JPH0351849U - - Google Patents
Info
- Publication number
- JPH0351849U JPH0351849U JP1989112645U JP11264589U JPH0351849U JP H0351849 U JPH0351849 U JP H0351849U JP 1989112645 U JP1989112645 U JP 1989112645U JP 11264589 U JP11264589 U JP 11264589U JP H0351849 U JPH0351849 U JP H0351849U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- land portion
- arrangement
- pellet
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000008188 pellet Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989112645U JPH0741164Y2 (ja) | 1989-09-26 | 1989-09-26 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989112645U JPH0741164Y2 (ja) | 1989-09-26 | 1989-09-26 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0351849U true JPH0351849U (US20100268047A1-20101021-C00003.png) | 1991-05-20 |
JPH0741164Y2 JPH0741164Y2 (ja) | 1995-09-20 |
Family
ID=31661088
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989112645U Expired - Lifetime JPH0741164Y2 (ja) | 1989-09-26 | 1989-09-26 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0741164Y2 (US20100268047A1-20101021-C00003.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012108011A1 (ja) * | 2011-02-09 | 2012-08-16 | 三菱電機株式会社 | パワー半導体モジュール |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109194153A (zh) | 2010-11-02 | 2019-01-11 | 三菱电机株式会社 | 电动式动力转向用电源模块及使用其的电动式动力转向驱动控制装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63151055A (ja) * | 1986-12-16 | 1988-06-23 | Matsushita Electronics Corp | 複合型半導体装置 |
JPS63255953A (ja) * | 1987-04-13 | 1988-10-24 | Sanken Electric Co Ltd | 絶縁物封止型回路装置 |
-
1989
- 1989-09-26 JP JP1989112645U patent/JPH0741164Y2/ja not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63151055A (ja) * | 1986-12-16 | 1988-06-23 | Matsushita Electronics Corp | 複合型半導体装置 |
JPS63255953A (ja) * | 1987-04-13 | 1988-10-24 | Sanken Electric Co Ltd | 絶縁物封止型回路装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012108011A1 (ja) * | 2011-02-09 | 2012-08-16 | 三菱電機株式会社 | パワー半導体モジュール |
JP5669866B2 (ja) * | 2011-02-09 | 2015-02-18 | 三菱電機株式会社 | パワー半導体モジュール |
US9129949B2 (en) | 2011-02-09 | 2015-09-08 | Mitsubishi Electric Corporation | Power semiconductor module |
Also Published As
Publication number | Publication date |
---|---|
JPH0741164Y2 (ja) | 1995-09-20 |