JPH0355988B2 - - Google Patents

Info

Publication number
JPH0355988B2
JPH0355988B2 JP13378282A JP13378282A JPH0355988B2 JP H0355988 B2 JPH0355988 B2 JP H0355988B2 JP 13378282 A JP13378282 A JP 13378282A JP 13378282 A JP13378282 A JP 13378282A JP H0355988 B2 JPH0355988 B2 JP H0355988B2
Authority
JP
Japan
Prior art keywords
optical
transmission line
optical transmission
package
optical semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP13378282A
Other languages
Japanese (ja)
Other versions
JPS5925282A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP57133782A priority Critical patent/JPS5925282A/en
Publication of JPS5925282A publication Critical patent/JPS5925282A/en
Publication of JPH0355988B2 publication Critical patent/JPH0355988B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Led Device Packages (AREA)
  • Light Receiving Elements (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)

Description

【発明の詳細な説明】 (1) 発明の技術分野 本発明は光伝送路付光半導体を収容したパツケ
ージの改良に関するものである。
DETAILED DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to an improvement in a package containing an optical semiconductor with an optical transmission line.

(2) 従来技術と問題点 第1図は光通信に用いられる光伝送路付光半導
体集積回路の構造を示す図である。この光半導体
集積回路はプレーナ構造の半導体1に受光素子
2、発光素子2a、IC3等を形成し、パツケー
ジ4の中に収容し光伝送路5をパツケージの蓋
4′に垂直に取着している。このような構造の光
半導体集積回路はプリント板6に搭載したとき、
光フアイバ等を用いた光伝送路5を急激に曲げる
ことができないのでその実装高さHが著しく大と
なる欠点があつた。
(2) Prior Art and Problems FIG. 1 is a diagram showing the structure of an optical semiconductor integrated circuit with an optical transmission line used in optical communication. This optical semiconductor integrated circuit includes a semiconductor 1 having a planar structure, on which a light receiving element 2, a light emitting element 2a, an IC 3, etc. are formed, and the circuit is housed in a package 4, and an optical transmission path 5 is vertically attached to a lid 4' of the package. There is. When the optical semiconductor integrated circuit having such a structure is mounted on the printed board 6,
Since the optical transmission line 5 using an optical fiber or the like cannot be sharply bent, the mounting height H becomes extremely large.

(3) 発明の目的 本発明は上記従来の欠点に鑑み、実装高さの低
い光伝送路付光半導体パツケージを提供すること
を目的とするものである。
(3) Object of the Invention In view of the above-mentioned conventional drawbacks, it is an object of the present invention to provide an optical semiconductor package with an optical transmission line that has a low mounting height.

(4) 発明の構成 そしてこの目的は本発明によれば、光フアイバ
等の光伝送路を備えた光半導体素子用のパツケー
ジにおいて、封止を行なうための蓋の裏面に光伝
送路と光半導体素子間の光を伝送するためのミラ
ーを設けたことを特徴とする光伝送路付光半導体
パツケージを提供することによつて達成される。
(4) Structure of the Invention According to the present invention, in a package for an optical semiconductor element equipped with an optical transmission path such as an optical fiber, the optical transmission path and the optical semiconductor are provided on the back side of a lid for sealing. This is achieved by providing an optical semiconductor package with an optical transmission line, which is characterized by being provided with a mirror for transmitting light between elements.

(5) 発明の実施例 以下本発明実施例を図面によつて詳述する。(5) Examples of the invention Embodiments of the present invention will be described in detail below with reference to the drawings.

第2図は本発明による光伝送路付光半導体パツ
ケージの構造を説明するための図である。同図に
おいて、7は光半導体集積回路、8はその受光素
子、9は受光用光伝送路、10はパツケージ、1
1はその蓋をそれぞれ示す。
FIG. 2 is a diagram for explaining the structure of an optical semiconductor package with an optical transmission line according to the present invention. In the figure, 7 is an optical semiconductor integrated circuit, 8 is its light receiving element, 9 is an optical transmission line for light reception, 10 is a package, 1
1 indicates the lid, respectively.

本実施例は、図に示す如く先端を斜に研磨した
光伝送路9の先端と光半導体集積回路7とをパツ
ケージ10に収容して同一平面に固定し、蓋11
の裏面には光伝送路9から出た光12が反射して
受光素子8に入射するようにミラー13を設けた
ものである。
In this embodiment, as shown in the figure, the tip of an optical transmission line 9 whose tip is obliquely polished and an optical semiconductor integrated circuit 7 are housed in a package 10 and fixed on the same plane.
A mirror 13 is provided on the back surface of the mirror 13 so that the light 12 emitted from the optical transmission path 9 is reflected and incident on the light receiving element 8.

このように構成された本実施例は光伝送路9が
光半導体集積回路7の表面と平行に配置できるの
でパツケージ10の実装高さH′を従来に比して
著しく低くすることができる。また光伝送路9と
光半導体集積回路7とを同一平面上に取着できる
ので組立が容易となる利点も生ずる。
In this embodiment configured as described above, the optical transmission line 9 can be arranged parallel to the surface of the optical semiconductor integrated circuit 7, so that the mounting height H' of the package 10 can be made significantly lower than in the conventional case. Further, since the optical transmission line 9 and the optical semiconductor integrated circuit 7 can be mounted on the same plane, there is an advantage that assembly is easy.

第3図は他の実施例を示す図である。同図にお
いて第2図と同一部分は同一符号を付して示し
た。なお14及び15はミラーである。
FIG. 3 is a diagram showing another embodiment. In this figure, the same parts as in FIG. 2 are designated by the same reference numerals. Note that 14 and 15 are mirrors.

本実施例は蓋11の裏面に45゜に傾けてミラー
14,15を設け光伝送路9から出た光12を2
回反射させて受光素子8に導くようにしたもので
あり、その効果は前実施例と全く同様である。
In this embodiment, mirrors 14 and 15 are provided on the back surface of the lid 11 at an angle of 45 degrees, and the light 12 emitted from the optical transmission line 9 is divided into two.
The light is reflected twice and guided to the light receiving element 8, and the effect is exactly the same as in the previous embodiment.

なお、第2図及び第3図に示した実施例は受光
用として説明したが、受光素子8を発光素子とす
れば送光用にも用いられることは勿論であり、同
様の効果を期待することができる。
Although the embodiments shown in FIGS. 2 and 3 have been described as being for light reception, if the light receiving element 8 is used as a light emitting element, it can of course also be used for light transmission, and similar effects are expected. be able to.

(6) 発明の効果 以上、詳細に説明したように本発明の光伝送路
付光半導体パツケージは、パツケージの蓋の裏面
にミラーを設ける簡単な構成により、その実装高
さを従来に比して著しく低下することを可能とし
た効果大なるものである。
(6) Effects of the Invention As explained above in detail, the optical semiconductor package with optical transmission line of the present invention has a simple configuration in which a mirror is provided on the back side of the lid of the package, so that the mounting height can be increased compared to the conventional one. This is a great effect as it made it possible to significantly reduce the amount of water used.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の光伝送路付光半導体パツケージ
の構造を示す図、第2図は本発明による光伝送路
付光半導体パツケージの実施例の構造を示す図、
第3図は他の実施例の構造を示す図である。 図面において、7は光半導体集積回路、8はそ
の受光素子、9は光伝送路、10はパツケージ、
11は蓋、13,14,15はミラーをそれぞれ
示す。
FIG. 1 is a diagram showing the structure of a conventional optical semiconductor package with an optical transmission line, and FIG. 2 is a diagram showing the structure of an embodiment of the optical semiconductor package with an optical transmission line according to the present invention.
FIG. 3 is a diagram showing the structure of another embodiment. In the drawing, 7 is an optical semiconductor integrated circuit, 8 is a light receiving element thereof, 9 is an optical transmission line, 10 is a package,
11 is a lid, and 13, 14, and 15 are mirrors, respectively.

Claims (1)

【特許請求の範囲】[Claims] 1 光フアイバ等の光伝送路を備えた光半導体素
子用のパツケージにおいて、封止を行なうための
蓋の裏面に光伝送路と光半導体素子間の光を伝送
するためのミラーを設けたことを特徴とする光伝
送路付光半導体パツケージ。
1. In a package for an optical semiconductor device equipped with an optical transmission line such as an optical fiber, a mirror is provided on the back side of the lid for sealing to transmit light between the optical transmission line and the optical semiconductor element. Optical semiconductor package with characteristic optical transmission line.
JP57133782A 1982-08-02 1982-08-02 Photosemiconductor package with photo transmission line Granted JPS5925282A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57133782A JPS5925282A (en) 1982-08-02 1982-08-02 Photosemiconductor package with photo transmission line

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57133782A JPS5925282A (en) 1982-08-02 1982-08-02 Photosemiconductor package with photo transmission line

Publications (2)

Publication Number Publication Date
JPS5925282A JPS5925282A (en) 1984-02-09
JPH0355988B2 true JPH0355988B2 (en) 1991-08-27

Family

ID=15112863

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57133782A Granted JPS5925282A (en) 1982-08-02 1982-08-02 Photosemiconductor package with photo transmission line

Country Status (1)

Country Link
JP (1) JPS5925282A (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0192850A1 (en) * 1985-01-07 1986-09-03 Siemens Aktiengesellschaft Monolithic integrated optoelectronic semiconductor device
JPS62260384A (en) * 1986-05-06 1987-11-12 Mitsubishi Electric Corp Semiconductor device
FR2601505B1 (en) * 1986-07-09 1988-11-10 Labo Electronique Physique INTEGRATED SEMICONDUCTOR DEVICE OF THE COUPLING DEVICE BETWEEN A PHOTODETECTOR AND A LIGHT WAVEGUIDE
US4826272A (en) * 1987-08-27 1989-05-02 American Telephone And Telegraph Company At&T Bell Laboratories Means for coupling an optical fiber to an opto-electronic device
EP0308604A1 (en) * 1987-09-25 1989-03-29 Siemens Aktiengesellschaft Optical coupling device for a laser diode with an optical wave guide
US4897711A (en) * 1988-03-03 1990-01-30 American Telephone And Telegraph Company Subassembly for optoelectronic devices
CA2019074C (en) * 1989-06-19 1993-06-01 Takayuki Masuko Photo-semiconductor module
JPH0427408U (en) * 1990-06-27 1992-03-04
JPH0749817Y2 (en) * 1990-09-25 1995-11-13 ホシデン株式会社 Optical link
CA2130738A1 (en) * 1993-11-01 1995-05-02 Keith Wayne Goossen Method and arrangement for arbitrary angle mirrors in substrates for use in hybrid optical systems
WO1997025638A2 (en) * 1996-01-09 1997-07-17 Siemens Aktiengesellschaft An arrangement for optical coupling of a light emitting element with a light receiving element

Also Published As

Publication number Publication date
JPS5925282A (en) 1984-02-09

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