JPH0353511Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a high voltage semiconductor device suitable for stacking to form a high voltage rectifier stack.

[Conventional technology]

Conventionally, a plurality of high-voltage semiconductor devices are prepared depending on the final required voltage resistance, and the male-threaded anode electrode and female-threaded cathode electrode of adjacent high-voltage semiconductor devices are sequentially screwed together and connected at the same time. It is also possible to obtain a high voltage rectifier stack with a desired withstand voltage by electrically connecting them in series and stacking them in multiple stages.

As such a conventional example, there is one described in Japanese Utility Model Publication No. 57-30863, which will be explained with reference to FIG.

Reference numeral 1 denotes a bowl-shaped molded case made of an insulating material such as synthetic resin and having an arcuately curved cross section, and a male-threaded anode electrode 2 is inserted through the bottom center of the case 1. attached,
The male threaded portion protrudes outward from the bowl, that is, downward in the drawing. Further, a stepped portion 3 is formed at the periphery of the opening of the case 1. Reference numeral 4 denotes a Y-shaped bridging piece that is fitted and held at three points on the stepped portion 3 of the case 1, and bridges the opening of the case 1 through its center.

A female threaded cathode electrode 5 is fitted into the center of the bridging piece 4 with the screw hole facing upward in the drawing. That is, the Y-shaped bridging piece 4 connects the anode electrode 2
and cathode electrodes 5 are aligned along central portions B and B' of case 1. A plurality of rectifying elements 6 are connected in series between the electrodes 2 and 5, and a surge absorbing capacitor 7 is connected in parallel to each rectifying element 6. Note that in the drawing, all of the rectifying element 6 and capacitor 7 are not shown for the sake of simplicity. Furthermore, 8 is a synthetic resin molding agent such as an epoxy resin filled into the space of the case 1 to a level reaching the bridging piece 4 .

[Problem that the invention attempts to solve]

This conventional example has the following drawbacks.

(1) In order to reduce the dimensional error when multiple high voltage rectifier modules are connected in series, case 1
The center alignment of the electrode 2 of the bridge piece 4 and the electrode 5 of the bridging piece 4 must be performed with a sufficiently high precision.
This was one of the reasons for the increase in costs.

(2) Also, bridging pieces when the mold resin hardens,
Deformation of the case may reduce the dimensional accuracy.

(3) Since the electrode 2 is fixed to the case 1 in advance, and the electrode 5 is similarly fixed to the bridging piece 4,
It is difficult to solder the terminals at both ends of the series connection body of the rectifying element 6 and the surge absorbing capacitor 7 to the electrodes 2 and 5, respectively, and since the bridging piece 4 is present, it is difficult to solder the terminals at both ends of the series connection body of the rectifying element 6 and the surge absorbing capacitor 7 to the electrodes 2 and 5, respectively. It was difficult to arrange series connections, and this sometimes became a factor in reducing the withstand voltage.

(4) Furthermore, since the molding resin such as epoxy resin is filled into the case 1 with the bridging piece 4 positioned on the upper surface of the case 1, the bridging piece 4 becomes an obstruction and reduces work efficiency. This negative effect is particularly noticeable in the case of automation. Furthermore, if the bridging piece 4 is displaced on the way, the product will be defective.

[Means for solving problems]

A pair of screw-shaped electrodes facing each other in the center of the case are integrally molded with an insulating support column in advance, and these are arranged in the center of the case.

[Effect]

When molding the support column with insulating material, a pair of male and female threaded electrodes are also molded together.
By screwing the male threaded electrodes onto a fixed base pre-prepared at the center of the bottom of the case, the pair of electrodes can be fixed to the case with extremely high centering accuracy and spacing accuracy. The manufacturing process is simplified because the pair of male and female threaded electrodes can be handled separately from the case.

〔Example〕

An embodiment of a high voltage semiconductor device according to the present invention will be described with reference to FIGS. 1A and 1B and FIG. 2.

In FIG. 1, A is a top view of the high voltage semiconductor device, and B is a cross section taken along line X-X'. Further, in the figure, the same symbols as those explained in FIG. 3 indicate the same members. The electrode support 10 is preferably made of an insulating material such as a specific plastic resin, which has a higher dielectric strength than a mold resin such as an epoxy resin, and has high adhesion to the mold resin. The male threaded electrode 2 and the female threaded electrode 5 are integrated when molding this electrode support 10. The head 2a of the male threaded electrode 2 is embedded in one end of the electrode support 10, and the embedded portion 5a of the female threaded electrode 5 is embedded in the other end of the electrode support 10. At this time, a portion of the extraction electrode 12 that has been fixed in advance to the portion 5a of the female threaded electrode 5 by soldering or the like is also buried. As a matter of course, a jig (not shown) is used to set the center lines L of the threaded electrodes 2 and 5 to coincide with each other. Further, the electrode support 10 has a plurality of annular protrusions 10a on its outer surface so as to increase its creeping distance.

Such an electrode support 10 and screw-shaped electrodes 2, 5
The integrally molded product is the threaded part 2b of the male threaded electrode 2.
It is fixed at the center of the case 1 by screwing it into the threaded part of the metal fixing base 11 arranged at the center of the case 1. At this time, the threaded portion 2b of the male threaded electrode 2 is passed through the annular portion 13a of the other extracted electrode 13, and the threaded portion 2b of the male threaded electrode 2 is screwed onto the fixed base 11 as described above. 13 is fixed inside the case 1. Thereafter, six groups of rectifying elements connected in series are arranged around the pillar 10, and the outermost cathode lead wire and anode lead wire are soldered to the lead electrodes 12 and 13, respectively, and the molded resin 8 is soldered. Resin molding is performed.

In this case, in the configuration of the present invention, both ends of the 6 groups of rectifying elements connected in series are soldered to the lead electrodes 12 and 13, respectively, and then the threaded portion 2b of the male threaded electrode 2 is screwed to the fixed base 11. This soldering work can be performed outside the case 1.

[Effect of idea]

As described above, the present invention has the following effects.

(1) Since the male threaded electrode 2 and the female threaded electrode 5 are integrated when molding the electrode support 10, highly accurate center alignment can be easily performed using a jig.
It is also less susceptible to the effects of stress during curing of the mold resin.

Therefore, dimensional accuracy can be improved when a plurality of high voltage semiconductor devices are connected in series.

(2) A pair of screw-shaped electrodes can be treated as a single unit, so
All soldering work can be done outside the case, thus improving work ability.

(3) By constructing the electrode support using an insulating material with high dielectric strength and molded resin, the distance between the electrodes can be reduced, making the case even thinner and making it possible to downsize the high voltage rectifier stack. Become.

(4) Since the conventional bridging piece is not required, it becomes easy to inject the molding resin into the case.

[Brief explanation of the drawing]

1A and 1B are diagrams showing an embodiment of a high voltage semiconductor device according to the present invention, FIG. 2 is a diagram showing an electrode support and related parts used in the high voltage semiconductor device according to the present invention, and FIG. The figures show a conventional example, in which A shows a top view, B shows a bottom view, and C shows a sectional view. DESCRIPTION OF SYMBOLS 1... Case, 2... Male threaded electrode, 5... Female threaded electrode, 6... Rectifier, 8... Molded resin, 10...
Electrode support column, 11... Fixed base, 12, 13...
Extraction electrode.

Claims (1)

[Scope of utility model registration request] A molding case made of an insulating material, a male or female threaded electrode located at the center of the bottom of the case, a female or male threaded electrode located to face the electrode, and connected in series to both of the electrodes. A high voltage semiconductor device comprising a series connection body of a plurality of rectifying elements connected to each other and housed in the case, wherein both screw-shaped electrodes are integrally fixed to an electrode support made of an insulating material. A high voltage semiconductor device characterized by: