of the Invention As explained above in detail, the optical semiconductor package with optical transmission line of the present invention has a simple configuration in which a mirror is provided on the back side of the lid of the package, so that the mounting height can be increased compared to the conventional one. This is a great effect as it made it possible to significantly reduce the amount of water used.
第１図は従来の光伝送路付光半導体パツケージ
の構造を示す図、第２図は本発明による光伝送路
付光半導体パツケージの実施例の構造を示す図、
第３図は他の実施例の構造を示す図である。
図面において、７は光半導体集積回路、８はそ
の受光素子、９は光伝送路、１０はパツケージ、
１１は蓋、１３，１４，１５はミラーをそれぞれ
示す。
FIG. 1 is a diagram showing the structure of a conventional optical semiconductor package with an optical transmission line, and FIG. 2 is a diagram showing the structure of an embodiment of the optical semiconductor package with an optical transmission line according to the present invention.
FIG. 3 is a diagram showing the structure of another embodiment. In the drawing, 7 is an optical semiconductor integrated circuit, 8 is a light receiving element thereof, 9 is an optical transmission line, 10 is a package,
11 is a lid, and 13, 14, and 15 are mirrors, respectively.
Claims (1)
子用のパツケージにおいて、封止を行なうための
蓋の裏面に光伝送路と光半導体素子間の光を伝送
するためのミラーを設けたことを特徴とする光伝
送路付光半導体パツケージ。1. In a package for an optical semiconductor device equipped with an optical transmission line such as an optical fiber, a mirror is provided on the back side of the lid for sealing to transmit light between the optical transmission line and the optical semiconductor element. Optical semiconductor package with characteristic optical transmission line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57133782A JPS5925282A (en) | 1982-08-02 | 1982-08-02 | Photosemiconductor package with photo transmission line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57133782A JPS5925282A (en) | 1982-08-02 | 1982-08-02 | Photosemiconductor package with photo transmission line |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5925282A JPS5925282A (en) | 1984-02-09 |
| JPH0355988B2 true JPH0355988B2 (en) | 1991-08-27 |
Family
ID=15112863
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57133782A Granted JPS5925282A (en) | 1982-08-02 | 1982-08-02 | Photosemiconductor package with photo transmission line |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5925282A (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4772787A (en) * | 1985-01-07 | 1988-09-20 | Siemens Aktiengesellschaft | Monolithically integrated opto-electronic semiconductor component |
| JPS62260384A (en) * | 1986-05-06 | 1987-11-12 | Mitsubishi Electric Corp | Semiconductor device |
| FR2601505B1 (en) * | 1986-07-09 | 1988-11-10 | Labo Electronique Physique | INTEGRATED SEMICONDUCTOR DEVICE OF THE COUPLING DEVICE BETWEEN A PHOTODETECTOR AND A LIGHT WAVEGUIDE |
| US4826272A (en) * | 1987-08-27 | 1989-05-02 | American Telephone And Telegraph Company At&T Bell Laboratories | Means for coupling an optical fiber to an opto-electronic device |
| EP0308604A1 (en) * | 1987-09-25 | 1989-03-29 | Siemens Aktiengesellschaft | Optical coupling device for a laser diode with an optical wave guide |
| US4897711A (en) * | 1988-03-03 | 1990-01-30 | American Telephone And Telegraph Company | Subassembly for optoelectronic devices |
| CA2019074C (en) * | 1989-06-19 | 1993-06-01 | Takayuki Masuko | Photo-semiconductor module |
| JPH0427408U (en) * | 1990-06-27 | 1992-03-04 | ||
| JPH0749817Y2 (en) * | 1990-09-25 | 1995-11-13 | ホシデン株式会社 | Optical link |
| CA2130738A1 (en) * | 1993-11-01 | 1995-05-02 | Keith Wayne Goossen | Method and arrangement for arbitrary angle mirrors in substrates for use in hybrid optical systems |
| WO1997025638A2 (en) * | 1996-01-09 | 1997-07-17 | Siemens Aktiengesellschaft | An arrangement for optical coupling of a light emitting element with a light receiving element |
-
1982
- 1982-08-02 JP JP57133782A patent/JPS5925282A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5925282A (en) | 1984-02-09 |
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