JPH035079U - - Google Patents
Info
- Publication number
- JPH035079U JPH035079U JP6402789U JP6402789U JPH035079U JP H035079 U JPH035079 U JP H035079U JP 6402789 U JP6402789 U JP 6402789U JP 6402789 U JP6402789 U JP 6402789U JP H035079 U JPH035079 U JP H035079U
- Authority
- JP
- Japan
- Prior art keywords
- heat pipe
- boss
- mounting hole
- holding plate
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000009434 installation Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第1図は、本考案のヒートパイプ取付け構造の
分解側面図、第2図は、弾性リングによるシール
の状態を示す部分拡大図、第3図は、本考案によ
つて取付けられたヒートパイプの状態を示す側面
図、第4図は、本考案が適用される通信機器用筺
体の斜視図、第5図は、従来のヒートパイプ取付
け状態を示す側面図である。
11……筺体、12……保持板、13……ヒー
トパイプ、14……壁材、15……吸熱フイン、
15’……放熱フイン、16……取付け孔、17
……接着剤、18……貫通開口、19……ボス、
20……環状凹部、21……弾性リング、22…
…シール用テープ、23……ビス。
Fig. 1 is an exploded side view of the heat pipe mounting structure of the present invention, Fig. 2 is a partially enlarged view showing the state of the seal by the elastic ring, and Fig. 3 is the heat pipe installed according to the present invention. FIG. 4 is a perspective view of a communication device casing to which the present invention is applied, and FIG. 5 is a side view showing a state in which a conventional heat pipe is installed. 11... Housing, 12... Holding plate, 13... Heat pipe, 14... Wall material, 15... Endothermic fin,
15'...Radiation fin, 16...Mounting hole, 17
...Adhesive, 18...Through opening, 19...Boss,
20... Annular recess, 21... Elastic ring, 22...
...Sealing tape, 23...screws.
Claims (1)
体11の壁面に設けられた取付け孔16に、筺体
内部で発生した熱を外部に放散させるためのヒー
トパイプ13を挿通し、保持板12を用いて固定
する構造であつて、該保持板12に前記取付け孔
16と一致する貫通開口18を有するボス19を
設け、該ボス19の内面側に前記取付け孔16の
外径よりも大きい環状凹部20を形成する肩部を
設け、取付けに際し、接着剤17を胴部に塗布し
たヒートパイプ13を前記取付け孔13を通じて
壁面に挿通して位置決めし、前記ボス19の環状
凹部20内に弾性リング21を嵌めた状態で前記
保持板12の貫通開口18にヒートパイプ13を
挿通して保持板12を筺体11の壁面に固定し、
更に必要に応じて、ボス19の突出端とヒートパ
イプ13の胴部との間をシール用テープ22で密
閉するように構成された放熱用ヒートパイプの取
付け構造。 A heat pipe 13 for dissipating heat generated inside the housing to the outside is inserted into a mounting hole 16 provided on the wall of a housing 11 that houses communication equipment and is installed outdoors, and the retainer plate 12 is inserted. The holding plate 12 is provided with a boss 19 having a through opening 18 that coincides with the mounting hole 16, and an annular recess larger than the outer diameter of the mounting hole 16 is provided on the inner surface of the boss 19. At the time of installation, the heat pipe 13 with adhesive 17 applied to the body is inserted into the wall surface through the mounting hole 13 and positioned, and the elastic ring 21 is inserted into the annular recess 20 of the boss 19. The heat pipe 13 is inserted into the through opening 18 of the holding plate 12 in a state in which the holding plate 12 is fitted, and the holding plate 12 is fixed to the wall surface of the housing 11.
Furthermore, the heat dissipation heat pipe mounting structure is configured to seal the space between the protruding end of the boss 19 and the body of the heat pipe 13 with a sealing tape 22 as required.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6402789U JPH035079U (en) | 1989-06-02 | 1989-06-02 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6402789U JPH035079U (en) | 1989-06-02 | 1989-06-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH035079U true JPH035079U (en) | 1991-01-18 |
Family
ID=31594598
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6402789U Pending JPH035079U (en) | 1989-06-02 | 1989-06-02 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH035079U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020100447A1 (en) * | 2018-11-13 | 2020-05-22 | Necプラットフォームズ株式会社 | Heat dissipation structure |
-
1989
- 1989-06-02 JP JP6402789U patent/JPH035079U/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020100447A1 (en) * | 2018-11-13 | 2020-05-22 | Necプラットフォームズ株式会社 | Heat dissipation structure |
JP2020080381A (en) * | 2018-11-13 | 2020-05-28 | Necプラットフォームズ株式会社 | Heat radiation structure |
US11979993B2 (en) | 2018-11-13 | 2024-05-07 | Nec Platforms, Ltd. | Heat dissipation structure |
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