JPH035079U - - Google Patents
Info
- Publication number
- JPH035079U JPH035079U JP6402789U JP6402789U JPH035079U JP H035079 U JPH035079 U JP H035079U JP 6402789 U JP6402789 U JP 6402789U JP 6402789 U JP6402789 U JP 6402789U JP H035079 U JPH035079 U JP H035079U
- Authority
- JP
- Japan
- Prior art keywords
- heat pipe
- boss
- mounting hole
- holding plate
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000009434 installation Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6402789U JPH035079U (fr) | 1989-06-02 | 1989-06-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6402789U JPH035079U (fr) | 1989-06-02 | 1989-06-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH035079U true JPH035079U (fr) | 1991-01-18 |
Family
ID=31594598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6402789U Pending JPH035079U (fr) | 1989-06-02 | 1989-06-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH035079U (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020100447A1 (fr) * | 2018-11-13 | 2020-05-22 | Ｎｅｃプラットフォームズ株式会社 | Structure de dissipation de chaleur |
-
1989
- 1989-06-02 JP JP6402789U patent/JPH035079U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020100447A1 (fr) * | 2018-11-13 | 2020-05-22 | Ｎｅｃプラットフォームズ株式会社 | Structure de dissipation de chaleur |
| JP2020080381A (ja) * | 2018-11-13 | 2020-05-28 | Ｎｅｃプラットフォームズ株式会社 | 放熱構造体 |
| US11979993B2 (en) | 2018-11-13 | 2024-05-07 | Nec Platforms, Ltd. | Heat dissipation structure |
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