JPH0351833B2 - - Google Patents
Info
- Publication number
- JPH0351833B2 JPH0351833B2 JP63007353A JP735388A JPH0351833B2 JP H0351833 B2 JPH0351833 B2 JP H0351833B2 JP 63007353 A JP63007353 A JP 63007353A JP 735388 A JP735388 A JP 735388A JP H0351833 B2 JPH0351833 B2 JP H0351833B2
- Authority
- JP
- Japan
- Prior art keywords
- synthetic resin
- layer
- vinyl chloride
- flooring material
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920003002 synthetic resin Polymers 0.000 claims description 203
- 239000000057 synthetic resin Substances 0.000 claims description 203
- 239000000463 material Substances 0.000 claims description 120
- 239000000203 mixture Substances 0.000 claims description 112
- 238000009408 flooring Methods 0.000 claims description 88
- 239000007788 liquid Substances 0.000 claims description 64
- 239000000853 adhesive Substances 0.000 claims description 22
- 230000001070 adhesive effect Effects 0.000 claims description 22
- 238000000576 coating method Methods 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 9
- 239000010410 layer Substances 0.000 description 162
- 229920005989 resin Polymers 0.000 description 72
- 239000011347 resin Substances 0.000 description 72
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 67
- 239000000839 emulsion Substances 0.000 description 50
- 238000010438 heat treatment Methods 0.000 description 44
- 150000001875 compounds Chemical class 0.000 description 38
- 238000000034 method Methods 0.000 description 35
- 238000010894 electron beam technology Methods 0.000 description 31
- 239000004014 plasticizer Substances 0.000 description 25
- 239000011256 inorganic filler Substances 0.000 description 22
- 239000012766 organic filler Substances 0.000 description 20
- 229920006174 synthetic rubber latex Polymers 0.000 description 19
- 238000004132 cross linking Methods 0.000 description 18
- 238000007639 printing Methods 0.000 description 17
- 239000000843 powder Substances 0.000 description 16
- 239000003381 stabilizer Substances 0.000 description 16
- 239000006260 foam Substances 0.000 description 15
- 239000000126 substance Substances 0.000 description 14
- 239000000835 fiber Substances 0.000 description 12
- 239000000945 filler Substances 0.000 description 12
- 238000005187 foaming Methods 0.000 description 12
- 239000004088 foaming agent Substances 0.000 description 12
- 238000009472 formulation Methods 0.000 description 12
- -1 Phthalate ester Chemical class 0.000 description 11
- 239000000123 paper Substances 0.000 description 11
- 239000003504 photosensitizing agent Substances 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 239000010425 asbestos Substances 0.000 description 10
- 238000010276 construction Methods 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 229910052895 riebeckite Inorganic materials 0.000 description 10
- 229920003051 synthetic elastomer Polymers 0.000 description 10
- 239000005061 synthetic rubber Substances 0.000 description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 9
- 229920000126 latex Polymers 0.000 description 9
- 239000004816 latex Substances 0.000 description 9
- 239000004034 viscosity adjusting agent Substances 0.000 description 9
- 235000019504 cigarettes Nutrition 0.000 description 8
- 239000003086 colorant Substances 0.000 description 8
- 229920001577 copolymer Polymers 0.000 description 8
- 238000004049 embossing Methods 0.000 description 8
- 229920003023 plastic Polymers 0.000 description 8
- 239000004033 plastic Substances 0.000 description 8
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 8
- 239000005038 ethylene vinyl acetate Substances 0.000 description 7
- 239000003365 glass fiber Substances 0.000 description 7
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 7
- 229910052753 mercury Inorganic materials 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000011162 core material Substances 0.000 description 6
- 239000003431 cross linking reagent Substances 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 239000004745 nonwoven fabric Substances 0.000 description 6
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 5
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 5
- 239000003054 catalyst Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 229910003475 inorganic filler Inorganic materials 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 229920001944 Plastisol Polymers 0.000 description 4
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 239000004999 plastisol Substances 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000003505 polymerization initiator Substances 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000002344 surface layer Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- ARCGXLSVLAOJQL-UHFFFAOYSA-N anhydrous trimellitic acid Natural products OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000004872 foam stabilizing agent Substances 0.000 description 3
- 238000007646 gravure printing Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 125000005395 methacrylic acid group Chemical group 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 2
- NIQCNGHVCWTJSM-UHFFFAOYSA-N Dimethyl phthalate Chemical compound COC(=O)C1=CC=CC=C1C(=O)OC NIQCNGHVCWTJSM-UHFFFAOYSA-N 0.000 description 2
- GUUVPOWQJOLRAS-UHFFFAOYSA-N Diphenyl disulfide Chemical compound C=1C=CC=CC=1SSC1=CC=CC=C1 GUUVPOWQJOLRAS-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229920006243 acrylic copolymer Polymers 0.000 description 2
- 150000005215 alkyl ethers Chemical class 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000000440 bentonite Substances 0.000 description 2
- 229910000278 bentonite Inorganic materials 0.000 description 2
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 239000004202 carbamide Substances 0.000 description 2
- 239000001913 cellulose Substances 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 description 2
- MGWAVDBGNNKXQV-UHFFFAOYSA-N diisobutyl phthalate Chemical compound CC(C)COC(=O)C1=CC=CC=C1C(=O)OCC(C)C MGWAVDBGNNKXQV-UHFFFAOYSA-N 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000002612 dispersion medium Substances 0.000 description 2
- KWKXNDCHNDYVRT-UHFFFAOYSA-N dodecylbenzene Chemical class CCCCCCCCCCCCC1=CC=CC=C1 KWKXNDCHNDYVRT-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 2
- 239000004533 oil dispersion Substances 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 239000002984 plastic foam Substances 0.000 description 2
- 239000011120 plywood Substances 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 238000010022 rotary screen printing Methods 0.000 description 2
- 239000000344 soap Substances 0.000 description 2
- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000002562 thickening agent Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- WRXCBRHBHGNNQA-UHFFFAOYSA-N (2,4-dichlorobenzoyl) 2,4-dichlorobenzenecarboperoxoate Chemical compound ClC1=CC(Cl)=CC=C1C(=O)OOC(=O)C1=CC=C(Cl)C=C1Cl WRXCBRHBHGNNQA-UHFFFAOYSA-N 0.000 description 1
- JMYZLRSSLFFUQN-UHFFFAOYSA-N (2-chlorobenzoyl) 2-chlorobenzenecarboperoxoate Chemical compound ClC1=CC=CC=C1C(=O)OOC(=O)C1=CC=CC=C1Cl JMYZLRSSLFFUQN-UHFFFAOYSA-N 0.000 description 1
- NJVOHKFLBKQLIZ-UHFFFAOYSA-N (2-ethenylphenyl) prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1C=C NJVOHKFLBKQLIZ-UHFFFAOYSA-N 0.000 description 1
- XMNDMAQKWSQVOV-UHFFFAOYSA-N (2-methylphenyl) diphenyl phosphate Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C=CC=CC=1)OC1=CC=CC=C1 XMNDMAQKWSQVOV-UHFFFAOYSA-N 0.000 description 1
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- KDGNCLDCOVTOCS-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy propan-2-yl carbonate Chemical compound CC(C)OC(=O)OOC(C)(C)C KDGNCLDCOVTOCS-UHFFFAOYSA-N 0.000 description 1
- LNAZSHAWQACDHT-XIYTZBAFSA-N (2r,3r,4s,5r,6s)-4,5-dimethoxy-2-(methoxymethyl)-3-[(2s,3r,4s,5r,6r)-3,4,5-trimethoxy-6-(methoxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6r)-4,5,6-trimethoxy-2-(methoxymethyl)oxan-3-yl]oxyoxane Chemical compound CO[C@@H]1[C@@H](OC)[C@H](OC)[C@@H](COC)O[C@H]1O[C@H]1[C@H](OC)[C@@H](OC)[C@H](O[C@H]2[C@@H]([C@@H](OC)[C@H](OC)O[C@@H]2COC)OC)O[C@@H]1COC LNAZSHAWQACDHT-XIYTZBAFSA-N 0.000 description 1
- KEOLYBMGRQYQTN-UHFFFAOYSA-N (4-bromophenyl)-phenylmethanone Chemical compound C1=CC(Br)=CC=C1C(=O)C1=CC=CC=C1 KEOLYBMGRQYQTN-UHFFFAOYSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- NALFRYPTRXKZPN-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane Chemical compound CC1CC(C)(C)CC(OOC(C)(C)C)(OOC(C)(C)C)C1 NALFRYPTRXKZPN-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 1
- UBRWPVTUQDJKCC-UHFFFAOYSA-N 1,3-bis(2-tert-butylperoxypropan-2-yl)benzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC(C(C)(C)OOC(C)(C)C)=C1 UBRWPVTUQDJKCC-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- UICXTANXZJJIBC-UHFFFAOYSA-N 1-(1-hydroperoxycyclohexyl)peroxycyclohexan-1-ol Chemical compound C1CCCCC1(O)OOC1(OO)CCCCC1 UICXTANXZJJIBC-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- YEVQZPWSVWZAOB-UHFFFAOYSA-N 2-(bromomethyl)-1-iodo-4-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=CC=C(I)C(CBr)=C1 YEVQZPWSVWZAOB-UHFFFAOYSA-N 0.000 description 1
- SFRDXVJWXWOTEW-UHFFFAOYSA-N 2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)CO SFRDXVJWXWOTEW-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- DZZAHLOABNWIFA-UHFFFAOYSA-N 2-butoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCCCC)C(=O)C1=CC=CC=C1 DZZAHLOABNWIFA-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- RZCDMINQJLGWEP-UHFFFAOYSA-N 2-hydroxy-1,2-diphenylpent-4-en-1-one Chemical compound C=1C=CC=CC=1C(CC=C)(O)C(=O)C1=CC=CC=C1 RZCDMINQJLGWEP-UHFFFAOYSA-N 0.000 description 1
- DIVXVZXROTWKIH-UHFFFAOYSA-N 2-hydroxy-1,2-diphenylpropan-1-one Chemical compound C=1C=CC=CC=1C(O)(C)C(=O)C1=CC=CC=C1 DIVXVZXROTWKIH-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- PZBLUWVMZMXIKZ-UHFFFAOYSA-N 2-o-(2-ethoxy-2-oxoethyl) 1-o-ethyl benzene-1,2-dicarboxylate Chemical compound CCOC(=O)COC(=O)C1=CC=CC=C1C(=O)OCC PZBLUWVMZMXIKZ-UHFFFAOYSA-N 0.000 description 1
- YJERZJLSXBRUDQ-UHFFFAOYSA-N 2-o-(3,4-dihydroxybutyl) 1-o-methyl benzene-1,2-dicarboxylate Chemical compound COC(=O)C1=CC=CC=C1C(=O)OCCC(O)CO YJERZJLSXBRUDQ-UHFFFAOYSA-N 0.000 description 1
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- ALKCLFLTXBBMMP-UHFFFAOYSA-N 3,7-dimethylocta-1,6-dien-3-yl hexanoate Chemical compound CCCCCC(=O)OC(C)(C=C)CCC=C(C)C ALKCLFLTXBBMMP-UHFFFAOYSA-N 0.000 description 1
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- 239000001384 succinic acid Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000012749 thinning agent Substances 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
- URAYPUMNDPQOKB-UHFFFAOYSA-N triacetin Chemical compound CC(=O)OCC(OC(C)=O)COC(C)=O URAYPUMNDPQOKB-UHFFFAOYSA-N 0.000 description 1
- 229960002622 triacetin Drugs 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- 229960001147 triclofos Drugs 0.000 description 1
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000005335 volcanic glass Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
Landscapes
- Floor Finish (AREA)
- Synthetic Leather, Interior Materials Or Flexible Sheet Materials (AREA)
- Laminated Bodies (AREA)
Description
(産業上の利用分野)
本発明は積層床材に関し、更に詳しくは通常の
接着剤の使用により施工容易で、実用に耐え、尚
且つ、床材の貼り替え時に容易に剥離可能な積層
床材に関するものである。
(従来技術)
従来、この種の積層床材は、美麗で清潔であ
り、維持管理が簡単な上に価格が低兼で、耐摩耗
性、耐薬品性等が良いので、店舗や一般家庭の床
にかなり使用されている。この床材は、中間層に
軟質合成樹脂層を設けその表面には軟質合成樹脂
上引層を、裏面には基材としてアスベストシート
を各々積層した構造となつている。この床材を通
常の接着剤にて施工し、実用に供した後、床材を
貼り替える際に、裏面のアスベストが下地面に部
分的に多量に残着する為、下地に凹凸を生じ、そ
のままの状態では床材を施工することが困難とな
り、床材を再施工する場合には非常な手間をかけ
て下地面に多層に残着したアスベストを除去しな
ければならないという大きな欠点があつた。
また従来よりこの種の床材としては長繊維不織
布からなる芯材層の表面側に軟質プラスチツクフ
オームの中間層とさらにその上に軟質プラスチツ
クフイルムからなる表面層を結着形成せしめ、前
記芯材層の裏面に充填材を多量に混入した密組織
の軟質プラスチツク層を接合してなる積層床材に
関する特公昭47−41848号公報及び紙若しくは不
織布を主材とするベースの表面に合成樹脂等を以
て表層を形成してなる床、壁材等のベースの裏面
に剥離材の層を形成させるという思想に基づく特
開昭51−99821号、実開昭51−105221号、実開昭
51−107902号、実開昭51−137930号、実開昭51−
137931号の各公報等が知られている。
しかしながら、特公昭47−41848号公報の積層
床材においては、長繊維不織布からなる芯材層を
基材としその表面に軟質プラスチツクフオームの
中間層とその上に軟質プラスチツクフイルムの表
面層を有する積層体の裏面(芯材層の裏面)に充
填材を多量に混入した密組織の軟質プラスチツク
層を接合することを特徴としているが、この場合
には、まず第1に該積層体の芯材層の裏面に充填
剤を多量に混入した密組織の軟質プラスチツク層
を接合する為、該密組織の軟質プラスチツク層は
芯材層を構成する長繊維不織布の表面部分におい
てのみ接合され、両者が完全に一体化されない
為、床材の上を人が歩行したり、床材上で重量物
を引きずつたり、又、キヤスター付きのイス等で
局部的にくり返し荷重をかけたりした場合、前記
接合面で層間剥離を起こしてしまうこと、さら
に、第2に前記芯材層の裏面に充填剤を多量に混
入した密組織の軟質プラスチツク層を接合する際
にしわ等の発生を防止する為、該密組織の軟質プ
ラスチツク層に張力をかける必要があり、この張
力により該密組織の軟質プラスチツク層は内部歪
を持つた状態で芯材層と接合されることとなり、
この内部歪を為床材が経時的に収縮し、床材の寸
法安定性を著しく悪化させてしまうこと等の問題
があつた。
又、特開昭51−99821号、実開昭51−105221号、
実開昭51−107902号、実開昭51−137930号、実開
昭51−137931号の各公報においては、紙若しくは
不織布を主材とするベースの表面に合成樹脂等を
以て表層を形成してなる床、壁材等のベースの裏
面に剥離剤の層を形成させることを特徴としてい
るが、この場合には、該ベース裏面の剥離剤の層
と床材を施工するのに使用する接着剤とが基本的
に接着しない為、床材を剥離する際には非常に簡
単に剥離可能であるが、剥離容易であるが故に床
材の上を歩行したり、床材上で重量物を引きずつ
たり、又、キヤスター付きのイス等で局部的にく
り返し荷重をかけたりした場合に、剥離剤の層と
接着剤層の界面で剥離を起こしてしまい、実用上
大きな問題があつた。
(問題点を解決するための手段)
本発明はこれら従来の欠点を解消し、実用時の
剥れ等の問題がなく十分実用に耐え、かつ床材の
貼り替え時には下地側接着剤に貼り替えに何ら支
障のない程度の薄層を残着させて層破壊する様な
層を有する再施工容易な床材を提供せんとするも
のである。すなわち、本発明の床材は、繊維質基
材の片側に液状合成樹脂組成物を塗布含浸しこれ
を固化してなる厚味0.5m/m以下の耐熱性合成
樹脂層を有し、他の片側に軟質合成樹脂中間層と
軟質合成樹脂上引層が順次積層されてなる積層床
材であつて、
前記耐熱性合成樹脂層は、積層床材を下地より
剥離する際に、下地側接着剤に薄層を残着させて
層破壊する性質の層であることを特徴とする。
本発明の積層床材は繊維質基材1に液状合成樹
脂組成物を塗布含浸し、加熱、紫外線照射又は電
子線照射の固化手段の1又は2以上によつて耐熱
性合成樹脂層2を形成し、該液状合成樹脂組成物
の塗布面と反対側の繊維質基材の面に軟質合成樹
脂中間層3をカレンダー法、押出法、ペーストコ
ーテイング法等で積層し、この表面に必要に応じ
て、グラビア印刷法、フレキソ印刷法、ロータリ
ースクリーン印刷法、転写印刷法等で印刷して印
刷層5を形成し、さらに、この表面に軟質合成樹
脂上引層4を、カレンダー法、押出法、ペースト
コーデイング法等で積層することによつて得られ
るものである。上記した固化手段の1つである加
熱は公知の加熱方法を用いることで差支えない
が、例えば、電気ヒーター、赤外線ヒーター、熱
風吹きつけ、エロフイン、蒸気噴射、高周波誘導
加熱、高周波誘電加熱等を挙げることができる。
上記した樹脂積層方法のうちペーストコーテイン
グ法が一般的であり、ここではペーストコーテイ
ング法による床材の製造方法について記載する。
繊維質基材1に液状合成樹脂組成物を塗布含浸
し、50℃〜250℃にて30秒〜15分間加熱し、該液
状合成樹脂組成物を固化せしめた後、必要に応じ
て、紫外線又は電子線を照射し耐熱性合成樹脂層
2を形成し、該液状合成樹脂組成物の塗布面と反
対側の面に塩化ビニル樹脂プラスチゾルを塗布
し、120℃〜250℃にて30秒〜5分間加熱し、軟質
合成樹脂中間層3を形成し、しかる後、塩化ビニ
ル樹脂プラスチゾルを塗布し、150℃〜250℃にて
30秒〜5分間加熱し、該塩化ビニル樹脂プラスチ
ゾルを熔融した後、必要に応じて、エンボス加工
を行い、その後必要に応じて、紫外線又は電子線
照射を行なうものである。床材の意匠性という点
から前記軟質合成樹脂中間層3に任意の模様を印
刷した印刷層5を形成した方が好ましい。任意の
模様を印刷する方法としては、グラビア印刷法、
フレキソ印刷法、ロータリースクリーン印刷法
等、印刷インキを軟質合成樹脂中間層表面に直接
印刷しても良く、又転写紙に印刷インキを印刷し
たものを軟質合成樹脂中間層3表面に転写しても
良い。さらに印刷のみではなく、印刷とエンボス
の双方を行なうことも出来、この際には印刷とエ
ンボスを同時に施す谷染エンボスや頭汚し印刷を
行なうことも出来る。又軟質合成樹脂中間層3を
化学発泡剤にて発泡する場合には、印刷層5の絵
柄の一部を発泡仰制剤及び/又は発泡促進剤を配
合したインキにて印刷することにより、ケミカル
エンボスも可能である。又、印刷層5の絵柄の一
部を発泡性インキ及び/又は非発泡性インキにて
印刷することにより、印刷と凹凸を同調させるこ
とも出来る。
前記液状合成樹脂組成物を繊維質基材1に塗布
含浸する手段としては、一般に使用されている方
法なら何でも良く、ナイフコーター、ロールコー
ター、グラビアプリンター、ロータリースクリー
ン、カーテンフローコーター、デイツピング等の
使用が好ましい。ガラス繊維の密度の低い(目の
粗い)ガラスペーパー等の繊維質基材1に薄く均
一に液状合成樹脂組成物を塗布する場合にはガラ
スペーパーの裏面への液状合成樹脂組成物のしみ
出しのない点でグラビアプリンター、ロールコー
ターやロータリースクリーン等が適している。
又、液状合成樹脂組成物の粘度は繊維質基材1
の繊維の密度と塗布方法により適宜粘度調整をす
ることが必要である。一例を挙げると、繊維密度
の高い繊維質基材1、例えばアスベストシートの
如きものの場合は、液状合成樹脂組成物の粘度は
低いものから高いものまで適用出来、各塗布方法
に応じてその適正粘度範囲に粘度調整すれば良い
が、繊維密度の高くないもの、例えばガラス繊維
紙でガラス繊維の密度が約0.12g/c.c.程度の繊維
質基材1に液状合成樹脂組成物をナイフコーター
にて塗布する場合は、該液状合成樹脂組成物の粘
度を約10000cps〜500000cpsに調整することが好
ましい。又繊維密度の低い(目の粗い)繊維質基
材1を使用する場合で、上記液状合成樹脂組成物
を塗布しても、該液状合成樹脂組成物の含浸が不
充分である場合に、該液状合成樹脂組成物の塗布
面と反対側の面に軟質合成樹脂中間層3を積層す
ると、積層界面に気泡が入り、これを発泡すると
気泡の影響で異常発泡を生じることがあるが、こ
の様な場合には、液状合成樹脂組成物の塗布面の
反対側の面を、例えば塩化ビニル樹脂ペースト等
で目止めをするか、又は、繊維質基材1に液状合
成樹脂組成物を塗布、乾燥後に加熱し、ロール間
で圧縮し積層面を平滑にしてから軟質合成樹脂中
間層3を積層するのが好ましい。
なお、床材が実用時に剥離しない程度に下地と
接着し、且つ、床材を剥離する際には、前記床材
の裏面の耐熱性合成樹脂層2の破壊により耐熱性
合成樹脂層2の薄層が接着剤と共に下地に残る様
な形で剥離する為の耐熱性合成樹脂層2と接着剤
層との接着強度又は耐熱性合成樹脂層2の破壊に
よる層間剥離強度は、0.3〜5Kg/2cm幅である
ことが好ましい。この接着強度又は層間剥離強度
が0.3Kg/2cm幅未満である場合は、下地との接
着強度が弱すぎて実用時に剥離を起こしてしま
い、又、接着強度又は層間剥離強度が5Kg/2cm
幅を越えると床材を下地より剥離するのが困難と
なるものである。
●繊維質基材
本発明に使用する繊維質基材1としては、フエ
ルト状シート、織布、編布、不織布等の寸法安定
性に優れたものであれば単層のものでも2層以上
の複層のものでも使用出来るが、特に寸法安定性
の面からアスベストシート、アスベスト、ガラス
繊維、紙、ポリエステル繊維等の無機及び/又は
有機繊維の少なくとも2種以上を混合したシー
ト、ガラス繊維紙、紙等が好ましい。
●耐熱性合成樹脂層
<液状合成樹脂組成物>
本発明に使用する耐熱性合成樹脂層2を形成す
るための液状合成樹脂組成物としては、軟質合成
樹脂中間層3、軟質合成樹脂上引層4等の積層加
工において、加熱炉内の熱された状態にある支持
体に接触しても、これに粘着しない程度の耐熱性
と、さらに、通常の床材施工用の接着剤を使用し
て床材を加工した後も実用時に剥離を起こさない
程度に接着し、そして床材を剥離する際に前記耐
熱性合成樹脂層2の破壊による層間剥離を起こさ
せるものであれば何でも使用出来る。
本発明に使用する耐熱性合成樹脂層2を形成す
るための液状合成樹脂組成物としては、次の様な
ものが好ましいが、本発明は何らこれに制限され
るものではない。
塩化ビニルペーストに多量の耐熱性に優れた
無機質及び/又は有機質の充填剤を配合した組
成物
塩化ビニルペーストに紫外線照射又は電子線
照射等の手段により架橋する化合物を配合した
組成物
非反応型の合成樹脂エマルジヨン又は非反応
型の合成ゴムラテツクス等の反応性のない液状
組成物に多量の耐熱性に優れた無機質及び/又
は有機質の充填剤を配合した組成物
非反応型の合成樹脂エマルジヨン又は非反応
型の合成ゴムラテツクス等の反応性のない液状
組成物に加熱にて架橋する合成物を配合した組
成物
非反応型の合成樹脂エマルジヨン又は非反応
型の合成ゴムラテツクス等の反応性のない液状
組成物に紫外線照射又は電子線照射等の手段に
より架橋する化合物を配合した組成物
反応型の合成樹脂エマルジヨン又は反応型の
合成ゴムラテツクス等の反応性液状組成物
加熱により架橋する化合物よりなる液状組成
物
紫外線照射又は電子照射により架橋する化合
物よりなる液状組成物
耐熱性合成樹脂層2を形成するための液状合成
樹脂組成物が、の組成物の場合、この塩化ビニ
ル樹脂ペースト組成物は、塩化ビニル樹脂100重
量部に対して可塑剤30〜130重量部、安定剤適当
量、耐熱性に優れた無機質及び/又は有機質の充
填剤50〜400重量部、及び、必要に応じて、粘度
調整剤、着色剤等の適当量から成る。可塑剤量が
塩化ビニル樹脂100重量部に対して30重量部未満
である場合には、耐熱性合成樹脂層2が硬くなり
すぎ特に低温特性が悪くなる為、冬期における施
工が困難となり好ましくない。又、可塑剤量が塩
化ビニル樹脂100重量部に対し130重量部を越える
と、耐熱性合成樹脂層2のベタツキがひどくなる
ばかりでなく、特に合成ゴムラテツクス系の接着
剤にて施工した場合、可塑剤が合成ゴムの接着剤
層へ多量に移行し、接着力が著しく低下する為、
実用時における床材の反り、剥れ等の問題を生じ
好ましいものではない。
耐熱性に優れた無機質及び/又は有機質の充填
剤の量が、塩化ビニル樹脂100重量部に対して50
重量部未満である場合には、耐熱性合成樹脂層2
が加熱炉内の熱された状態にある支持体に粘着
し、所期の目的を達成出来ないものである。又、
耐熱性に優れた無機質及び/又は有機質の充填剤
の量が塩化ビニル樹脂100重量部に対して400重量
部を越えると、該充填剤量が多くなりすぎ耐熱性
合成樹脂層2がもろくなり、床材を施工する際に
床材が折れ易くなつてしまうため好ましいもので
はない。耐熱性に優れた無機質及び/又は有機質
の充填剤で粒径の大きなもの程、比較的少量の添
加で加熱炉内の熱された状態にある支持体への粘
着防止に効果がある。これは粒径の大きなもの
程、耐熱性合成樹脂層2の表面を粗化し、熱され
た状態にある支持体への接触面積を小さくするこ
と、及び、該耐熱性合成樹脂層2の表面に前記粒
径の大きな耐熱性に優れた無機質及び/又は有機
質の充填剤が配列し、これが熱された状態にある
支持体との粘着を防止すること等の理由によると
考えられる。
耐熱性合成樹脂層2を形成するための液状合成
樹脂組成物が、、の組成物の場合、塩化ビニル
樹脂ペースト組成物は、塩化ビニル樹脂100重量
部に対して可塑剤10〜100重量部、紫外線照射又
は電子線照射等により架橋する化合物0.5〜100重
量部、安定剤適当量、及び、必要に応じて、重合
開始剤、光増感剤、触媒、粘度調整剤、着色剤、
整泡剤、発泡剤、耐熱性に優れた無機質及び/又
は有機質の充填剤等の適当量から成るものであ
る。可塑剤量が塩化ビニル樹脂100重量部に対し
て10重量部未満である場合には、耐熱性合成樹脂
層2が硬くなりすぎ、特に低温特性が悪くなる
為、冬期における施工が困難となり好ましくな
い。又、可塑剤量が塩化ビニル樹脂100重量部に
対して、100重量部を越えると、耐熱性合成樹脂
層2のベタツキがひどくなるばかりでなく、特に
合成ゴムラテツクス系の接着剤にて施工した場
合、可塑剤が合成ゴムの接着層へ多量に移行し、
接着力が著しく低下する為、実用時における床剤
の反り、剥がれ等の問題を生じ、好ましいもので
はない。紫外線照射又は電子線照射等の手段によ
り架橋する化合物の量が塩化ビニル樹脂100重量
部に対して0.5重量部未満である場合には、架橋
度が低く加熱炉内の熱された状態にある支持対に
粘着し所期の目的を達成出来ないものである。
又、紫外線照射又は電子線照射等により架橋する
化合物の量が塩化ビニル樹脂100重量部に対して
100重量部を越えると、架橋度が高くなりすぎ耐
熱性合成樹脂層2が硬くもろくなり、実用性にと
ぼしいものとなる。
耐熱性合成樹脂層2を形成するための液状合成
樹脂組成物が、の組成物の場合、この合成樹脂
エマルジヨン、合成ゴムラテツクス等の液状組成
物は該エマルジヨンやラテツクスに含まれる合成
樹脂や合成ゴムの100重量部に対して耐熱性に優
れた無機質及び/又は有機質の充填剤150〜950重
量部、及び、必要に応じて、粘度調整剤、着色剤
等の適当量から成る。耐熱性に優れた無機質及
び/又は有機質の充填剤の量が前記エマルジヨン
やラテツクスに含まれる合成樹脂や合成ゴムの
100重量部に対して150重量部未満である場合に
は、耐熱性合成樹脂層2が加熱炉内の熱された状
態にある支持体に粘着し、所期の目的を達成出来
ないものである。又、耐熱性に優れた有機質及
び/又は有機質の充填剤の量が前記エマルジヨン
やラテツクスに含まれる合成樹脂や合成ゴムの
100重量部に対して950重量部を越えると、耐熱性
合成樹脂層2がもろくなり床材を施工する際に床
材が折れ易くなつてしまうため好ましいものでは
ない。
耐熱性合成樹脂層2を形成するための液状合成
樹脂組成物が、、の組成物の場合、この液状
組成物は、それに含まれる合成樹脂や合成ゴムの
100重量部に対して、加熱又は紫外線照射又は電
子線照射等にて架橋する化合物10〜100重量部、
及び、必要に応じて、重合開始剤、光増感剤、触
媒、粘度調整剤、着色剤、整泡剤、、耐熱性に優
れた無機質及び/又は有機質の充填剤等の適当量
から成る。加熱又は紫外線照射又は電子線照射等
により架橋する化合物の量が前記反応性のない液
状組成物等に含まれる合成樹脂や合成ゴムの100
重量部に対して10重量部未満である場合には、耐
熱性合成樹脂層の架橋度が低く加熱炉内の熱され
た状態にある支持体に粘着し、所期の目的を達成
出来ないものである。又、加熱又は紫外線照射又
は電子線照射等の手段により架橋する化合物の量
が前記エマルジヨンやラテツクス等に含まれる合
成樹脂や合成ゴムの100重量部に対して100重量部
を越えると、架橋度が高くなりすぎ耐熱性合成樹
脂層2が硬くもろくなり、実用性にとぼしいもの
となる。又、耐熱性に優れた無機質及び/又は有
機質の充填剤の添加は、床施工用の接着剤に対す
る接着性を向上することもある。
耐熱性合成樹脂層2を形成するための液状合成
樹脂組成物が、の組成物の場合、この合成樹脂
エマルジヨン、合成ゴムラテツクス組成物は、該
エマルジヨンやラテツクスに、必要に応じて、架
橋剤、粘度調整剤、整泡剤、着色剤、耐熱剤に優
れた無機質及び/又は有機質の充填剤等の適当量
からなる。上記反応型の合成樹脂エマルジヨン、
合成ゴムラテツクス等が自己架橋性である場合
は、単独でも架橋し耐熱性合成樹脂層2を形成す
るが、さらに耐熱性を向上させる場合には、架橋
剤の添加が効果的である。又、耐熱性に優れた無
機質及び/又は有機質の充填剤の添加は床施工用
の接着剤に対する接着性を向上することもある。
耐熱性合成樹脂層を形成するための液状合成樹
脂組成物が、、の組成物の場合、この組成物
は、加熱又は紫外線照射又は電子照射等の手段に
より架橋する液状化合物に、必要に応じて、重合
開始剤、光増感剤、触媒、着色剤、耐熱性に優れ
た無機質及び/又は有機質の充填剤等の適当量か
ら成る。前記加熱又は紫外線照射又は電子線照射
等の手段により架橋する液状化合物への耐熱性に
優れた無機質及び/又は有機質の充填剤の添加
は、床施工用の接着剤に対する接着性を向上する
こともある。
<液状合成樹脂組成物の固化条件>
耐熱性合成樹脂層2を形成するための液状合成
樹脂組成物を固化する方法としては次の様な方法
が適当であるが、本発明は何らこれに制限される
ものではない。
の組成物の場合、液状合成樹脂組成物を120
℃〜180℃で30秒〜6分間予備加熱し、これを半
固化の状態にした後、180℃〜250℃で30秒〜5分
間加熱し、塩化ビニル樹脂を熔融せしめるかある
いは前記の予備加熱をせずに該液状合成樹脂組成
物を180℃〜250℃で30秒〜5分間加熱し、塩化ビ
ニル樹脂を熔融せしめるのが好ましい。
の組成物の場合も、前記の組成物の場合と
同様の条件で加熱し、塩化ビニル樹脂を熔融せし
めた後、紫外線又は電子線を照射して架橋せしめ
るのが良い。
の組成物の場合、液状合成樹脂組成物を50℃
〜180℃で30秒〜15分間加熱乾燥するのが好まし
い。
の組成物の場合、液状合成樹脂組成物を50℃
〜150℃で30秒〜15分間加熱乾燥した後100℃〜
200℃で30秒〜10分間加熱して架橋せしめるかあ
るいは該液状合成樹脂組成物を100℃〜200℃で30
秒〜15分間加熱して架橋せしめるのが好ましい。
エマルジヨンやラテツクスの場合、最初から高温
で加熱すると水分の影響により異常発泡を生じ易
いものがあるが、この様な場合には上記の2段階
の加熱が好ましく、この様な問題がなければ上記
の1段階の加熱の方法が効率的である。の組成
物の場合、該液状合成樹脂組成物を50℃〜180℃
で30秒〜15分間加熱乾燥した後紫外線照射又は電
子線照射を行ない該化合物を架橋せしめるのが好
ましい。
の組成物の場合、前記の組成物の場合と同
じ条件で架橋せしめるのが好ましい。
の組成物の場合、50℃〜200℃で30秒〜15分
間加熱して架橋せしめるのが好ましい。
の組成物の場合、液状化合物に紫外線照射又
は電子線照射を行ないより短時間で架橋硬化せし
めることが出来る。尚、この化合物中に水又は溶
剤等の分散媒が含まれている場合には、あらかじ
め加熱して分散媒を除去してから、紫外線照射又
は電子線照射を行なうのが好ましい。
紫外線照射は、低圧水銀灯、中圧水銀灯、高圧
水銀灯、超高圧水銀灯を使用して行なうことが出
来、紫外線照射時間は、使用する水銀灯の強さに
より可変出来る。すなわち水銀灯の強さが強い場
合には、照射時間は短時間ですみ、逆に水銀灯の
強さが弱い場合には、照射時間を長くする必要が
ある。又紫外線照射を行なう場合には、液状合成
樹脂組成物が透明もしくは半透明であることが好
ましく、不透明のものについては紫外線照射を行
なうのが難しい。液状合成樹脂組成物が不透明の
場合は、電子線照射を行なうのが好ましい。さら
に電子線照射の方が紫外線照射に比べ生産速度が
速く、充填剤を多量に含む不透明な合成樹脂組成
物でも架橋可能である為、床材の生産量が多い場
合には、電子線照射の方が有利である。
<耐熱合成樹脂層の厚味>
繊維質基材1に液状合成樹脂組成物を塗布含浸
して得られる耐熱性合成樹脂層2の厚味(繊維質
基材1に液状合成樹脂組成物を塗布含浸したもの
厚味から繊維質基材1の厚味を除いた厚味)は、
0.5m/m以下にする。耐熱性合成樹脂層2の厚
味が0.5m/m以上であると、床材を剥離した際
の下地の凹凸が大となり、そのままの状態でその
上に床材を施工することが出来なくなり、本発明
の所期の目的を達成し得ないからである。又、床
材自体の軽量化の点から耐熱性合成樹脂層2を発
泡させることも出来るが、発泡倍率を高くすると
床材を剥離する際に発泡層の層破壊を生じる為、
発泡層の密度を0.2g/c.c.以上にすることが好ま
しい。発泡層を形成する方法は、化学発泡剤によ
る方法、機械発泡による方法等が利用出来る。
●軟質合成樹脂中間層
<組成物>
本発明に使用する軟質合成樹脂中間層3を形成
するための軟質合成樹脂組成物は、床材としての
使用に耐えるものであれば何でも良いが、塩化ビ
ニル樹脂ペースを使用するのが一般的であり、以
下、塩化ビニル樹脂ペースト組成物についても述
べる。軟質合成樹脂中間層を形成するための塩化
ビニル樹脂ペースト組成物は、塩化ビニル樹脂
100重量部に対して可塑剤20〜120重量部、安定剤
適当量、及び、必要に応じて粘度調整剤、発泡
剤、整泡剤、着色剤、充填剤、金属粉末等の適当
量から成る。可塑剤量が塩化ビニル樹脂100重量
部に対して20重量部未満である場合には、軟質合
成樹脂中間層3が硬くなりすぎ、低温特性(特に
低温における可撓性)が悪くなり、冬期における
施工が困難となり好ましいものではない。逆に可
塑剤量が塩化ビニル樹脂100重量部に対して120重
量部を越えると、軟質合成樹脂中間層3から軟質
合成樹脂上引層4への可塑剤の移行が大きくな
り、床材の表面のベタツキがひどくなり、その結
果床材表面の汚染が大きくなるという欠点を有し
好ましいものではない。又、軟質合成樹脂中間層
3は特別な理由がない限り発泡した方が施工面及
びコスト面で有利である。発泡する手段としては
前記塩化ビニル樹脂ペーストに化学発泡剤を添加
し、加熱により化学発泡剤を分解せしめ発泡する
方法と、前記塩化ビニル樹脂ペーストに整泡剤を
添加し機械的にフオームを作る方法、及び前記塩
化ビニル樹脂ペーストと中空のバルーン状の物質
を添加する方法等があり、本発明にはこれらのい
ずれかの方法も使用出来る。前記の化学発泡剤、
整泡剤、中空のバルーン状の物質の量は、必要に
応じて、適宜調整する。又床材の耐タバコ火性を
向上する場合には、軟質合成樹脂中間層3の熱伝
導率を高くする必要がある。この場合には、軟質
合成樹脂中間層3を非発泡構造にする必要があ
る。この場合、無機質の充填剤の添加及び/又は
金属粉末等の添加により軟質合成樹脂中間層3の
熱伝導率が高くなり、床剤の耐タバコ火性はかな
り向上する。無機質の充填剤の添加量は塩化ビニ
ル樹脂100重量部に対して400重量部以下が好まし
く、又、金属粉末の添加量は塩化ビニル樹脂100
重量部に対して600重量部以下が好ましい。もち
ろん、無機質の充填剤と金属粉末を併用すること
も可能である。無機質の充填剤の量が塩化ビニル
樹脂100重量部に対して400重量部を越えると、軟
質合成樹脂中間層3の機械的強度が弱くなり、折
曲げに対して弱くなると共に床材自体の重量が重
くなり、施工性が悪くなるので好ましくない。
又、金属粉末の量が塩化ビニル樹脂100重量部に
対して600重量部を越えると軟質合成樹脂中間層
3の機械的強度が弱くなり、折曲げに対して弱く
なると共に床材の重量が重くなり、施工性が悪く
なるので好ましくない。
<軟質合成樹脂中間層の厚味>
軟質合成樹脂中間層3の厚味は一般に0.05m/
m〜4.00m/mであるが、特にこの範囲に制限さ
れるものではない。しかしながら軟質合成樹脂中
間層3の厚味が4.00m/mを越えると、得られる
床材は非常に厚いものとなり、施工に不便であり
あまり好ましいものではない。又、軟質合成樹脂
中間層3は発泡層であつても非発泡層であつても
良い。ただし、軟質合成樹脂中間層3を非発泡層
にした場合、床材の重量が重くなり床材の運搬や
施工が不便となるので、特別の理由がない限り発
泡層にした方が良い。又、発泡層を形成させる方
法としては、化学発泡剤による方法、機械発泡に
よる方法等があるが、ケミカルエンボスを行なう
場合には、化学発泡剤による方法が必要であり、
その他の場合は機械発泡による方法も使用出来
る。
●軟質合成樹脂上引層
<組成物>
本発明に使用する軟質合成樹脂上引層4を形成
するための軟質合成樹脂組成物は、機械的強度優
れ床材の上引層としての使用に耐えるものである
ならば何でも良いが、塩化ビニルペーストを使用
するのが一般的であり、以下、塩化ビニル樹脂ペ
ースト組成物について述べる。軟質合成樹脂上引
層4を形成するための塩化ビニル樹脂ペースト組
成物は、塩化ビニル樹脂100重量部に対して可塑
剤10〜100重量部、安定剤適当量、及び、必要に
応じて、粘度調整剤、着色剤、充填剤、紫外線照
射又は電子照射等の手段により架橋する化合物、
光増感剤等の適当量から成る。可塑剤量が塩化ビ
ニル樹脂100重量部に対して10重量部未満である
場合には、軟質合成樹脂上引層4が硬くなりす
ぎ、床材としては表面がすべりやすく、又、低温
特性(特に低温における可撓性)が悪くなるた
め、冬期における施工が困難なものとなり好まし
いものではない。逆に可塑剤量が塩化ビニル樹脂
100重量部に対して100重量部を越えると、床材の
表面のベタツキがひどくなり、その結果、床材表
面の汚染もひどくなり好ましいものではない。軟
質合成樹脂中間層4の表面に印刷を施こした場合
は、軟質合成樹脂上引層4は透明もしくは半透明
であることが必要であるが、それ以外の場合には
軟質合成樹脂上引層4は不透明でも良く、この場
合には、充填剤を使用した方が価格面で有利であ
る。又、床材の耐タバコ火性を向上する場合に
は、軟質合成樹脂上引層4の耐熱性を向上するこ
とが必要であり、この場合には、紫外線照射又は
電子線照射等の手段により架橋する化合物、及び
必要に応じて光増感剤等を、前記軟質合成樹脂上
引層4を形成するための塩化ビニル樹脂ペースト
組成物に添加することが必要である。前記軟質合
成樹脂上引層4中に含まれる紫外線照射又は電子
線照射等により架橋する化合物を架橋する手段が
紫外線照射である場合には、光増感剤を併用した
方が良く、又、該化合物を架橋する手段が電子線
照射である場合には、光増感剤を併用する必要は
ない。紫外線照射又は電子線照射等の手段により
架橋する化合物の量は、塩化ビニル樹脂100重量
部に対して10〜100重量部が好ましい。紫外線照
射又は電子線照射等の手段により架橋する化合物
の量が塩化ビニル樹脂100重量部に対して10重量
部未満である場合には、架橋度が低く耐タバコ火
性が悪く所期の目的を達成し得ないものである。
逆に紫外線照射又は電子線照射等の手段により架
橋する化合物の量が塩化ビニル樹脂100重量部に
対して100重量部を越えると、架橋度が高くなり
すぎ床材表面が硬くなりすぎてすべり易くなるば
かりでなく、使用中に床材が反り上がり実用的な
ものではない。
<軟質合成樹脂上引層の厚味>
軟質合成樹脂上引層4の厚味は0.05〜m/m〜
2.00m/mが好ましい。軟質合成樹脂上引層4の
厚味が0.05m/m未満であると、人の歩行等によ
り該軟質合成樹脂上引層4がすぐに摩耗してま
い、床材の寿命が短かくなる為好ましくない。
又、軟質合成樹脂上引層4の厚味が2.00m/mを
越えると、床材自体が硬くなり施工に不便である
と共に反りや収縮が出易くなるのであまり好まし
くない。
<軟質合成樹脂上引層の態様>
軟質合成樹脂上引層4は無色透明でも任意の色
に着色した透明もしくは不透明であつても良いし
又床材の意匠の点から、軟質合成樹脂上引層4に
任意の色に着色した単色又は多数色の合成樹脂製
粉末、チツプ状物、塊状物等を入れても良い。任
意の色に着色した単色又は多数色の合成樹脂製粉
末、チツプ状物、塊状物が透明もしくは半透明の
場合は、軟質合成樹脂中間層3の表面に施こされ
た印刷模様とあいまつてモザイク調の意匠が表現
され、又、該任意の色に着色した単色又は多数色
の合成樹脂製粉末、チツプ状物、塊状物等が不透
明の場合には、該合成樹脂製粉末、チツプ状物、
塊状物等による独特の意匠が表現される。さら
に、前記軟質合成樹脂上引層4に耐熱性を付与す
ることにより床材の表面に火のついたタバコを放
置したり火のついたタバコを床材の表面でもみ消
しても、床材表面が変色したり、焦げ跡を生じな
い耐タバコ火性床材を提供することが出来る。軟
質合成樹脂上引層4に耐熱性を付与する方法とし
ては、軟質合成樹脂組成物に加熱又は紫外線照射
又は電子線照射等により架橋する化合物を配合し
たものを加熱又は紫外線照射又は電子線照射にて
架橋する方法等があるが、架橋性の点で紫外線照
射又は電子線照射又は電子線照射により架橋する
方法が好ましい。又、この軟質合成樹脂上引層4
にエンボスを行なう場合は、紫外線照射又は電子
線照射前にエンボスを行なうことが好ましい。
床材の耐タバコ火性を向上する為には、前記の
如く、軟質合成樹脂上引層4に耐熱性を付与する
と共に、軟質合成樹脂中間層3及び耐熱性合成樹
脂層2を非発泡構造とし、そして多量の充填剤及
び/又は金属粉末を配合し、床材自体の熱伝導を
良くすることが好ましい。
●本発明に使用する化合物、添加剤
<塩化ビニル樹脂>
耐熱性合成樹脂層2、軟質合成樹脂中間層3、
軟質合成樹脂上引層4を形成するための塩化ビニ
ル樹脂ペースト組成物に使用される塩化ビニル樹
脂は、乳化重合塩化ビニル樹脂、懸濁重合塩化ビ
ニル樹脂、塊状重合塩化ビニル樹脂等一般に使用
されている塩化ビニル樹脂が使用できる。また、
塩化ビニル単独重合体だけでなく、酢酸ビニル、
エチレン、アルキルエーテル、アクリル酸エステ
ル、メタクリン酸エステル等の一種又は二種以上
と塩化ビニルとの共重合体も使用でき、これら単
独重合体および共重合体は単独で又は併用で使用
できる。また、他の重合体を上述したような塩化
ビニル樹脂とブレンドすることもできる。ブレン
ドできる樹脂としては、例えば、アクリロニトリ
ル−ブタジエン共重合体、エチレン−酢酸ビニル
共重合体、アクリロニトリル−ブタジエン−スチ
レン共重合体、アクリル樹脂等があるが、これら
に制限されるものではない。
<可塑剤>
可塑剤としては、一般に使用される可塑剤が使
用できるが、次にその例を掲げる。フタル酸エス
テル系可塑剤としては、ジメチルフタレート、ジ
エチルフタレート、ジブチルフタレート、ジイソ
ブチルフタレート、ジオクチルフタレート、オク
チルカプリルフタレート、ジシクロヘキシルフタ
レート、ジドデシルフタレート、ブチルベンジル
フタレート、ジメチルグリコールフタレート、エ
チルフタリルエチルグリコレート、メチルフタリ
ルエチルグリコレート、ブチルフタリルブチルグ
リコレート、ジイソデシルフタレート等が使用さ
れる。燐隣エステル系可塑剤としては、トリブチ
ルホスヘート、トリクレジルホスヘート、トリフ
エニルホスヘート、トリクロルエチルホスヘー
ト、トリオクチルホスヘート、トリエチルホスヘ
ート、ジフエニルクレジルホスヘート、アリール
アルキルホスヘート、ジフエニルモノオルソキセ
ニールホスヘート等が使用される。脂肪酸エステ
ル系可塑剤としては、メチルアセチルリシノレー
ト、ジオクチルアジペート、ジオクチルアゼレー
ト、ジブチルセバケート、ジオクチルセバケー
ト、トリアセチルグリセリン、グリセロールブチ
レート、ジイソデシルサクシネート、ジイソデシ
ルアジペート、コハク酸混合アルキルエステル等
が使用される。その他、トリオクチルトリメリツ
ト酸等のトリメリツト酸エステル系可塑剤、エポ
キシ化大豆油や各種エポキシ樹脂等のエポキシ系
可塑剤、ポリエステル系高分子可塑剤等も使用で
きる。
更に、塩化ビニル樹脂ペーストの粘度低下を目
的として、少量の粘度調整剤として、例えばガソ
リン、オクタン、ベンゼン、トルエン、ナフサ、
ドデシルベンゼン誘導体等の揮発性希釈剤や各種
の界面活性剤等の減粘剤を前記可塑剤と併用する
こともある。
<安定剤>
安定剤は、通常塩化ビニル樹脂に使用されるも
のであれば何でも使用出来る。具体的には、カド
ミウム、亜鉛、バリウム、カルシウム、ストロン
チウム、アルミニウム、マグネシウム、セリウ
ム、ナトリウム、鉛、錫等の金属系安定剤の他、
有機リン化合物、多価アルコール、エポキシ化合
物等を単独で又は2種以上を併用して使用でき
る。
安定剤の添加量は塩化ビニル樹脂100重量部に
対して0.1〜10重量部が好ましい。
<合成樹脂エマルジヨン、合成ゴムラテツクス>
非反応型の合成樹脂エマルジヨンや合成ゴムラ
テツクスとしては、一般に使用されるものであれ
ば何でも使用出来る。具体的には、塩化ビニル樹
脂エマルジヨン、塩化ビニル−エチレン共重合体
エマルジヨン、塩化ビニル−塩化ビニリデン共重
合体エマルジヨン、塩化ビニル−酢酸ビニル共重
合体エマルジヨン、塩化ビニリデン樹脂エマルジ
ヨン、酢酸ビニル樹脂エマルジヨン、酢酸ビニル
−アクリル共重合体エマルジヨン、エチレン−酢
酸ビニル共重合体エマルジヨン、アクリル樹脂エ
マルジヨン、アクリル−スチレン共重合体エマル
ジヨン、ウレタン樹脂エマルジヨン等の合成樹脂
エマルジヨン、又は、SBRラテツクス、NBRラ
テツクス、CRラテツクス、IIRラテツクス等の合
成ゴムラテツクス等が使用出来る。これらは単独
で使用しても良いし、2種以上を併用して使用す
ることも出来る。又、上記エマルジヨンやラテツ
クスの他、合成樹脂や合成ゴムを有機溶剤又は水
に溶解した溶液も上記エマルジヨンやラテツクス
同様に使用出来る。
反応型の合成樹脂エマルジヨンや合成ゴムラテ
ツクスとしては、一般に使用されるものであれば
何でも使用出来るが、具体的には、カルボキシル
基、水酸基、アミド基等の反応基をエマルジヨン
やラテツクスポリマーに導入したものに架橋剤と
してメラミンや尿素の初期縮合物を添加し加熱架
橋させるものや、エマルジヨンやラテツクスポリ
マーにグリシジル基、メチロール基等の反応基を
導入したもの、例えばアクリル酸エステル又はメ
タクリル酸エステルを主成分とし、これにグリシ
ジルアクリレート又はグリシジルメタクリレート
及びアクリル酸第3ブチル又はアミルの3成分を
共重合することによつて得られたエマルジヨンや
スチレンアクリル酸エステルとアクリルアマイド
を共重合した後これをメチロール化することによ
つて得られたエマルジヨン等の如き自己架橋型の
エマルジヨンやラテツクス等が使用出来る。反応
型の合成樹脂エマルジヨンや合成ゴムラテツクス
としては、アクリル樹脂エマルジヨン、酢酸ビニ
ル樹脂エマルジヨン、酢酸ビニル−アクリル共重
合体エマルジヨン、塩化ビニル−酢酸ビニル共重
合体エマルジヨン、SBRラテツクス、NBRラテ
ツクス、CRラテツクス等が掲げられる。これら
は単独で使用しても良いし、2種以上を併用して
使用することも出来る。又、これらの反応型の合
成樹脂エマルジヨンや合成ゴムラテツクスと、前
記非反応型の合成樹脂エマルジヨンや合成ゴムラ
テツクスとを併用して使用することも出来る。
又、上記エマルジヨンやラテツクスの他、上記の
如き反応基を有する合成樹脂や合成ゴムを有機溶
剤又は水に溶解した溶液等も上記エマルジヨンや
ラテツクス同様に使用出来る。
<加熱、紫外線又は電子線照射で架橋する化合物
>
加熱又は紫外線照射又は、電子線照射等の手段
により架橋する化合物としては次の様なものが使
用出来るが、本発明は何らこれに限定されるもの
ではない。
エチレングリコール、プロピレングリコール、
ブチレングリコール、1・6−ヘキサンジオー
ル、ネオペンチルグリコール、ポリエチレングリ
コール、ポリプロピレングリコール、トリメチロ
ールプロパン、トリメチロールメタン、グリセリ
ン、ペンタエリスリトール、ジペンタエリスリト
ール等の脂肪族多価アルコールとアクリル酸又は
メタクリル酸とから得られるアクリル系多官能化
合物;トリアリルイソシアヌレート、トリスー
(2−メタクリロイル、オキシエチル)−イソシア
ヌレート等のイソシアヌレート誘導体;ビスフエ
ノールA型エポキシ樹脂、フエノールノボラツク
型エポキシ樹脂、クレゾールノボラツク型エポキ
シ樹脂等の1分子中に少なくとも2個以上のエポ
キシ基を有するエポキシ化合物と不飽和一塩基酸
とから得られるアクリル変性エポキシ樹脂;多価
シクロアセタール化合物とグリコール不飽和モノ
カルボン酸モノエステルまたは多価アルコール不
飽和モノカルボン酸エステルモノオールとの反応
生成物である不飽和シクロアセタール樹脂;オリ
ゴエステルアクリレート等のアクリル変性ポリエ
ステル樹脂;アクリル変性ポリウレタン樹脂;不
飽和ポリエステル樹脂;ジアリルフタレート等が
あり、これらを単独で又は数種併用して使用して
も良い。またスチレン系単量体、メタクリル酸エ
ステル系単量体、アクリル酸エステル系単量体等
の単官能モノマーを反応性減粘剤として前記の多
官能化合物と併用しても良い。多官能化合物の添
加量は樹脂100重量部に対して10〜100重量部が好
ましい。
<重量開始剤、触媒>
重量開始剤としては一般に使用されるものが使
用出来る。例えばメチルエチルケトンパーオキサ
イド、シクロヘキサノンパーオキサイド、t−ブ
チルハイロドパーオキサイド、クメンハイドロパ
ーオキサイド、ジ−t−ブチルパーオキサイド、
t−ブチルクミルパーオキサイド、ジクミルパー
オキサイド、2・5−ジメチル2・5−ジ(t−
ブチルパーオキシ)ヘキサン、2・5−ジメチル
2・5−ジ(t−ブチルパーオキシ)ヘキシン、
1・3−ビス(t−ブチルパーオキシイソプロピ
ル)ベンゼン、1・1−ビス(t−ブチルパーオ
キシ)3・3・5−トリメチルシクロヘキサン、
n−ブチル4・4−ビス(t−ブチルパーオキ
シ)バレート、ベンゾイルパーオキサイド、p−
クロロベンゾイルパーオキサイド、2・4−ジク
ロロベンゾイルパーオキサイド、t−ブチルパー
オキシベンゾエート、t−ブチルパーオキシイソ
プロピルカーボネート等の有機過酸化物が一般的
であり、これらを単独で又は2種以上を併用して
使用する。又、触媒としては、ジメチルアニリ
ン、ジメチルパラトルイジン等のアミン類、ナフ
テン酸コバルト、ナフテン酸亜鉛等の金属化合物
等が一般的である。
重合開始剤添加量は多官能化合物0.5〜10重量
%が適当である。
<光増感剤>
光増感剤は一般的に使用されるものが使用出来
る。例えば、ベンゾイン、α−メチルベンゾイ
ン、α−アリルベンゾイン、ベンゾインメチルエ
ーテル、ベンゾインエチルエーテル、ベンゾイン
イソプロピルエーテル、ベンゾインn−ブチルエ
ーテル、ベンゾインイソブチルエーテル、アセト
フエノン、ベンゾフエノン、p−ブロムベンゾフ
エノン、4・4′−テトラメチルジアミノベンゾフ
エノン、ジフエニルジスルフイド、ベンジル等が
あり、これらを単独で又は2種以上を併用して使
用できる。光増感剤の添加量は多官能化合物の
0.5重量%〜10重量%が適当である。
又、前記多官能化合物を電子線照射にて架橋さ
せる場合は、光増感剤等を使用する必要はない。
<架橋剤>
前記多官能化合物の他、ハロゲン化合成樹脂組
成物、例えば塩化ビニル樹脂、塩化ビニルと酢酸
ビニル、エチレン、アルキルエーテル、アクリル
酸エステル、メタクリル酸エステル等との共重合
体、塩化ビニリデン樹脂、クロロプレンゴム等の
合成樹脂組成物を使用する場合は、該合成樹脂組
成物に2−ジブチルアミノ−4・6−ジチオシア
ヌル酸、2−ジシクロヘキシルアミノ−4・6−
ジチオシアヌル酸、2−ジベンジルアミノ−4・
6−ジチオシアヌル酸、2−ジフエニルアミノ−
4・6−ジチオシアヌル酸、2−アニリノ−4・
6−ジチオシアヌル酸、又はこの様なジチオシア
ヌル酸誘導体の金属塩等の架橋剤と、必要に応じ
て、酸化マグネシウム、酸化カルシウム酸化亜
鉛、酸化バリウム、酸化鉛、炭酸カルシウム等の
受酸剤、及び、架橋促進剤等を添加して使用する
ことも出来る。前記架橋剤の添加量は、前記ハロ
ゲン化合成樹脂100重量部に対して0.5〜20重量部
が好ましい。
合成樹脂エマルジヨンや合成ゴムラテツクスに
に、必要に応じて、添加して使用する架橋剤とし
ては、メラミンや尿素の初期縮合物が使用される
が、本発明は何らこれらのものに制限されるもの
ではない。
<耐熱性に優れた充填剤>
耐熱性に優れた無機質及び/又は有機質の充填
剤としては、基本的には加工温度にて熔融、分解
等の物理的、科学的な変化をしないものであれば
何でも使用出来るが、次にその例を掲げる。炭酸
カルシウム、炭酸マグネシウム、クレー、タル
ク、シリカ、ケイ藻土、ケイ砂、軽石粉、スレー
ト粉、雲母粉、アスベスト、水酸化アルミニウ
ム、酸化アルミニウム、硫酸アルミニウム、硫酸
バリウム、硫酸カルシウム、ガラス球、発泡ガラ
ス球、フライアツシユ球、火山ガラス中空体(シ
ラスバルーン)等の無機質充填剤、粉末繊維素
(セルロースパダー)、ポリビニルアルコール繊
維、コルク粉末、木粉、熱硬化性樹脂粉末、熱硬
化性樹脂中空球等の有機質充填剤等が使用出来
る。
<化学発泡剤>
本発明に使用する化学発泡剤としては、一般に
使用されるものが使用出来るが、次にその例を掲
げる。N・N′−ジニトロソペンタメチレンテト
ラミン、N・N′−ジメチル−N・N′−ジニトロ
ソテレフタルアミド、アゾジカルボンアミド、ア
ゾビスイソブチロニトリル、ベンゼルスルホニル
ヒドラジド、P・P′−オキシビス(ベンゼンスル
ホニルヒドラジド)、ベンゼン−1・3−ジスル
ホニルヒドラジド、トルエンスルホニルヒドラジ
ド等が使用出来る。
<整泡剤>
機械発泡により発泡層を形成する場合は整泡剤
を使用するのが好ましいが、この整泡剤としては
一般に使用されているものであれば何でも使用出
来、例えばメチルシロキサンエマルジヨン、メチ
ルシロキサン、キシレン溶液等のシリコン系整泡
剤、フツ素系整泡剤、脂肪酸縮合物、アルキルア
リルスルホネート系、オレイン酸やリシノール酸
の金属石けん、グアニジン塩類、第四級アンモニ
ウム化合物、アルデヒド−アミンの縮合生成物等
が使用される。
<粘度調整剤>
粘度調整剤は減粘剤及び増粘剤に大別される。
減粘剤としては一般に使用されるものが使用出来
るが、次にその例を掲げる。液状合成樹脂組成物
が塩化ビニル樹脂プラスチゾル及び合成樹脂や合
成ゴムを有機溶剤に溶解した溶液等の油分散系の
場合は、ガソリン、オクタン、ベンゼン、トルエ
ン、キシレン、ナフサ、ドデシルベンゼン誘導
体、メチルエチルケトン、メチルイソブチルケト
ン等の揮発性希釈剤、各種界面活性剤等が使用さ
れ、又、液状合成樹脂組成物が合成樹脂エマルジ
ヨンや合成ゴムラテツクス及び合成樹脂や合成ゴ
ムの水溶液等の水分散系の場合は、水、メタノー
ル、エタノール、イソプロピルアルコール等のア
ルコール等が使用される。又は、増粘剤としては
一般に使用されるものが使用出来るが、次にその
例を掲げる。液状合成樹脂組成物が上記の如き油
分散系の場合は、ステアリン酸アルミニウム、オ
レイン酸アルミニウム、ステアリン酸亜鉛等の金
属石けん、シリカ、ベントナイト、重合油等が、
又液状合成樹脂組成物が上記の如き水分散系の場
合は、シリカ、ベントナイト、化学変性沈降性炭
酸カルシウム、高分子有機酸のアンモニウム塩、
水溶性アクリル系ポリマー、アクリルエマルジヨ
ン共重合体、架橋アクリルエマンジヨン共重合
体、アンモニウム、ポリメタクリレート、ポリア
クリル酸アンモニウム、ポリアクリル酸ソーダ、
変性ポリアクリル酸ソーダ、部分酸化ポリアクリ
ル酸エステル、メチルセルロース、カルボキシル
メチルセルロース、ヒドロキシエチルセルロー
ス、繊維素グリコール酸ソーダ、ポリビニルアル
コール、アンモニア水等が使用出来る。これらの
粘度調整剤は液状合成樹脂組成物の粘度を加工に
適した粘度に調整する際に、必要に応じて、適当
量添加して使用される。
(実施例)
本発明を更に詳細に説明する為に以下実施例を
掲げるが、本発明はこれらの実施例の制限される
ものではない。
<配合例>
耐熱性合成樹脂層2を形成するための液状合成
樹脂組成物の代表的な配合例と比較配合例を表−
1に記載する。
軟質合成樹脂中間層3を形成する為の塩化ビニ
ル樹脂組成物の代表的な配合例を表−2に、さら
に軟質合成物樹脂上引層4を形成する為の塩化ビ
ニル樹脂組成物の代表的な配合例を表−3に記載
する。
(Field of Industrial Application) The present invention relates to a laminated flooring material, and more specifically, a laminated flooring material that is easy to construct using ordinary adhesives, durable for practical use, and that can be easily peeled off when replacing the flooring material. It is related to. (Prior art) Conventionally, this type of laminated flooring has been used in stores and households because it is beautiful and clean, easy to maintain, inexpensive, and has good abrasion resistance and chemical resistance. It is used extensively on the floor. This flooring material has a structure in which a soft synthetic resin layer is provided as an intermediate layer, a soft synthetic resin top layer is laminated on the surface thereof, and an asbestos sheet is laminated as a base material on the back surface. When this flooring material is installed with ordinary adhesive and put into practical use, when the flooring material is replaced, a large amount of asbestos on the back side remains on the underlying surface, causing unevenness on the underlying surface. A major drawback was that it would be difficult to install the flooring in its current state, and if the flooring was to be reinstalled, the asbestos remaining in multiple layers on the underlying surface would have to be removed with great effort. . Conventionally, this type of flooring material has a core material layer made of long-fiber nonwoven fabric, an intermediate layer of soft plastic foam on the surface side, and a surface layer of soft plastic film bonded thereon. Japanese Patent Publication No. 47-41848 relates to a laminated floor material made by bonding a soft plastic layer with a dense structure mixed with a large amount of filler to the back side of the floor material, and a surface layer made of synthetic resin etc. on the surface of a base mainly made of paper or non-woven fabric. JP-A No. 51-99821, Utility Model Application No. 51-105221, Japanese Utility Model Application No. 105221, based on the idea of forming a layer of release material on the back side of the base of flooring, wall materials, etc.
No. 51-107902, No. 51-137930, No. 51-
Publications such as No. 137931 are known. However, in the laminated flooring material disclosed in Japanese Patent Publication No. 47-41848, the laminated floor material has a core material layer made of long-fiber nonwoven fabric as a base material, an intermediate layer of soft plastic foam on the surface, and a surface layer of soft plastic film thereon. It is characterized by bonding a dense soft plastic layer containing a large amount of filler to the back surface of the body (the back surface of the core material layer). In this case, first of all, the core material layer of the laminate is bonded. In order to bond a soft plastic layer with a dense structure mixed with a large amount of filler to the back side of the material, the soft plastic layer with a dense structure is bonded only at the surface part of the long fiber nonwoven fabric that constitutes the core material layer, and the two are completely bonded. Because they are not integrated, if a person walks on the flooring, drags a heavy object on the flooring, or repeatedly applies a local load with a chair with casters, etc., the joint surface may In order to prevent delamination, and secondly, to prevent the formation of wrinkles when bonding a soft plastic layer with a dense structure containing a large amount of filler on the back side of the core material layer, the dense structure is It is necessary to apply tension to the soft plastic layer, and this tension causes the dense soft plastic layer to be bonded to the core layer with internal strain,
This internal strain causes the flooring material to shrink over time, resulting in problems such as a significant deterioration in the dimensional stability of the flooring material. Also, Japanese Patent Application Publication No. 51-99821, Utility Model Application No. 51-105221,
In the publications of Utility Model Application No. 51-107902, Utility Model Application No. 51-137930, and Utility Model Application No. 51-137931, a surface layer is formed using a synthetic resin or the like on the surface of a base mainly made of paper or nonwoven fabric. It is characterized by forming a release agent layer on the back side of the base of the floor, wall material, etc., but in this case, the release agent layer on the back side of the base and the adhesive used to install the flooring material are combined. Basically, they do not adhere to each other, so it is very easy to remove the flooring material. When the adhesive layer is dropped, or when a load is applied locally repeatedly using a chair with casters, etc., peeling occurs at the interface between the release agent layer and the adhesive layer, which poses a serious practical problem. (Means for Solving the Problems) The present invention solves these conventional drawbacks, is sufficiently durable for practical use without problems such as peeling during practical use, and is replaced with adhesive on the base side when replacing the flooring material. It is an object of the present invention to provide a flooring material that can be easily re-installed and has a layer that is so thin that it does not cause any problem and causes the layer to break. That is, the flooring material of the present invention has a heat-resistant synthetic resin layer with a thickness of 0.5 m/m or less obtained by coating and impregnating a liquid synthetic resin composition on one side of a fibrous base material and solidifying it. A laminated flooring material in which a soft synthetic resin intermediate layer and a soft synthetic resin top layer are sequentially laminated on one side, and the heat-resistant synthetic resin layer is separated from the base adhesive when the laminated flooring material is peeled from the base material. The layer is characterized by a property of causing a thin layer to remain on the surface and causing the layer to break. In the laminated flooring material of the present invention, a liquid synthetic resin composition is coated and impregnated on a fibrous base material 1, and a heat-resistant synthetic resin layer 2 is formed by one or more of the solidifying means of heating, ultraviolet irradiation, or electron beam irradiation. Then, a soft synthetic resin intermediate layer 3 is laminated on the surface of the fibrous base material opposite to the surface to which the liquid synthetic resin composition is applied by a calendering method, an extrusion method, a paste coating method, etc. , a printing layer 5 is formed by printing by a gravure printing method, a flexo printing method, a rotary screen printing method, a transfer printing method, etc., and a soft synthetic resin top layer 4 is further applied on this surface by a calendar method, an extrusion method, a paste method, etc. This can be obtained by laminating layers using a coding method or the like. Heating, which is one of the above-mentioned solidification means, may be performed using any known heating method, such as electric heaters, infrared heaters, hot air blowing, Erofin, steam injection, high frequency induction heating, high frequency dielectric heating, etc. be able to.
Among the above-mentioned resin lamination methods, the paste coating method is common, and here, a method for manufacturing a flooring material using the paste coating method will be described.
A liquid synthetic resin composition is coated and impregnated onto the fibrous base material 1, heated at 50°C to 250°C for 30 seconds to 15 minutes to solidify the liquid synthetic resin composition, and then exposed to ultraviolet light or A heat-resistant synthetic resin layer 2 is formed by irradiation with an electron beam, and a vinyl chloride resin plastisol is applied to the surface opposite to the surface to which the liquid synthetic resin composition is applied, and then heated at 120°C to 250°C for 30 seconds to 5 minutes. Heated to form a soft synthetic resin intermediate layer 3, then coated with vinyl chloride resin plastisol and heated at 150°C to 250°C.
After heating for 30 seconds to 5 minutes to melt the vinyl chloride resin plastisol, embossing is performed as necessary, and then irradiation with ultraviolet rays or electron beams is performed as necessary. From the viewpoint of the design of the flooring material, it is preferable to form a printed layer 5 in which an arbitrary pattern is printed on the soft synthetic resin intermediate layer 3. Methods for printing arbitrary patterns include gravure printing,
The printing ink may be printed directly on the surface of the soft synthetic resin intermediate layer using a flexo printing method, rotary screen printing method, etc., or the printing ink may be printed on transfer paper and transferred onto the surface of the soft synthetic resin intermediate layer 3. good. Furthermore, it is possible to perform not only printing but also both printing and embossing, and in this case, it is also possible to perform printing and embossing at the same time, such as valley dyeing embossing and head stain printing. In addition, when the soft synthetic resin intermediate layer 3 is foamed with a chemical foaming agent, a part of the pattern of the printed layer 5 is printed with an ink containing a foaming agent and/or a foaming accelerator. Embossing is also possible. Further, by printing a part of the pattern on the printing layer 5 with foaming ink and/or non-foaming ink, printing and unevenness can be synchronized. As a means for coating and impregnating the liquid synthetic resin composition on the fibrous base material 1, any commonly used method may be used, such as a knife coater, roll coater, gravure printer, rotary screen, curtain flow coater, date coating, etc. is preferred. When applying a liquid synthetic resin composition thinly and uniformly to a fibrous base material 1 such as glass paper with a low density of glass fibers (coarse mesh), it is important to prevent the liquid synthetic resin composition from seeping onto the back side of the glass paper. Gravure printers, roll coaters, rotary screens, etc. are suitable. In addition, the viscosity of the liquid synthetic resin composition is 1
It is necessary to adjust the viscosity appropriately depending on the fiber density and application method. For example, in the case of a fibrous base material 1 with a high fiber density, such as an asbestos sheet, the liquid synthetic resin composition can be applied with a viscosity ranging from low to high, and the appropriateness depends on each application method. The viscosity can be adjusted within the viscosity range, but the liquid synthetic resin composition is applied using a knife coater to a fibrous base material 1 that does not have a high fiber density, such as glass fiber paper with a glass fiber density of about 0.12 g/cc. When coating, the viscosity of the liquid synthetic resin composition is preferably adjusted to about 10,000 cps to 500,000 cps. In addition, when using a fibrous base material 1 with a low fiber density (coarse mesh), and even if the liquid synthetic resin composition is applied, the impregnation with the liquid synthetic resin composition is insufficient. When the soft synthetic resin intermediate layer 3 is laminated on the surface opposite to the surface on which the liquid synthetic resin composition is applied, air bubbles enter the laminated interface, and when this foams, abnormal foaming may occur due to the influence of the air bubbles. In such cases, the surface opposite to the surface to which the liquid synthetic resin composition is applied is sealed with, for example, vinyl chloride resin paste, or the liquid synthetic resin composition is applied to the fibrous base material 1 and dried. It is preferable that the soft synthetic resin intermediate layer 3 be laminated after heating and compressing between rolls to smooth the laminated surface. In addition, when the flooring material is bonded to the base to such an extent that it does not peel off during practical use, and when the flooring material is peeled off, the thinness of the heat-resistant synthetic resin layer 2 is destroyed due to the destruction of the heat-resistant synthetic resin layer 2 on the back side of the flooring material. The adhesion strength between the heat-resistant synthetic resin layer 2 and the adhesive layer or the interlayer peeling strength due to destruction of the heat-resistant synthetic resin layer 2 is 0.3 to 5 kg/2 cm in order to separate the layer so that it remains on the base together with the adhesive. Preferably, the width is the same. If this adhesive strength or interlayer peel strength is less than 0.3 kg/2cm width, the adhesive strength with the base will be too weak and peeling will occur during practical use, or the adhesive strength or interlayer peel strength will be less than 5 kg/2 cm.
If the width is exceeded, it becomes difficult to separate the flooring material from the base. ●Fibrous base material The fibrous base material 1 used in the present invention may be a single layer or two or more layers as long as it has excellent dimensional stability such as a felt sheet, woven fabric, knitted fabric, or nonwoven fabric. Although multi-layered ones can be used, in particular, from the viewpoint of dimensional stability, asbestos sheets, sheets mixed with at least two or more types of inorganic and/or organic fibers such as asbestos, glass fiber, paper, and polyester fibers, glass fiber paper, Paper or the like is preferred. Heat-resistant synthetic resin layer <liquid synthetic resin composition> The liquid synthetic resin composition for forming the heat-resistant synthetic resin layer 2 used in the present invention includes a soft synthetic resin intermediate layer 3 and a soft synthetic resin top layer. In lamination processing such as No. 4, it has a heat resistance that does not stick to the heated support in the heating furnace, and it also uses an adhesive for ordinary flooring construction. Any material can be used as long as it adheres to a degree that does not cause peeling during practical use even after processing the flooring material, and causes interlayer peeling due to destruction of the heat-resistant synthetic resin layer 2 when the flooring material is peeled off. The liquid synthetic resin composition for forming the heat-resistant synthetic resin layer 2 used in the present invention is preferably the following, but the present invention is not limited thereto. A composition in which a vinyl chloride paste is blended with a large amount of an inorganic and/or organic filler with excellent heat resistance A composition in which a vinyl chloride paste is blended with a compound that crosslinks by means such as ultraviolet irradiation or electron beam irradiation Non-reactive type A composition in which a large amount of an inorganic and/or organic filler with excellent heat resistance is blended into a non-reactive liquid composition such as a synthetic resin emulsion or non-reactive synthetic rubber latex. A composition in which a compound that crosslinks by heating is blended into a non-reactive liquid composition such as a non-reactive synthetic rubber latex.A non-reactive liquid composition such as a non-reactive synthetic resin emulsion or a non-reactive synthetic rubber latex. Compositions containing compounds that crosslink by means such as ultraviolet irradiation or electron beam irradiation Reactive liquid compositions such as reactive synthetic resin emulsion or reactive synthetic rubber latex Liquid compositions containing compounds that crosslink by heating Ultraviolet irradiation or reactive liquid compositions such as reactive synthetic rubber latex Liquid composition composed of a compound crosslinked by electron irradiation When the liquid synthetic resin composition for forming the heat-resistant synthetic resin layer 2 is the composition, this vinyl chloride resin paste composition contains 100 parts by weight of vinyl chloride resin. 30 to 130 parts by weight of plasticizer, appropriate amount of stabilizer, 50 to 400 parts by weight of inorganic and/or organic filler with excellent heat resistance, and if necessary, viscosity modifier, coloring agent, etc. Consisting of appropriate amounts. If the amount of plasticizer is less than 30 parts by weight based on 100 parts by weight of the vinyl chloride resin, the heat-resistant synthetic resin layer 2 will become too hard and its low-temperature properties will deteriorate, making it difficult to apply in winter, which is not preferable. Furthermore, if the amount of plasticizer exceeds 130 parts by weight per 100 parts by weight of vinyl chloride resin, not only will the heat-resistant synthetic resin layer 2 become extremely sticky, but especially when applied with a synthetic rubber latex adhesive, plasticizer A large amount of the agent migrates to the synthetic rubber adhesive layer, resulting in a significant decrease in adhesive strength.
This is not preferable since it causes problems such as warping and peeling of the flooring material during practical use. The amount of inorganic and/or organic filler with excellent heat resistance is 50 parts by weight per 100 parts by weight of vinyl chloride resin.
If the amount is less than parts by weight, the heat-resistant synthetic resin layer 2
The material sticks to the support while it is heated in the heating furnace, making it impossible to achieve the intended purpose. or,
When the amount of the inorganic and/or organic filler with excellent heat resistance exceeds 400 parts by weight per 100 parts by weight of the vinyl chloride resin, the amount of the filler becomes too large and the heat-resistant synthetic resin layer 2 becomes brittle. This is not preferable because the flooring material becomes easy to break when it is installed. An inorganic and/or organic filler with excellent heat resistance and a larger particle size is more effective in preventing adhesion to a heated support in a heating furnace even when added in a relatively small amount. This is because the larger the particle size, the rougher the surface of the heat-resistant synthetic resin layer 2 and the smaller the contact area with the heated support. This is thought to be due to the arrangement of the inorganic and/or organic fillers with large particle sizes and excellent heat resistance, which prevents adhesion to the heated support. When the liquid synthetic resin composition for forming the heat-resistant synthetic resin layer 2 is the composition, the vinyl chloride resin paste composition contains 10 to 100 parts by weight of a plasticizer per 100 parts by weight of the vinyl chloride resin, 0.5 to 100 parts by weight of a compound crosslinked by ultraviolet irradiation or electron beam irradiation, an appropriate amount of stabilizer, and, if necessary, a polymerization initiator, photosensitizer, catalyst, viscosity modifier, colorant,
It consists of appropriate amounts of a foam stabilizer, a foaming agent, an inorganic and/or organic filler with excellent heat resistance, and the like. If the amount of plasticizer is less than 10 parts by weight based on 100 parts by weight of the vinyl chloride resin, the heat-resistant synthetic resin layer 2 will become too hard and its low-temperature properties will deteriorate, making installation in winter difficult and undesirable. . Furthermore, if the amount of plasticizer exceeds 100 parts by weight per 100 parts by weight of the vinyl chloride resin, not only will the heat-resistant synthetic resin layer 2 become extremely sticky, but also especially when applied with a synthetic rubber latex adhesive. , a large amount of plasticizer migrates to the adhesive layer of synthetic rubber,
Since the adhesive strength is significantly reduced, problems such as warping and peeling of the flooring material occur during practical use, which is not preferable. If the amount of the compound crosslinked by means such as ultraviolet irradiation or electron beam irradiation is less than 0.5 parts by weight per 100 parts by weight of vinyl chloride resin, the degree of crosslinking is low and the support is heated in a heating furnace. It sticks to the pair and cannot achieve the intended purpose.
In addition, the amount of compounds crosslinked by ultraviolet irradiation or electron beam irradiation, etc. per 100 parts by weight of vinyl chloride resin.
If it exceeds 100 parts by weight, the degree of crosslinking will become too high and the heat-resistant synthetic resin layer 2 will become hard and brittle, making it impractical. When the liquid synthetic resin composition for forming the heat-resistant synthetic resin layer 2 is a composition of It consists of 150 to 950 parts by weight of an inorganic and/or organic filler with excellent heat resistance per 100 parts by weight, and, if necessary, appropriate amounts of a viscosity modifier, a coloring agent, etc. The amount of inorganic and/or organic fillers with excellent heat resistance depends on the amount of synthetic resin or synthetic rubber contained in the emulsion or latex.
If the amount is less than 150 parts by weight relative to 100 parts by weight, the heat-resistant synthetic resin layer 2 will stick to the heated support in the heating furnace, making it impossible to achieve the intended purpose. . In addition, the amount of organic filler and/or organic filler with excellent heat resistance depends on the amount of synthetic resin or synthetic rubber contained in the emulsion or latex.
If the amount exceeds 950 parts by weight relative to 100 parts by weight, the heat-resistant synthetic resin layer 2 becomes brittle and the flooring material tends to break during installation, which is not preferable. When the liquid synthetic resin composition for forming the heat-resistant synthetic resin layer 2 is a composition of
10 to 100 parts by weight of a compound crosslinked by heating, ultraviolet irradiation, electron beam irradiation, etc., per 100 parts by weight;
It also contains appropriate amounts of polymerization initiators, photosensitizers, catalysts, viscosity modifiers, colorants, foam stabilizers, and inorganic and/or organic fillers with excellent heat resistance, as required. The amount of the compound that crosslinks by heating, ultraviolet irradiation, electron beam irradiation, etc. is 100% of the synthetic resin or synthetic rubber contained in the non-reactive liquid composition, etc.
If the amount is less than 10 parts by weight, the degree of crosslinking of the heat-resistant synthetic resin layer is low and it will stick to the heated support in the heating furnace, making it impossible to achieve the intended purpose. It is. In addition, if the amount of the compound crosslinked by means such as heating, ultraviolet irradiation, or electron beam irradiation exceeds 100 parts by weight per 100 parts by weight of the synthetic resin or synthetic rubber contained in the emulsion or latex, the degree of crosslinking will decrease. If it becomes too high, the heat-resistant synthetic resin layer 2 will become hard and brittle, making it impractical. Additionally, the addition of inorganic and/or organic fillers with excellent heat resistance may improve adhesion to adhesives for floor construction. When the liquid synthetic resin composition for forming the heat-resistant synthetic resin layer 2 is a composition of It consists of appropriate amounts of inorganic and/or organic fillers that are excellent regulators, foam stabilizers, colorants, and heat-resistant agents. The above reactive synthetic resin emulsion,
If the synthetic rubber latex or the like is self-crosslinking, it will crosslink alone to form the heat-resistant synthetic resin layer 2, but if the heat resistance is to be further improved, the addition of a crosslinking agent is effective. Additionally, the addition of inorganic and/or organic fillers with excellent heat resistance may improve adhesion to adhesives for floor construction. When the liquid synthetic resin composition for forming the heat-resistant synthetic resin layer is a composition of , a polymerization initiator, a photosensitizer, a catalyst, a colorant, an inorganic and/or organic filler with excellent heat resistance, etc., in appropriate amounts. Addition of an inorganic and/or organic filler with excellent heat resistance to the liquid compound that is crosslinked by means such as heating, ultraviolet irradiation, or electron beam irradiation can also improve adhesion to adhesives for floor construction. be. <Conditions for solidifying the liquid synthetic resin composition> The following methods are suitable for solidifying the liquid synthetic resin composition for forming the heat-resistant synthetic resin layer 2, but the present invention is not limited thereto in any way. It is not something that will be done. In the case of a composition of 120% of the liquid synthetic resin composition
Preheat at 180°C to 180°C for 30 seconds to 6 minutes to make it semi-solid, then heat at 180°C to 250°C for 30 seconds to 5 minutes to melt the vinyl chloride resin, or preheat as described above. It is preferable to heat the liquid synthetic resin composition at 180 DEG C. to 250 DEG C. for 30 seconds to 5 minutes to melt the vinyl chloride resin. In the case of the above composition as well, it is preferable that the vinyl chloride resin be melted by heating under the same conditions as the above composition, and then crosslinked by irradiation with ultraviolet rays or electron beams. In the case of a composition, the liquid synthetic resin composition is heated to 50℃.
It is preferable to heat dry at ~180°C for 30 seconds to 15 minutes. In the case of a composition, the liquid synthetic resin composition is heated to 50℃.
~100℃ after heating and drying at ~150℃ for 30 seconds ~ 15 minutes
The liquid synthetic resin composition is heated at 200°C for 30 seconds to 10 minutes to crosslink, or the liquid synthetic resin composition is heated at 100°C to 200°C for 30 minutes.
It is preferable to heat for 15 seconds to 15 minutes to effect crosslinking.
In the case of emulsions and latexes, if they are heated at high temperatures from the beginning, they tend to foam abnormally due to the influence of moisture. In such cases, the two-stage heating described above is preferable, and if there are no such problems, the above-mentioned method can be used. A one-stage heating method is efficient. In the case of a composition, the liquid synthetic resin composition is heated to 50°C to 180°C.
It is preferable to crosslink the compound by heating and drying it for 30 seconds to 15 minutes and then irradiating it with ultraviolet rays or electron beams. In the case of the composition, it is preferable to carry out crosslinking under the same conditions as in the case of the above-mentioned composition. In the case of the composition, crosslinking is preferably carried out by heating at 50°C to 200°C for 30 seconds to 15 minutes. In the case of the composition, the liquid compound can be crosslinked and cured in a shorter time by irradiating the liquid compound with ultraviolet rays or electron beams. If this compound contains a dispersion medium such as water or a solvent, it is preferable to heat the compound in advance to remove the dispersion medium before irradiating it with ultraviolet rays or electron beams. Ultraviolet irradiation can be performed using a low-pressure mercury lamp, medium-pressure mercury lamp, high-pressure mercury lamp, or ultra-high pressure mercury lamp, and the ultraviolet irradiation time can be varied depending on the strength of the mercury lamp used. That is, when the intensity of the mercury lamp is strong, the irradiation time can be shortened, whereas when the intensity of the mercury lamp is weak, the irradiation time needs to be lengthened. Furthermore, when irradiating with ultraviolet rays, it is preferable that the liquid synthetic resin composition be transparent or semi-transparent, and it is difficult to irradiate ultraviolet rays with opaque compositions. When the liquid synthetic resin composition is opaque, it is preferable to perform electron beam irradiation. Furthermore, electron beam irradiation has a faster production rate than ultraviolet irradiation, and can crosslink even opaque synthetic resin compositions containing large amounts of fillers. It is more advantageous. <Thickness of the heat-resistant synthetic resin layer> Thickness of the heat-resistant synthetic resin layer 2 obtained by coating and impregnating the fibrous base material 1 with a liquid synthetic resin composition (the thickness of the heat-resistant synthetic resin layer 2 obtained by coating and impregnating the fibrous base material 1 with a liquid synthetic resin composition) The thickness (thickness obtained by subtracting the thickness of the fibrous base material 1 from the thickness of the impregnated material) is:
Keep it below 0.5m/m. If the thickness of the heat-resistant synthetic resin layer 2 is 0.5 m/m or more, the unevenness of the base will become large when the flooring material is peeled off, making it impossible to construct the flooring material on top of it in that state. This is because the intended purpose of the present invention cannot be achieved. In addition, from the viewpoint of reducing the weight of the flooring material itself, the heat-resistant synthetic resin layer 2 can be foamed, but if the foaming ratio is increased, the foamed layer will break when the flooring material is peeled off.
It is preferable that the density of the foam layer is 0.2 g/cc or more. As a method for forming the foam layer, a method using a chemical foaming agent, a method using mechanical foaming, etc. can be used. - Soft synthetic resin intermediate layer <composition> The soft synthetic resin composition for forming the soft synthetic resin intermediate layer 3 used in the present invention may be any material as long as it can withstand use as a flooring material, but vinyl chloride It is common to use a resin paste, and a vinyl chloride resin paste composition will also be described below. The vinyl chloride resin paste composition for forming the soft synthetic resin intermediate layer is made of vinyl chloride resin.
Consists of 20 to 120 parts by weight of plasticizer, an appropriate amount of stabilizer, and appropriate amounts of viscosity modifier, foaming agent, foam stabilizer, coloring agent, filler, metal powder, etc., per 100 parts by weight. . If the amount of plasticizer is less than 20 parts by weight based on 100 parts by weight of the vinyl chloride resin, the soft synthetic resin intermediate layer 3 will become too hard, resulting in poor low-temperature properties (especially flexibility at low temperatures) and poor performance in winter. This is not desirable as it makes construction difficult. On the other hand, if the amount of plasticizer exceeds 120 parts by weight per 100 parts by weight of vinyl chloride resin, the transfer of the plasticizer from the soft synthetic resin intermediate layer 3 to the soft synthetic resin top layer 4 will increase, causing the surface of the flooring material to deteriorate. This is not preferable since it has the drawback that it becomes extremely sticky, resulting in increased contamination of the surface of the flooring material. Furthermore, it is advantageous in terms of construction and cost to foam the soft synthetic resin intermediate layer 3 unless there is a special reason. Foaming methods include a method in which a chemical foaming agent is added to the vinyl chloride resin paste and the chemical foaming agent is decomposed by heating to cause foaming, and a method in which a foam stabilizer is added to the vinyl chloride resin paste to create a foam mechanically. , and a method of adding the vinyl chloride resin paste and a hollow balloon-like substance, and any of these methods can be used in the present invention. the aforementioned chemical blowing agent;
The amount of the foam stabilizer and the hollow balloon-like substance is adjusted as necessary. Further, in order to improve the cigarette flame resistance of the flooring material, it is necessary to increase the thermal conductivity of the soft synthetic resin intermediate layer 3. In this case, the soft synthetic resin intermediate layer 3 needs to have a non-foamed structure. In this case, the thermal conductivity of the soft synthetic resin intermediate layer 3 is increased by adding an inorganic filler and/or a metal powder, and the cigarette ignition resistance of the floor material is considerably improved. The amount of inorganic filler added is preferably 400 parts by weight or less per 100 parts by weight of vinyl chloride resin, and the amount of metal powder added is preferably 400 parts by weight or less per 100 parts by weight of vinyl chloride resin.
It is preferably 600 parts by weight or less. Of course, it is also possible to use an inorganic filler and metal powder together. If the amount of inorganic filler exceeds 400 parts by weight per 100 parts by weight of vinyl chloride resin, the mechanical strength of the soft synthetic resin intermediate layer 3 will be weakened, making it weak against bending and reducing the weight of the flooring itself. It is not preferable because it becomes heavy and the workability deteriorates.
Furthermore, if the amount of metal powder exceeds 600 parts by weight per 100 parts by weight of vinyl chloride resin, the mechanical strength of the soft synthetic resin intermediate layer 3 will be weakened, making it weak against bending and making the flooring material heavier. This is not preferable because it impairs workability. <Thickness of the soft synthetic resin intermediate layer> The thickness of the soft synthetic resin intermediate layer 3 is generally 0.05 m/
m to 4.00 m/m, but is not particularly limited to this range. However, if the thickness of the soft synthetic resin intermediate layer 3 exceeds 4.00 m/m, the resulting flooring material will be very thick, which is inconvenient for construction and is not very preferable. Further, the soft synthetic resin intermediate layer 3 may be a foamed layer or a non-foamed layer. However, if the soft synthetic resin intermediate layer 3 is made of a non-foamed layer, the weight of the flooring material will be heavy and transportation and construction of the flooring material will be inconvenient, so it is better to use a foamed layer unless there is a special reason. In addition, methods for forming a foam layer include a method using a chemical foaming agent and a method using mechanical foaming, but when performing chemical embossing, a method using a chemical foaming agent is required.
In other cases, mechanical foaming can also be used. ●Soft synthetic resin top layer <Composition> The soft synthetic resin composition for forming the soft synthetic resin top layer 4 used in the present invention has excellent mechanical strength and can withstand use as a top layer of flooring materials. Although any material may be used, vinyl chloride paste is generally used, and the vinyl chloride resin paste composition will be described below. The vinyl chloride resin paste composition for forming the soft synthetic resin top layer 4 contains 10 to 100 parts by weight of a plasticizer, an appropriate amount of a stabilizer, and, if necessary, a viscosity of 100 parts by weight of a vinyl chloride resin. Conditioners, colorants, fillers, compounds that crosslink by means such as ultraviolet irradiation or electron irradiation,
It consists of an appropriate amount of photosensitizer, etc. If the amount of plasticizer is less than 10 parts by weight based on 100 parts by weight of vinyl chloride resin, the soft synthetic resin top layer 4 will become too hard, the surface will be slippery as a flooring material, and the low-temperature properties (especially The flexibility at low temperatures deteriorates, making construction in the winter difficult and undesirable. On the contrary, the amount of plasticizer is vinyl chloride resin
If the amount exceeds 100 parts by weight, the surface of the flooring material becomes extremely sticky, and as a result, the surface of the flooring material becomes seriously contaminated, which is not preferable. When printing is performed on the surface of the soft synthetic resin intermediate layer 4, the soft synthetic resin top layer 4 needs to be transparent or translucent; however, in other cases, the soft synthetic resin top layer 4 4 may be opaque, and in this case, it is more advantageous in terms of cost to use a filler. In addition, in order to improve the cigarette flame resistance of the flooring material, it is necessary to improve the heat resistance of the soft synthetic resin top layer 4, and in this case, it is necessary to improve the heat resistance of the soft synthetic resin top layer 4. It is necessary to add a crosslinking compound and, if necessary, a photosensitizer and the like to the vinyl chloride resin paste composition for forming the soft synthetic resin top layer 4. When the means for crosslinking the compound contained in the soft synthetic resin top layer 4 that is crosslinked by ultraviolet irradiation, electron beam irradiation, etc. is ultraviolet irradiation, it is better to use a photosensitizer in combination. When the means for crosslinking the compound is electron beam irradiation, there is no need to use a photosensitizer together. The amount of the compound crosslinked by means such as ultraviolet irradiation or electron beam irradiation is preferably 10 to 100 parts by weight based on 100 parts by weight of the vinyl chloride resin. If the amount of the compound crosslinked by means such as ultraviolet irradiation or electron beam irradiation is less than 10 parts by weight per 100 parts by weight of vinyl chloride resin, the degree of crosslinking will be low and the cigarette flame resistance will be poor and the intended purpose will not be met. It is unattainable.
On the other hand, if the amount of the compound crosslinked by means such as ultraviolet irradiation or electron beam irradiation exceeds 100 parts by weight per 100 parts by weight of vinyl chloride resin, the degree of crosslinking will be too high and the surface of the flooring material will become too hard and slippery. Not only that, but the flooring also warps during use, making it impractical. <Thickness of the soft synthetic resin top layer> The thickness of the soft synthetic resin top layer 4 is 0.05~m/m~
2.00m/m is preferred. If the thickness of the soft synthetic resin top layer 4 is less than 0.05 m/m, the soft synthetic resin top layer 4 will quickly wear out due to people walking, etc., and the life of the flooring material will be shortened. Undesirable.
Furthermore, if the thickness of the soft synthetic resin top layer 4 exceeds 2.00 m/m, the floor material itself becomes hard, which is inconvenient to install, and it also tends to warp or shrink, which is not very preferable. <Aspects of the soft synthetic resin top layer> The soft synthetic resin top layer 4 may be colorless and transparent, transparent or opaque colored in any color, and from the viewpoint of the design of the flooring material, the soft synthetic resin top layer 4 may be made of a soft synthetic resin top layer. The layer 4 may contain monochromatic or multicolored synthetic resin powder, chips, lumps, etc. colored in any desired color. If the monochromatic or multi-colored synthetic resin powder, chips, or lumps colored in any color are transparent or translucent, they can be combined with the printed pattern on the surface of the soft synthetic resin intermediate layer 3 to form a mosaic. If the synthetic resin powder, chips, lumps, etc. are opaque and have a monochromatic or multi-colored color, the synthetic resin powder, chips, lumps, etc.
A unique design is expressed using lumps, etc. Furthermore, by imparting heat resistance to the soft synthetic resin top layer 4, even if a lit cigarette is left on the surface of the flooring material or a lit cigarette is smudged on the surface of the flooring material, the surface of the flooring material will remain intact. To provide a cigarette flame-resistant flooring material that does not discolor or cause scorch marks. A method for imparting heat resistance to the soft synthetic resin top layer 4 is to mix a soft synthetic resin composition with a compound that crosslinks by heating, ultraviolet irradiation, electron beam irradiation, etc. Although there are methods of crosslinking using ultraviolet irradiation, electron beam irradiation, or crosslinking with electron beam irradiation, preferred from the viewpoint of crosslinking properties. Moreover, this soft synthetic resin top layer 4
When embossing is performed on the substrate, it is preferable to perform the embossing before irradiation with ultraviolet rays or electron beams. In order to improve the cigarette ignition resistance of the flooring material, as mentioned above, the soft synthetic resin top layer 4 is given heat resistance, and the soft synthetic resin intermediate layer 3 and the heat-resistant synthetic resin layer 2 are made of a non-foamed structure. It is preferable to mix a large amount of filler and/or metal powder to improve the heat conduction of the floor material itself. ●Compounds and additives used in the present invention <vinyl chloride resin> Heat-resistant synthetic resin layer 2, soft synthetic resin intermediate layer 3,
The vinyl chloride resin used in the vinyl chloride resin paste composition for forming the soft synthetic resin top layer 4 includes commonly used emulsion polymerized vinyl chloride resins, suspension polymerized vinyl chloride resins, bulk polymerized vinyl chloride resins, etc. Vinyl chloride resin can be used. Also,
In addition to vinyl chloride homopolymer, vinyl acetate,
Copolymers of vinyl chloride and one or more of ethylene, alkyl ethers, acrylic esters, methacrylic esters, etc. can also be used, and these homopolymers and copolymers can be used alone or in combination. Also, other polymers can be blended with the vinyl chloride resins as described above. Examples of resins that can be blended include, but are not limited to, acrylonitrile-butadiene copolymers, ethylene-vinyl acetate copolymers, acrylonitrile-butadiene-styrene copolymers, and acrylic resins. <Plasticizer> As the plasticizer, commonly used plasticizers can be used, examples of which are listed below. Phthalate ester plasticizers include dimethyl phthalate, diethyl phthalate, dibutyl phthalate, diisobutyl phthalate, dioctyl phthalate, octyl capryl phthalate, dicyclohexyl phthalate, didodecyl phthalate, butyl benzyl phthalate, dimethyl glycol phthalate, ethyl phthalyl ethyl glycolate, Methylphthalyl ethyl glycolate, butylphthalyl butyl glycolate, diisodecyl phthalate, etc. are used. Examples of phosphorous ester plasticizers include tributyl phosphate, tricresyl phosphate, triphenyl phosphate, trichloroethyl phosphate, trioctyl phosphate, triethyl phosphate, diphenyl cresyl phosphate, arylalkyl phosphate, Diphenyl monoorthoxenyl phosphate and the like are used. Examples of fatty acid ester plasticizers include methyl acetyl ricinoleate, dioctyl adipate, dioctyl azelate, dibutyl sebacate, dioctyl sebacate, triacetyl glycerin, glycerol butyrate, diisodecyl succinate, diisodecyl adipate, succinic acid mixed alkyl ester, etc. used. In addition, trimellitic acid ester plasticizers such as trioctyl trimellitic acid, epoxy plasticizers such as epoxidized soybean oil and various epoxy resins, polyester polymer plasticizers, etc. can also be used. Furthermore, for the purpose of reducing the viscosity of the vinyl chloride resin paste, small amounts of viscosity modifiers such as gasoline, octane, benzene, toluene, naphtha,
A volatile diluent such as a dodecylbenzene derivative or a viscosity reducing agent such as various surfactants may be used in combination with the plasticizer. <Stabilizer> Any stabilizer that is normally used for vinyl chloride resin can be used. Specifically, in addition to metal stabilizers such as cadmium, zinc, barium, calcium, strontium, aluminum, magnesium, cerium, sodium, lead, and tin,
Organic phosphorus compounds, polyhydric alcohols, epoxy compounds, etc. can be used alone or in combination of two or more. The amount of the stabilizer added is preferably 0.1 to 10 parts by weight per 100 parts by weight of the vinyl chloride resin. <Synthetic resin emulsion, synthetic rubber latex> Any commonly used non-reactive synthetic resin emulsion or synthetic rubber latex can be used. Specifically, vinyl chloride resin emulsion, vinyl chloride-ethylene copolymer emulsion, vinyl chloride-vinylidene chloride copolymer emulsion, vinyl chloride-vinyl acetate copolymer emulsion, vinylidene chloride resin emulsion, vinyl acetate resin emulsion, and acetic acid. Synthetic resin emulsions such as vinyl-acrylic copolymer emulsion, ethylene-vinyl acetate copolymer emulsion, acrylic resin emulsion, acrylic-styrene copolymer emulsion, urethane resin emulsion, or SBR latex, NBR latex, CR latex, IIR Synthetic rubber latex such as latex can be used. These may be used alone or in combination of two or more. In addition to the above emulsions and latexes, solutions of synthetic resins and synthetic rubbers dissolved in organic solvents or water can also be used in the same way as the above emulsions and latexes. Any commonly used synthetic resin emulsion or synthetic rubber latex can be used, but specifically, reactive groups such as carboxyl groups, hydroxyl groups, and amide groups are introduced into the emulsion or latex polymer. Products that are heat-crosslinked by adding an initial condensate of melamine or urea as a crosslinking agent, or products that have reactive groups such as glycidyl groups or methylol groups introduced into emulsions or latex polymers, such as acrylic esters or methacrylic esters. An emulsion obtained by copolymerizing the main component with glycidyl acrylate or glycidyl methacrylate and tert-butyl or amyl acrylate, or an emulsion obtained by copolymerizing styrene acrylate and acrylamide and then adding methylol Self-crosslinking emulsions and latexes such as emulsions obtained by oxidation can be used. Reactive synthetic resin emulsions and synthetic rubber latexes include acrylic resin emulsions, vinyl acetate resin emulsions, vinyl acetate-acrylic copolymer emulsions, vinyl chloride-vinyl acetate copolymer emulsions, SBR latexes, NBR latexes, CR latexes, etc. It is raised. These may be used alone or in combination of two or more. It is also possible to use these reactive synthetic resin emulsions and synthetic rubber latexes in combination with the non-reactive synthetic resin emulsions and synthetic rubber latexes.
In addition to the above-mentioned emulsions and latexes, solutions of synthetic resins and synthetic rubbers having the above-mentioned reactive groups dissolved in organic solvents or water can also be used in the same manner as the above-mentioned emulsions and latexes. <Compounds that crosslink by heating, ultraviolet rays, or electron beam irradiation> The following compounds can be used as compounds that crosslink by means such as heating, ultraviolet irradiation, or electron beam irradiation, but the present invention is not limited to these in any way. It's not a thing. ethylene glycol, propylene glycol,
Acrylic acid or methacrylic acid and aliphatic polyhydric alcohol such as butylene glycol, 1,6-hexanediol, neopentyl glycol, polyethylene glycol, polypropylene glycol, trimethylolpropane, trimethylolmethane, glycerin, pentaerythritol, dipentaerythritol, etc. Isocyanurate derivatives such as triallyl isocyanurate and tris(2-methacryloyl, oxyethyl)-isocyanurate; bisphenol A epoxy resin, phenol novolak epoxy resin, cresol novolak epoxy Acrylic modified epoxy resin obtained from an epoxy compound having at least two or more epoxy groups in one molecule of resin etc. and an unsaturated monobasic acid; a polyvalent cycloacetal compound and a glycol unsaturated monocarboxylic acid monoester or polyvalent Unsaturated cycloacetal resin, which is a reaction product with alcohol unsaturated monocarboxylic acid ester monool; acrylic modified polyester resin such as oligoester acrylate; acrylic modified polyurethane resin; unsaturated polyester resin; diallyl phthalate, etc. They may be used alone or in combination. Furthermore, monofunctional monomers such as styrene monomers, methacrylic acid ester monomers, and acrylic ester monomers may be used in combination with the above-mentioned polyfunctional compounds as reactive thinning agents. The amount of the polyfunctional compound added is preferably 10 to 100 parts by weight per 100 parts by weight of the resin. <Weight initiator, catalyst> As the weight initiator, commonly used ones can be used. For example, methyl ethyl ketone peroxide, cyclohexanone peroxide, t-butyl hydroperoxide, cumene hydroperoxide, di-t-butyl peroxide,
t-Butylcumyl peroxide, dicumyl peroxide, 2,5-dimethyl 2,5-di(t-
butylperoxy)hexane, 2,5-dimethyl2,5-di(t-butylperoxy)hexane,
1,3-bis(t-butylperoxyisopropyl)benzene, 1,1-bis(t-butylperoxy)3,3,5-trimethylcyclohexane,
n-butyl 4,4-bis(t-butylperoxy)valate, benzoyl peroxide, p-
Organic peroxides such as chlorobenzoyl peroxide, 2,4-dichlorobenzoyl peroxide, t-butyl peroxybenzoate, and t-butyl peroxyisopropyl carbonate are common, and these can be used alone or in combination of two or more. and use it. Further, as the catalyst, amines such as dimethylaniline and dimethyl para-toluidine, and metal compounds such as cobalt naphthenate and zinc naphthenate are generally used. The appropriate amount of the polymerization initiator added is 0.5 to 10% by weight of the polyfunctional compound. <Photosensitizer> As the photosensitizer, commonly used ones can be used. For example, benzoin, α-methylbenzoin, α-allylbenzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin n-butyl ether, benzoin isobutyl ether, acetophenone, benzophenone, p-bromobenzophenone, 4.4' -tetramethyldiaminobenzophenone, diphenyl disulfide, benzyl, etc., and these can be used alone or in combination of two or more. The amount of photosensitizer added depends on the amount of the polyfunctional compound.
0.5% to 10% by weight is suitable. Further, when the polyfunctional compound is crosslinked by electron beam irradiation, it is not necessary to use a photosensitizer or the like. <Crosslinking agent> In addition to the above polyfunctional compounds, halogenated synthetic resin compositions, such as vinyl chloride resin, copolymers of vinyl chloride and vinyl acetate, ethylene, alkyl ethers, acrylic esters, methacrylic esters, etc., vinylidene chloride When using a synthetic resin composition such as resin or chloroprene rubber, 2-dibutylamino-4,6-dithiocyanuric acid, 2-dicyclohexylamino-4,6-
Dithiocyanuric acid, 2-dibenzylamino-4.
6-dithiocyanuric acid, 2-diphenylamino-
4,6-dithiocyanuric acid, 2-anilino-4.
A crosslinking agent such as 6-dithiocyanuric acid or a metal salt of such a dithiocyanuric acid derivative, and, if necessary, an acid acceptor such as magnesium oxide, calcium oxide, zinc oxide, barium oxide, lead oxide, calcium carbonate, and the like. It is also possible to add a crosslinking accelerator or the like. The amount of the crosslinking agent added is preferably 0.5 to 20 parts by weight based on 100 parts by weight of the halogenated synthetic resin. As a crosslinking agent that is added to synthetic resin emulsion or synthetic rubber latex as necessary, initial condensates of melamine and urea are used, but the present invention is not limited to these in any way. do not have. <Fillers with excellent heat resistance> Inorganic and/or organic fillers with excellent heat resistance are basically those that do not undergo physical or chemical changes such as melting or decomposition at processing temperatures. You can use anything, but here is an example. Calcium carbonate, magnesium carbonate, clay, talc, silica, diatomaceous earth, silica sand, pumice powder, slate powder, mica powder, asbestos, aluminum hydroxide, aluminum oxide, aluminum sulfate, barium sulfate, calcium sulfate, glass bulbs, foaming Inorganic fillers such as glass bulbs, fly ash bulbs, volcanic glass hollow bodies (shirasu balloons), powdered cellulose (cellulose padder), polyvinyl alcohol fibers, cork powder, wood powder, thermosetting resin powder, thermosetting resin hollows Organic fillers such as spheres can be used. <Chemical foaming agent> As the chemical foaming agent used in the present invention, commonly used chemical foaming agents can be used, and examples thereof are listed below. N・N′-dinitrosopentamethylenetetramine, N・N′-dimethyl-N・N′-dinitrosoterephthalamide, azodicarbonamide, azobisisobutyronitrile, benzelsulfonylhydrazide, P・P′-oxybis (benzenesulfonylhydrazide), benzene-1,3-disulfonylhydrazide, toluenesulfonylhydrazide, etc. can be used. <Foam stabilizer> When forming a foam layer by mechanical foaming, it is preferable to use a foam stabilizer, but any commonly used foam stabilizer can be used, such as methylsiloxane emulsion. , methylsiloxane, silicone foam stabilizers such as xylene solutions, fluorine foam stabilizers, fatty acid condensates, alkylaryl sulfonates, metal soaps of oleic acid and ricinoleic acid, guanidine salts, quaternary ammonium compounds, aldehydes. Condensation products of amines and the like are used. <Viscosity modifier> Viscosity modifiers are broadly classified into thinners and thickeners.
As the viscosity reducing agent, commonly used ones can be used, examples of which are listed below. If the liquid synthetic resin composition is an oil dispersion system such as vinyl chloride resin plastisol or a solution of synthetic resin or synthetic rubber dissolved in an organic solvent, gasoline, octane, benzene, toluene, xylene, naphtha, dodecylbenzene derivatives, methyl ethyl ketone, Volatile diluents such as methyl isobutyl ketone, various surfactants, etc. are used, and when the liquid synthetic resin composition is an aqueous dispersion system such as a synthetic resin emulsion, synthetic rubber latex, or an aqueous solution of synthetic resin or synthetic rubber, Alcohols such as water, methanol, ethanol, and isopropyl alcohol are used. Alternatively, commonly used thickeners can be used, examples of which are listed below. When the liquid synthetic resin composition is an oil dispersion system as described above, metal soaps such as aluminum stearate, aluminum oleate, zinc stearate, silica, bentonite, polymerized oil, etc.
When the liquid synthetic resin composition is an aqueous dispersion system as described above, silica, bentonite, chemically modified precipitated calcium carbonate, ammonium salts of polymeric organic acids,
Water-soluble acrylic polymer, acrylic emulsion copolymer, crosslinked acrylic emundion copolymer, ammonium, polymethacrylate, ammonium polyacrylate, sodium polyacrylate,
Modified sodium polyacrylate, partially oxidized polyacrylic ester, methyl cellulose, carboxyl methyl cellulose, hydroxyethyl cellulose, cellulose sodium glycolate, polyvinyl alcohol, ammonia water, etc. can be used. When adjusting the viscosity of a liquid synthetic resin composition to a viscosity suitable for processing, these viscosity modifiers are added in an appropriate amount as necessary. (Examples) Examples are given below to explain the present invention in more detail, but the present invention is not limited to these Examples. <Formulation Examples> Typical formulation examples and comparative formulation examples of liquid synthetic resin compositions for forming the heat-resistant synthetic resin layer 2 are shown in the table below.
1. Table 2 shows typical blending examples of the vinyl chloride resin composition for forming the soft synthetic resin intermediate layer 3, and further shows typical formulation examples of the vinyl chloride resin composition for forming the soft synthetic resin top layer 4. Examples of formulations are listed in Table 3.
【表】【table】
【表】【table】
【表】
実施例 1
0.22m/mの繊維組織の粗なガラス繊維上に配
合例1のエチレン−酢酸ビニル共重合体エマルジ
ヨンを乾燥後の全厚味が0.4m/mとなる様にド
クターナイフコーターにて塗布し、加熱炉内で
140℃で5分間加熱乾燥し、耐熱性合成樹脂層を
形成し冷却後巻取る。そして、上記エチレン−酢
酸ビニル共重合体エマルジヨンの塗布面と反対側
の面に配合例2の塩化ビニル樹脂ペーストを0.5
m/mの厚味で塗布し、加熱炉中で180℃で1分
間加熱固化した後、この表面にグラビア印刷機に
て所定の模様を印刷した後、この表面に配合例3
の塩化ビニル樹脂ペーストを0.3m/mの厚味で
塗布し、加熱炉内で200℃で3分間加熱発泡して、
冷却後巻取ることにより、床材を作成した。上記
エチレン−酢酸ビニル共重合体エマルジヨンによ
り形成された耐熱性合成樹脂層は加熱炉内の200
℃に熱された支持体に接触しても、これに粘着す
ることなく容易に加熱炉内を通過し、上記床材を
得ることが出来た。この床材を合成ゴムラテツク
ス系の接着剤にて合板に貼り、約1週間乾燥した
後、剥離した結果、上記耐熱性合成樹脂層の薄層
を下地に残し剥離することが出来ることを確認出
来た。又、この床材を200m/m×200m/mの大
きさに切り、これを300m/m×300m/mの合板
に合成ゴムラテツクス系の接着剤を用いて貼りつ
け、これを7日間室温にて乾燥後、70℃の温度下
で200時間放置し、床材の反りが生じてないか否
かを観察した結果、反りの発生は認められず、こ
の床材は、剥離可能な床材として必要な基本的性
能を具備していることが確認された。試験結果は
表−4に示す。
比較例 1
0.22m/mの繊維組織の粗なガラス繊維紙上に
比較配合例1のエチレン−酢酸ビニル共重合体エ
マルジヨンを乾燥後の全厚味が0.3m/mとなる
様にドクターナイフコーターにて塗布し、加熱炉
内で80℃×10分間加熱乾燥し、合成樹脂層を形成
し、冷却後巻取る。そして、上記エチレン−酢酸
ビニル共重合体エマルジヨンの塗布面と反対側の
面に配合例2の塩化ビニル樹脂ペーストをドクタ
ーナイフコーターにて0.55m/mの厚味で塗布
し、加熱炉内で180℃で加熱固化しようとしたと
ころ、比較配合例1のエチレン−酢酸ビニル共重
合体にて形成された合成樹脂層が加熱炉内の180
℃に熱された支持体に接触した際にこれに粘着
し、加熱炉内で切断して所定の床材を得ることが
出来なかつた。
比較例 2
0.8m/mのアスベスト紙上に配合例2の塩化
ビニル樹脂ペーストをドクターナイフコーターに
て0.3m/mの厚味で塗布し、加熱炉内で180℃で
1分間加熱固化した後、この表面にグラビア印刷
機にて所定の模様に印刷した後、配合例3の塩化
ビニル樹脂ペーストをドクターナイフコーターに
て0.30m/mの厚味で塗布し、加熱炉内で200℃
で3分間加熱して床材を作成した。この床材につ
いて実施例1と同様の方法で剥離性を試験した結
果、厚いアスベスト層が下地に部分的に残着し、
下地の凹凸が大となり、この上に床材を施工する
ことが出来ない状態であり、剥離可能な床材とは
言えないものであつた。[Table] Example 1 Apply the ethylene-vinyl acetate copolymer emulsion of Formulation Example 1 on a coarse glass fiber with a fiber structure of 0.22 m/m using a doctor knife so that the total thickness after drying becomes 0.4 m/m. Apply with a coater and heat in a heating furnace.
Heat and dry at 140°C for 5 minutes to form a heat-resistant synthetic resin layer, cool and then roll up. Then, 0.5% of the vinyl chloride resin paste of Blend Example 2 was applied to the surface opposite to the coated surface of the ethylene-vinyl acetate copolymer emulsion.
After coating with a thickness of m/m and heating and solidifying in a heating oven at 180°C for 1 minute, a predetermined pattern was printed on this surface using a gravure printer, and then Formulation Example 3 was applied to this surface.
PVC resin paste was applied to a thickness of 0.3 m/m, heated and foamed in a heating oven at 200°C for 3 minutes,
A flooring material was created by winding it up after cooling. The heat-resistant synthetic resin layer formed from the above ethylene-vinyl acetate copolymer emulsion is
Even when it came into contact with a support heated to .degree. C., it did not stick to the support and easily passed through the heating furnace, yielding the above-mentioned flooring material. This flooring material was attached to plywood using a synthetic rubber latex adhesive, dried for about a week, and then peeled off. As a result, it was confirmed that the thin layer of the heat-resistant synthetic resin layer could be left behind on the base and could be removed. . Also, cut this flooring material into a size of 200m/m x 200m/m, paste it on a 300m/m x 300m/m plywood board using a synthetic rubber latex adhesive, and leave it at room temperature for 7 days. After drying, we left the flooring at a temperature of 70℃ for 200 hours and observed whether or not the flooring material had warped. As a result, no warping was observed, and this flooring material is necessary as a removable flooring material. It was confirmed that it has the same basic performance. The test results are shown in Table-4. Comparative Example 1 The ethylene-vinyl acetate copolymer emulsion of Comparative Formulation Example 1 was coated on glass fiber paper with a coarse fiber structure of 0.22 m/m using a doctor knife coater so that the total thickness after drying was 0.3 m/m. The resin layer is applied by heating and drying in a heating oven at 80°C for 10 minutes to form a synthetic resin layer, and after cooling, it is rolled up. Then, the vinyl chloride resin paste of Formulation Example 2 was applied to the surface opposite to the applied surface of the ethylene-vinyl acetate copolymer emulsion to a thickness of 0.55 m/m using a doctor knife coater, and heated to a thickness of 180 m/m in a heating furnace. When attempting to solidify by heating at ℃, the synthetic resin layer formed from the ethylene-vinyl acetate copolymer of Comparative Formulation Example 1 was heated to 180℃ in the heating furnace.
When it came into contact with a support heated to .degree. C., it stuck to the support, and it was not possible to cut it in a heating furnace to obtain the desired flooring material. Comparative Example 2 The vinyl chloride resin paste of Formulation Example 2 was coated on 0.8 m/m asbestos paper with a thickness of 0.3 m/m using a doctor knife coater, and after solidifying by heating at 180°C for 1 minute in a heating furnace, After printing a predetermined pattern on this surface using a gravure printing machine, the vinyl chloride resin paste of Formulation Example 3 was applied to a thickness of 0.30 m/m using a doctor knife coater, and heated to 200°C in a heating furnace.
The material was heated for 3 minutes to create a flooring material. As a result of testing the removability of this flooring material in the same manner as in Example 1, it was found that a thick asbestos layer remained partially on the base.
The base was so uneven that it was impossible to construct a flooring material on top of it, and it could not be said to be a removable flooring material.
【表】
(効果)
本発明においては、繊維質基材1に液状合成樹
脂組成物を塗布含浸することにより、該繊維質基
材1が液状合成樹脂組成物により一体化され、さ
らに、一体化する手段が液状合成樹脂組成物を加
熱、紫外線照射又は電子線照射により固化する方
法であり、加工時の内部歪がほとんどない為、前
記特公昭47−41848号公報におけるが如き床材の
実用時の層間剥離及び充填剤を多量に混入した密
組織の軟質プラスチツク層の接合時の内部歪によ
る床材の寸法安定性悪化等の問題がない。
さらに、繊維質基材1に塗布含浸する液状合成
樹脂組成物として、床材施工用の接着剤にて実用
時に剥離を起こさない程度に下地と接着し、且つ
床材を剥離する際には該液状合成樹脂組成物の固
化により得られる耐熱性合成樹脂層2の破壊によ
り耐熱性合成樹脂層2の薄層が接着剤と共に下地
に残る様な形で剥離する様なものを使用するた
め、床材の実用時の剥離等の問題がない。
また、本発明の積層床材はアスベストシートを
基材とした従来の床材に比して基材が床材表面に
多量に残着したりすることもなく、再施工が容易
であるという効果を奏するものである。[Table] (Effects) In the present invention, by coating and impregnating the fibrous base material 1 with a liquid synthetic resin composition, the fibrous base material 1 is integrated with the liquid synthetic resin composition, and further, the fibrous base material 1 is integrated with the liquid synthetic resin composition. The method of solidifying the liquid synthetic resin composition is by heating, ultraviolet irradiation, or electron beam irradiation, and since there is almost no internal distortion during processing, it is difficult to use the flooring material as described in Japanese Patent Publication No. 47-41848 in practical use. There are no problems such as delamination between layers or deterioration of the dimensional stability of the flooring material due to internal strain during bonding of the soft plastic layer with a dense structure containing a large amount of filler. Furthermore, as a liquid synthetic resin composition to be applied and impregnated onto the fibrous base material 1, it can be used as an adhesive for flooring construction to adhere to the base to such an extent that no peeling occurs during practical use, and when the flooring material is to be peeled off, The flooring is made of a material that peels off in such a way that the thin layer of the heat-resistant synthetic resin layer 2 remains on the base together with the adhesive when the heat-resistant synthetic resin layer 2 obtained by solidifying the liquid synthetic resin composition is destroyed. There are no problems such as peeling of the material during practical use. In addition, the laminated flooring material of the present invention has the advantage that, compared to conventional flooring materials based on asbestos sheets, a large amount of the base material does not remain on the surface of the flooring material, and re-installation is easy. It is something that plays.
図は本発明の実施例を示す拡大断面図である。
1……繊維質基材、2……耐熱性合成樹脂層、
3……軟質合成樹脂中間層、4……軟質合成樹脂
上引層、5……印刷層。
The figure is an enlarged sectional view showing an embodiment of the present invention. 1... Fibrous base material, 2... Heat resistant synthetic resin layer,
3... Soft synthetic resin intermediate layer, 4... Soft synthetic resin top layer, 5... Printing layer.
Claims (1)
布含浸しこれを固化してなる厚味0.5m/m以下
の耐熱性合成樹脂層を有し、他の片側に軟質合成
樹脂中間層と軟質合成樹脂上引層が順次積層され
てなる積層床材であつて、 前記耐熱性合成樹脂層は、積層床材を下地より
剥離する際に、下地側接着剤に薄層を残着させて
層破壊する性質の層であるこを特徴とする積層床
材。[Scope of Claims] 1. A heat-resistant synthetic resin layer with a thickness of 0.5 m/m or less obtained by coating and impregnating a liquid synthetic resin composition on one side of a fibrous base material and solidifying it, and on the other side. This is a laminated flooring material in which a soft synthetic resin intermediate layer and a soft synthetic resin top layer are sequentially laminated, and the heat-resistant synthetic resin layer is formed by applying a thin layer to the adhesive on the base side when the laminated flooring material is peeled from the base material. A laminated flooring material characterized by a layer that remains attached to the layer and breaks down.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63007353A JPS63217061A (en) | 1988-01-16 | 1988-01-16 | Laminated floor material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63007353A JPS63217061A (en) | 1988-01-16 | 1988-01-16 | Laminated floor material |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63217061A JPS63217061A (en) | 1988-09-09 |
JPH0351833B2 true JPH0351833B2 (en) | 1991-08-08 |
Family
ID=11663592
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63007353A Granted JPS63217061A (en) | 1988-01-16 | 1988-01-16 | Laminated floor material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63217061A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010069729A (en) * | 2008-09-18 | 2010-04-02 | Okamoto Ind Inc | Heat molding decorative sheet and method for producing the same |
KR102471551B1 (en) * | 2022-08-24 | 2022-11-28 | 권혁섭 | A flooring materials using hemp fiber |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3968290A (en) * | 1973-05-16 | 1976-07-06 | Armstrong Cork Company | Non-woven fabric floor |
-
1988
- 1988-01-16 JP JP63007353A patent/JPS63217061A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3968290A (en) * | 1973-05-16 | 1976-07-06 | Armstrong Cork Company | Non-woven fabric floor |
Also Published As
Publication number | Publication date |
---|---|
JPS63217061A (en) | 1988-09-09 |
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