JPH0350975B2 - - Google Patents

Info

Publication number
JPH0350975B2
JPH0350975B2 JP59027684A JP2768484A JPH0350975B2 JP H0350975 B2 JPH0350975 B2 JP H0350975B2 JP 59027684 A JP59027684 A JP 59027684A JP 2768484 A JP2768484 A JP 2768484A JP H0350975 B2 JPH0350975 B2 JP H0350975B2
Authority
JP
Japan
Prior art keywords
substrate
chip
infrared rays
paste
conductive paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59027684A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60171441A (ja
Inventor
Yasuo Shimoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP59027684A priority Critical patent/JPS60171441A/ja
Publication of JPS60171441A publication Critical patent/JPS60171441A/ja
Publication of JPH0350975B2 publication Critical patent/JPH0350975B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/72—Investigating presence of flaws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Die Bonding (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP59027684A 1984-02-16 1984-02-16 ダイボンド接着状態の検出方法 Granted JPS60171441A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59027684A JPS60171441A (ja) 1984-02-16 1984-02-16 ダイボンド接着状態の検出方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59027684A JPS60171441A (ja) 1984-02-16 1984-02-16 ダイボンド接着状態の検出方法

Publications (2)

Publication Number Publication Date
JPS60171441A JPS60171441A (ja) 1985-09-04
JPH0350975B2 true JPH0350975B2 (ref) 1991-08-05

Family

ID=12227790

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59027684A Granted JPS60171441A (ja) 1984-02-16 1984-02-16 ダイボンド接着状態の検出方法

Country Status (1)

Country Link
JP (1) JPS60171441A (ref)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0210256A (ja) * 1988-06-29 1990-01-16 Ishikawajima Kensa Keisoku Kk セラミックス基板の探傷方法
US5228776A (en) * 1992-05-06 1993-07-20 Therma-Wave, Inc. Apparatus for evaluating thermal and electrical characteristics in a sample
DE102015122733A1 (de) * 2015-12-23 2017-06-29 Bundesdruckerei Gmbh Inspektionsvorrichtung und Verfahren zum Verifizieren einer Klebstoffverbindung
JPWO2022264773A1 (ref) * 2021-06-16 2022-12-22

Also Published As

Publication number Publication date
JPS60171441A (ja) 1985-09-04

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees