JPH0355893A - Both-side wiring board - Google Patents
Both-side wiring boardInfo
- Publication number
- JPH0355893A JPH0355893A JP19209989A JP19209989A JPH0355893A JP H0355893 A JPH0355893 A JP H0355893A JP 19209989 A JP19209989 A JP 19209989A JP 19209989 A JP19209989 A JP 19209989A JP H0355893 A JPH0355893 A JP H0355893A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- electrode
- conductive paste
- board
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 18
- 229910000679 solder Inorganic materials 0.000 abstract description 10
- 230000003628 erosive effect Effects 0.000 description 4
- 238000010304 firing Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は両面配線板に関し、具体的には表裏の接続信頼
性の高いスルーホールを持つ両面配線板に関する．
［背景技術コ
第２図に従来のスルーホール構造を示す．従来のスルー
ホール５１にあっては、図示のように基板５２に均一な
径の貫通孔５３を穿孔し、基板５２の一方表面から他方
表面にかけて、貫通孔５３内に導電ペーストを厚膜印刷
し、導電ペーストを乾燥させた後焼き付けて基板の両面
に中空のスルーホール電極５４を形成していた。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a double-sided wiring board, and specifically relates to a double-sided wiring board having through holes with high connection reliability on the front and back sides. [Background Art Figure 2 shows a conventional through-hole structure. In the conventional through hole 51, as shown in the figure, a through hole 53 with a uniform diameter is bored in a substrate 52, and a thick film of conductive paste is printed inside the through hole 53 from one surface of the substrate 52 to the other surface. After drying the conductive paste, it was baked to form hollow through-hole electrodes 54 on both sides of the substrate.
［発明が解決しようとする課題コ
しかしながら、従来のスルーホール構造にあっては、貫
通孔５３の開口端におけるエッジ部αの断面角が９０゜
となっていたので、導電ペーストを貫通孔５３に印刷し
た時、第２図に示すように導電ペーストの表面張力など
のため、貫通孔５３のエッジ部αで導電ペーストの膜厚
が薄くなり易い．したがって、貫通孔５３のエッジ部α
においては、スルーホール電極５４が、ランド部５４ａ
や貫通孔の内周部５４ｂにおける膜厚よりも極めて薄く
なっていた．このため、この両面配線板を半田浴に浸漬
した場合にエッジ部αで半田食われが生じてスルーホー
ル電極５４の電極切れを起こし易く、また導電ペースト
の焼成時に電極割れを生じることが多かった．
このため、第３図に示すように、貫通孔５６の直径を０
．１ ｍｍないし０．２ ｍｍ位に小さくし、基板５７
の片面付近で貫通孔５６内にスルーホール電極５８を充
填させたスルーホール構造が提案されている。しかし、
このようなスルーホール楕遣にあっては、充填側のエッ
ジ部βではスルーホール電極が薄くなるのを防止できる
が、反対側のエッジ部γでは、これまでと同様スルーホ
ール電極５８の膜厚が極めて薄く、半田浴に浸漬した場
合や焼成時などにはこちらのエッジ部γで電極切れを生
じていた．
しかして、本発明は叙上の従来例の欠点に鑑みてなされ
たものであり、その目的とするところは、スルーホール
電極のエッジ部における電極切れを無くし、スルーホー
ルの接続信頼性を向上させることにある。[Problems to be Solved by the Invention] However, in the conventional through-hole structure, the cross-sectional angle of the edge portion α at the open end of the through-hole 53 was 90°, so it was difficult to apply the conductive paste to the through-hole 53. When printed, the film thickness of the conductive paste tends to become thinner at the edge portion α of the through hole 53 due to the surface tension of the conductive paste, as shown in FIG. Therefore, the edge portion α of the through hole 53
In this case, the through-hole electrode 54 is connected to the land portion 54a.
The film thickness was extremely thinner than that at the inner peripheral portion 54b of the through hole. For this reason, when this double-sided wiring board is immersed in a solder bath, solder erosion occurs at the edge portion α, which tends to cause electrode breaks in the through-hole electrodes 54, and electrode cracks often occur when baking the conductive paste. ．． Therefore, as shown in FIG. 3, the diameter of the through hole 56 is set to 0.
．． The thickness is reduced to about 1 mm to 0.2 mm, and the substrate 57 is
A through-hole structure has been proposed in which a through-hole electrode 58 is filled in a through-hole 56 near one side of the through-hole. but,
In such a through-hole ellipse, it is possible to prevent the through-hole electrode from becoming thinner at the edge portion β on the filling side, but at the edge portion γ on the opposite side, the film thickness of the through-hole electrode 58 is reduced as before. The electrode was extremely thin, and the electrode broke at the edge γ when immersed in a solder bath or during firing. However, the present invention has been made in view of the drawbacks of the conventional examples described above, and its purpose is to eliminate electrode breakage at the edge portion of the through-hole electrode and improve the connection reliability of the through-hole. There is a particular thing.
［課題を解決するための手段］
このため本発明の両面配線板は、一方表面における開口
径が他方表面における開口径よりも大きくなった略テー
パー状の貫通孔を基板に穿孔し、基板の一方表面から他
方表面にかけて貫通孔内に導電ペーストを厚膜印刷して
スルーホール電極を形成すると共に、貫通孔の前記小径
側端部で貫通孔内にスルーホール電極を充填させたこと
を特徴としている。[Means for Solving the Problems] Therefore, in the double-sided wiring board of the present invention, a substantially tapered through hole is bored in the substrate, and the opening diameter on one surface is larger than the opening diameter on the other surface. A through-hole electrode is formed by printing a thick film of conductive paste in the through-hole from one surface to the other surface, and the through-hole electrode is filled in the through-hole at the small-diameter end of the through-hole. .
［作用コ
本発明にあっては、貫通孔を略テーパー状に形成してあ
るので、開口径の大きな側のエッジ部の断面角が鈍角と
なっており、このため貫通孔に導電ペーストを印刷塗布
した時、そのエッジ部で導電ペーストが薄くなりに＜＜
、スルーホール電極のｉＦｉ切れを防止することができ
る。また、貫通孔の小径側では、貫通孔内にスルーホー
ル電極が充填されているので、厚い膜厚を得ることがで
き、こちら側でもスルーホール電極の電極切れを防止す
ることができる。[Operation] In the present invention, since the through-hole is formed in a substantially tapered shape, the cross-sectional angle of the edge portion on the side with a larger opening diameter is an obtuse angle. When applied, the conductive paste becomes thinner at the edges.
, it is possible to prevent IFi breakage of the through-hole electrode. Moreover, since the through-hole electrode is filled in the through-hole on the small diameter side of the through-hole, a thick film thickness can be obtained, and electrode breakage of the through-hole electrode can be prevented on this side as well.
したがって、本発明によれば、貫通孔のエッジ部におけ
る電極切れを確実に防止することができ、基板の表裏に
おける接続信頼性を向上させることができる．
［実施例コ
以下、本発明の実施例を製造順序に沿って示した第ｌ図
（ａ）〜（Ｃ）に基づいて詳述する．まず、第１図（ａ
）に示すように、基板２の一方表面で開口径が大きく、
他方表面で開口径が小さくなった略テーパー状の貫通孔
１を、アルミナ基板等のセラミック基板２に穿孔する．
したがって、貫通孔１は、開口径の大きな側ではエッジ
部５ａの断面角が鈍角となっており、開口径の小さな側
ではエッジ部５ｂの断面角が鋭角となっている．貫通孔
１の孔あけ方法としては、例えばレーザー加工や金型を
用いたパンチング加工等による．
次に、第１図（ｂ）に示すように、貫通孔１の開口径の
大きな側を上にして基板２を配置し、貫通孔１の下面側
から真空吸引しながら、基板２の上面に導電ペースト３
をスクリーン印刷する．このとき、基板２の上面に印刷
された導電ペースト３によりランド部６ａが形成され、
貫通孔１内へ吸引された導電ペースト３は貫通孔１の内
周面に塗布される．しかも、導電ペースト３は、貫通孔
１の小径側へ引き抜かれず、貫通孔１の小径側に詰まっ
て充填される．なお、貫通孔１に導電ペースト３を充填
させるためには、従来にあっては導電ペースト３の塗布
量などの調整が困難であったが、本発明では貫通孔１の
一方が小径となっているので、容易に導電ペースト３を
充填させることができる．貫通孔１の小径側の開口径は
小さい方が良く、例えば直径０．２ ｍｍ以下とすると
良い．さらに、第１図（ｃ）に示すように、貫通孔１の
小径側において、基板２の表面に導電ペースト３をスク
リーン印刷して下面のランド部６ｂを形成し、貫通孔１
内の導電ペースト３と一体に接続させ、上下にランド部
６ａ，６ｂを備えたスルーホール電極４を形成する．こ
うして、基板２の上面から下面にかけて貫通孔１に導電
ペースト３を印刷した後、導電ペースト３を乾燥させ、
焼成して、スルーホール電極４を基板２に焼き付ける．
上記のような構造のスルーホールにおいては、開口径の
大きな側のエッジ部５ａでは、断面角が鈍角となってい
るので、導電ペースト３を塗布した時に基板２表面から
貫通孔１内周にかけて滑らかに導電ペースト３を塗布で
き、エッジ部５ａで導電ペースト３の膜厚が薄くならず
、ほぼ均一な膜厚を得ることができる。また、開口径の
小さい側のエッジ部５ｂでは、導電ペースト３の印刷時
に導電ペースト３が貫通孔１内に充填され、エッジ部５
ｂで大きな膜厚を得ることができる。Therefore, according to the present invention, it is possible to reliably prevent electrode breakage at the edge portion of the through hole, and it is possible to improve connection reliability on the front and back sides of the substrate. [Example 7] Examples of the present invention will be described in detail below based on FIGS. 1(a) to 1(C) shown in the manufacturing order. First, Figure 1 (a
), the opening diameter is large on one surface of the substrate 2;
A substantially tapered through hole 1 with a smaller opening diameter on the other surface is bored in a ceramic substrate 2 such as an alumina substrate.
Therefore, in the through-hole 1, the cross-sectional angle of the edge portion 5a is an obtuse angle on the side with a larger opening diameter, and the cross-sectional angle of the edge portion 5b is an acute angle on the side with a smaller opening diameter. The method for making the through hole 1 is, for example, laser processing or punching using a mold. Next, as shown in FIG. 1(b), the substrate 2 is placed with the side with the larger opening diameter of the through hole 1 facing upward, and while vacuum suction is applied from the lower surface side of the through hole 1, the upper surface of the substrate 2 is placed. conductive paste 3
Screen print. At this time, a land portion 6a is formed by the conductive paste 3 printed on the upper surface of the substrate 2,
The conductive paste 3 sucked into the through hole 1 is applied to the inner peripheral surface of the through hole 1. Moreover, the conductive paste 3 is not pulled out to the small diameter side of the through hole 1, but is clogged and filled in the small diameter side of the through hole 1. In order to fill the through-hole 1 with the conductive paste 3, in the past, it was difficult to adjust the amount of conductive paste 3 applied, but in the present invention, one of the through-holes 1 has a small diameter. Therefore, the conductive paste 3 can be easily filled. The smaller the diameter of the opening on the small diameter side of the through hole 1, the better, for example, a diameter of 0.2 mm or less. Furthermore, as shown in FIG. 1(c), a conductive paste 3 is screen printed on the surface of the substrate 2 on the small diameter side of the through hole 1 to form a land portion 6b on the lower surface.
A through-hole electrode 4 having upper and lower land portions 6a and 6b is formed by integrally connecting it with the conductive paste 3 inside. In this way, after printing the conductive paste 3 in the through holes 1 from the upper surface to the lower surface of the substrate 2, the conductive paste 3 is dried,
The through-hole electrodes 4 are baked onto the substrate 2 by firing.
In the through-hole with the above structure, the cross-sectional angle is obtuse at the edge portion 5a on the side with the larger opening diameter, so when the conductive paste 3 is applied, it is smooth from the surface of the substrate 2 to the inner circumference of the through-hole 1. The conductive paste 3 can be applied to the edge portion 5a, and the thickness of the conductive paste 3 does not become thinner at the edge portion 5a, making it possible to obtain a substantially uniform film thickness. In addition, in the edge portion 5b on the side where the opening diameter is smaller, the conductive paste 3 is filled into the through hole 1 when printing the conductive paste 3, and the edge portion 5b is filled with the conductive paste 3 during printing.
A large film thickness can be obtained with b.
したがって、貫通孔ｌに印刷された導電ペースト３を焼
成した場合、スルーホール電極４（特に、エッジ部５ａ
，５ｂにおいて）に電極切れが生じることがなく、また
、半田浴に浸漬して半田被膜を形成する場合に半田食わ
れ等による電極切れも生じにくい．したがって、スルー
ホールにおける表裏の導通不良の原因をなくすことがで
き、厚膜配線板の表裏間での接続信頼性を向上させるこ
とができる．
［発明の効果］
本発明によれば、スルーホールの両エッジ部においてス
ルーホール電極の膜厚が薄くなることを防止でき、スル
ーホールの導通不良の原因となるエッジ部での半田食わ
れや電極切れなどをなくすことができる。したがってス
ルーホールの表裏間における接続信頼性の高い厚膜配線
板を得ることができる。Therefore, when the conductive paste 3 printed in the through-hole l is fired, the through-hole electrode 4 (especially the edge portion 5a
, 5b), and when forming a solder film by immersing it in a solder bath, electrode breakage due to solder erosion is less likely to occur. Therefore, it is possible to eliminate the cause of poor conduction between the front and back sides of the through hole, and it is possible to improve the connection reliability between the front and back sides of the thick film wiring board. [Effects of the Invention] According to the present invention, it is possible to prevent the film thickness of the through-hole electrode from becoming thinner at both edges of the through-hole, and prevent solder erosion and electrode erosion at the edge portions that cause poor conduction of the through-hole. You can eliminate cuts etc. Therefore, it is possible to obtain a thick film wiring board with high connection reliability between the front and back sides of the through holes.
第１図（ａ）（ｂ）（ｃ）は本発明の一実施例における
製造過程を示す断面図、第２図は従来例の断面図、第３
図は先行技術例を示す断面図である。FIGS. 1(a), (b), and (c) are cross-sectional views showing the manufacturing process in one embodiment of the present invention, FIG. 2 is a cross-sectional view of a conventional example, and FIG.
The figure is a sectional view showing an example of the prior art.
Claims (1)
径よりも大きくなった略テーパー状の貫通孔を基板に穿
孔し、基板の一方表面から他方表面にかけて貫通孔内に
導電ペーストを厚膜印刷してスルーホール電極を形成す
ると共に、貫通孔の前記小径側端部で貫通孔内にスルー
ホール電極を充填させたことを特徴とする両面配線板。(1) A substantially tapered through hole with an opening diameter on one surface that is larger than the opening diameter on the other surface is drilled in the substrate, and a thick film of conductive paste is printed in the through hole from one surface of the substrate to the other surface. A double-sided wiring board characterized in that a through-hole electrode is formed in the through-hole, and the through-hole electrode is filled in the through-hole at the small-diameter end of the through-hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19209989A JPH0355893A (en) | 1989-07-24 | 1989-07-24 | Both-side wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19209989A JPH0355893A (en) | 1989-07-24 | 1989-07-24 | Both-side wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0355893A true JPH0355893A (en) | 1991-03-11 |
Family
ID=16285635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19209989A Pending JPH0355893A (en) | 1989-07-24 | 1989-07-24 | Both-side wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0355893A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010023733A1 (en) * | 2008-08-27 | 2010-03-04 | セイコーインスツル株式会社 | Piezoelectric vibrator, oscillator, electronic apparatus, wave clock, and method for manufacturing piezoelectric vibrator |
-
1989
- 1989-07-24 JP JP19209989A patent/JPH0355893A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010023733A1 (en) * | 2008-08-27 | 2010-03-04 | セイコーインスツル株式会社 | Piezoelectric vibrator, oscillator, electronic apparatus, wave clock, and method for manufacturing piezoelectric vibrator |
| JP5065494B2 (en) * | 2008-08-27 | 2012-10-31 | セイコーインスツル株式会社 | Piezoelectric vibrator, oscillator, electronic device, radio timepiece, and method of manufacturing piezoelectric vibrator |
| US8421546B2 (en) | 2008-08-27 | 2013-04-16 | Seiko Instruments Inc. | Piezoelectric vibrator, oscillator, electronic equipment timepiece, and radio-controlled timepiece, and method of manufacturing piezoelectric vibrator |
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