JPH0350799A - Mounting of electrical component onto wiring board - Google Patents

Mounting of electrical component onto wiring board

Info

Publication number
JPH0350799A
JPH0350799A JP18634289A JP18634289A JPH0350799A JP H0350799 A JPH0350799 A JP H0350799A JP 18634289 A JP18634289 A JP 18634289A JP 18634289 A JP18634289 A JP 18634289A JP H0350799 A JPH0350799 A JP H0350799A
Authority
JP
Japan
Prior art keywords
wiring board
chassis
type
electrical component
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18634289A
Other languages
Japanese (ja)
Inventor
Mitsuru Yoshida
充 吉田
Tadao Noguchi
野口 直男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alpine Electronics Inc
Original Assignee
Alpine Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alpine Electronics Inc filed Critical Alpine Electronics Inc
Priority to JP18634289A priority Critical patent/JPH0350799A/en
Publication of JPH0350799A publication Critical patent/JPH0350799A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To dip the electrical part of a second kind with solder together with the electrical part of a first kind, and to prevent the possibility of the displacement of a second position by previously fixing the electrical part of the second kind to a chassis and installing the electrical part of the second kind to a wiring board together with the chassis. CONSTITUTION:The electrical parts 3, 4 of a first kind are mounted to a wiring board 1, and the leads of the electrical parts 3, 4 are inserted into the terminal inserting holes of the board. A chassis 2 to which the electrical parts 6-11 of a second kind are fixed is placed on the wiring board 1 to which the electrical parts of the first kind are mounted. Each terminal 6a-11a of the electrical parts 6-11 of the second kind is inserted into each terminal inserting hole 12-17 of the wiring board 1 at that time while each pawl section 19 is inserted into each notch 20 of the wiring board 1 or fitted to edge sections. Each pawl section 19 is bent to the inside, and the wiring board 1 is set up to the chassis 2. The wiring board 1 set up is moved forward onto the solder jet section of a solder tank as the rear of the wiring board 1 is brought to the state in which the rear is positioned to a lower section, and dipped with solder. Accordingly, assembly operation is simplified largely, and cost can be reduced.

Description

【発明の詳細な説明】 〔産業上の利用分野1 本発明は、音響装置などの組立時において電気部品を配
線基板に装着(マウント及び半田付)する方法に係り、
特に、シャーシにねじ止めなどで固定される電気部品の
配線基板への半田付を手作業によることなく効率的に行
うことができる電気部品の配線基板への装着方法に関す
る。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field 1] The present invention relates to a method for mounting (mounting and soldering) electrical components on a wiring board during assembly of an audio device, etc.
In particular, the present invention relates to a method for attaching electrical components to a wiring board, which allows efficient soldering of electrical components fixed to a chassis by screws or the like to the wiring board without manual work.

[従来の技術1 車載用の音響装置などの組立時においては、配線基板の
配線パターンに各種の電気部品のリードが半田付けされ
て装着されるようになっている。
[Prior Art 1] When assembling an in-vehicle audio device, leads of various electrical components are soldered and attached to the wiring pattern of a wiring board.

このような電気部品の中には、抵抗、コンデンサ、ダイ
オード、トランジスタなどのように、配線基板に実装(
マウント)され、そのリードが端子挿通穴に挿通されて
導体パターンと半田付けされる第1の種類の電気部品と
、ボリュームやコネクタなどのように、シャーシにねじ
止めなどにより固定され且つ配線基板の端子挿入穴に端
子が挿入されて導体パターンに半田付けされる第2の種
類の電気部品とがある。
Some of these electrical components, such as resistors, capacitors, diodes, and transistors, are mounted on wiring boards (
The first type of electrical component is mounted (mounted), the lead of which is inserted into a terminal insertion hole and soldered to a conductor pattern; There is a second type of electrical component in which a terminal is inserted into a terminal insertion hole and soldered to a conductor pattern.

音響装置などの組立時においては、上記のような第1お
よび第2の種類の電気部品の双方を配線基板に装着(マ
ウント及び半田付)させる必要があるが、従来はこの作
業は次のような工程で行われていた。
When assembling an audio device, etc., it is necessary to mount (mount and solder) both the first and second types of electrical components as described above to the wiring board, but conventionally this work was done as follows. It was carried out in a process.

(a)配線基板に上記第1の種類の電気部品を自動機に
よりマウントし部品のリードを端子挿入穴に挿通させる
(a) The first type of electrical component is mounted on the wiring board using an automatic machine, and the leads of the component are inserted into the terminal insertion holes.

(b)上記配線基板の上記第2の種類の電気部品のリー
ドが挿通される予定の端子挿通穴を導体パターンが形成
された側からテープ等でマスキングする。
(b) Masking the terminal insertion hole of the wiring board into which the lead of the second type of electrical component is to be inserted with tape or the like from the side where the conductor pattern is formed.

(cl上記配線基板を半田槽の半田噴流部上に進行させ
て、導体パターンのランド部および第1の種類の電気部
品のリードに半田を付着固定させる(以下このような自
動化された半田付(作業)を「半田デイツプ(作業)」
という)、 (d)上記配線基板の上記(b)の工程でマスキングの
ために貼着したテープなどを除去する。
(cl) Advance the above-mentioned wiring board onto the solder jet part of the solder bath, and adhere and fix the solder to the land part of the conductor pattern and the lead of the first type of electrical component (hereinafter referred to as such automated soldering ( ``Solder dip (work)''
(d) Remove the tape and the like attached for masking in the step (b) above to the wiring board.

(el上記配線基板をシャーシに取り付けて、シャーシ
に予め取付けられていたボリュームやコネクタなどの第
2の種類の電気部品の端子を、マスクを除去した端子挿
入穴に挿入し、この端子と導体パターンとを手作業によ
り半田付けする。
(el) Attach the above wiring board to the chassis, insert the terminal of the second type of electrical component such as the volume or connector that was previously attached to the chassis into the terminal insertion hole from which the mask has been removed, and connect this terminal and the conductor pattern. and are manually soldered.

以上の各工程のうち上記(b)の工程は、半田デイツプ
((C)の工程)時に、後の(e)の工程で上記第2の
種類の電気部品のリードが挿通される予定の端子挿通穴
が半田でふさがってしまうことを防止するために行われ
るものである。また上記(elの工程については、第2
の種類の電気部品も第1の種類の電気部品と一緒に上記
(a)の工程で配線基板にマウントし、第1および第2
の種類の電気部品を一緒に上記(e)の工程で半田デイ
ツプする方法も考えられる。しかし第2の種類の電気部
品は比較的重量の大きい部品が多いため、第1の種類の
電気部品と一緒に半田デイツプすると半田デイツプ時に
位置がずれてしまい、その結果配線基板および第2の種
類の電気部品がシャーシに取付けられたとき取付歪が生
じ、これにより第2の種類の電気部品のリードにストレ
スがかかり部品破壊などの原因となってしまう、そのた
め、上記のような方法は実際上実施不可能であった。
Of the above steps, the step (b) is performed during soldering (step (C)) to the terminal into which the lead of the second type of electrical component is to be inserted in the later step (e). This is done to prevent the insertion hole from being blocked by solder. Also, regarding the above (el process), please refer to the second
The type of electrical components are also mounted on the wiring board in the step (a) above together with the first type of electrical components, and the first and second types of electrical components are
Another possible method is to solder-dip the types of electrical components together in the step (e) above. However, many of the second type of electrical components are relatively heavy, so if they are soldered together with the first type of electrical components, their positions may shift during soldering, resulting in the wiring board and the second type of electrical components being soldered together. When the second type of electrical component is installed on the chassis, installation distortion occurs, which places stress on the leads of the second type of electrical component and causes component damage. Therefore, the above method is not practical in practice. It was impossible to implement.

このような理由から、従来は第2の種類の電気部品のリ
ードを手作業で半田付する上記(e)の工程が不可欠と
なっていた6 〔考案が解決とようとする課題〕 しかしながら、上記のような従来の電気部品の配線基板
への装着方法では、特に上記各工程のうち、端子挿通穴
をテープ等でマスクする(blの工程や第2の種類の電
気部品のリードを手作業で半田付する(e)の工程が必
要とされているため、組立作業時に要する工数が非常に
多くなって作業の効率が悪くなり、またコストも高くな
ってしまうという問題があった。
For this reason, the process (e) above, in which the leads of the second type of electrical components are manually soldered, has traditionally been indispensable6. In the conventional method of mounting electrical components onto a wiring board, especially in each of the above steps, the terminal insertion holes are masked with tape, etc. Since the step (e) of soldering is required, there are problems in that the number of man-hours required during assembly work is extremely large, resulting in poor work efficiency and high costs.

本発明は上記のような課題を解決するためのものであり
、シャーシにねじ止めなどで固定される電気部品の配線
基板への半田付を手作業によることなく効率的に行うこ
とができる電気部品の配線基板への装着方法を提供する
ことを目的とする。
The present invention is intended to solve the above-mentioned problems, and provides an electrical component that can efficiently solder an electrical component fixed to a chassis with screws or the like to a wiring board without manual work. The purpose of the present invention is to provide a method for attaching the same to a wiring board.

〔課題を解決するための手段〕[Means to solve the problem]

本発明は、配線基板に実装されてそのリードが配線基板
に形成された導体パターンに半田付けされる第1の種類
の電気部品と、前記配線基板が取付けられるシャーシに
固定され且つその端子が前記配線基板の導体パターンに
半田付けされる第2の種類の電気部品とを装着する方法
であって、以下に列記する工程を含むことを特徴とする
電気部品の配線基板への実装方法である。
The present invention provides a first type of electrical component that is mounted on a wiring board and whose leads are soldered to a conductor pattern formed on the wiring board, and a first type of electrical component that is mounted on a wiring board and whose terminals are fixed to a chassis to which the wiring board is attached. This is a method for mounting a second type of electrical component to be soldered to a conductor pattern on a wiring board, and the method includes the steps listed below.

(イ)配線基板に第1の種類の電気部品を実装して、こ
の電気部品のリードを配線基板の端子挿通穴に挿入する
工程、 (ロ)上記第1の種類の電気部品が実装されている配線
基板を前記シャーシに取付けるとともに、このシャーシ
に予め固定されている第2の種類の電気部品の端子を配
線基板の端子挿入穴に挿入する工程、 (ハ)シャーシに取付けられた状態の配線基板を半田槽
に供給して、前記第1の種類の電気部品のリードと第2
の種類の電気部品の端子とを配線基板に形成された導体
パターンに対して同時に半田付けする工程、 〔作用] 上記手段によれば、第2の種類の電気部品をシャーシに
固定させた後、シャーシに配線基板を取付けると共にシ
ャーシに固定された第2の種類の電気部品の端子を配線
基板の端子挿通穴に挿通させるようにしているので、上
記配線基板に対して第1および第2の種類の電気部品を
一緒に半田デイツプすることが可能となる。よって、従
来の電気部品の配線基板への装着方法において半田デイ
ツプ作業の前後に必要とされていた、配線基板の第2の
種類の電気部品のリードが挿通される端子挿通穴をテー
プ等でマスキングする工程および第2の種類の電気部品
を手作業で半田付する工程を削減することができるよう
になる。
(a) mounting the first type of electrical component on the wiring board and inserting the lead of this electrical component into the terminal insertion hole of the wiring board; (b) mounting the first type of electrical component on the wiring board; a step of attaching a wiring board to the chassis and inserting a terminal of a second type of electrical component previously fixed to the chassis into a terminal insertion hole of the wiring board; (c) wiring in a state installed in the chassis; A board is supplied to a solder bath, and the leads of the first type of electrical component and the second type of electrical component are connected to each other.
[Operation] According to the above means, after the second type of electrical component is fixed to the chassis, Since the wiring board is attached to the chassis and the terminals of the second type of electrical components fixed to the chassis are inserted into the terminal insertion holes of the wiring board, the first and second types of electrical components are attached to the wiring board. This makes it possible to solder dip several electrical components together. Therefore, it is necessary to mask the terminal insertion holes of the wiring board through which the leads of the second type of electrical components are inserted, with tape or the like, which is required before and after the solder dip work in the conventional method of mounting electrical components onto the wiring board. The process of manually soldering the second type of electrical component can be reduced.

〔実施例J 以下図面に基づいて本考案の実施例を説明する。[Example J Embodiments of the present invention will be described below based on the drawings.

第1図は本発明の一実施例に係る電気部品の配線基板へ
の装着方法を説明するための図で、車載用音響装置の組
立時におけるプリント基板とシャーシおよびこれらに取
付けられる電気部品を示す斜視図である。
FIG. 1 is a diagram for explaining a method for attaching electrical components to a wiring board according to an embodiment of the present invention, and shows a printed circuit board, a chassis, and electrical components attached to these during assembly of an in-vehicle audio device. FIG.

図中符号1は裏面に導体パターンが形成されている配線
基板、符号2はこの配線基板1が取付けられるシャーシ
である。
In the drawing, reference numeral 1 indicates a wiring board having a conductive pattern formed on its back surface, and reference numeral 2 indicates a chassis to which this wiring board 1 is attached.

配線基板1上には、AM/FMチューナユニット3、コ
ンデンサ4などの第1の種類の電気部品(ディスクリュ
ート部品など)が、それらの各リードが端子挿通穴に挿
通されるようにマウントされている。このディスクリュ
ート部品のマウントは自動機により行なわれる。またこ
の配線基板lには図の一点鎖線α−α′で示す線に沿う
割れ目5が形成されており、配線基板1は、この割れ目
5を境に図のAで示す部分とBで示す部分とに分割でき
るようになっている。
On the wiring board 1, first types of electrical components (such as disclute components) such as an AM/FM tuner unit 3 and a capacitor 4 are mounted such that their respective leads are inserted into the terminal insertion holes. There is. Mounting of this disclute component is performed by an automatic machine. In addition, a crack 5 is formed in this wiring board 1 along the line indicated by a dashed line α-α' in the figure, and the wiring board 1 is divided into a part shown by A and a part shown by B in the figure, with this crack 5 as a boundary. It can be divided into .

一方シャーシ2にはボリュームなどの各部品6.7.8
およびコネクタ9,10.11などの第2の種類の電気
部品がねじなどにより固定されている。これらの第2の
種類の電気部品6〜11には図の下方に延びる端子6a
、7a。
On the other hand, chassis 2 has various parts such as volume 6.7.8
And a second type of electrical components such as connectors 9, 10, 11 are fixed by screws or the like. These second type electrical components 6 to 11 have terminals 6a extending downward in the figure.
, 7a.

8a、9a、10a、ILaが付けられている。8a, 9a, 10a, and ILa are attached.

これらの各ビン6a〜llaはそれぞれ、配線基板1が
シャーシ2に取付けられる際、配線基板1の各端子挿通
穴12,13,14,15゜16.17に挿通されるよ
うになっている。またシャーシ2の下縁部の6箇所には
、図の下方に延びる各爪部19が一体に形成されている
。これらの各爪部19は、配線基板1がシャーシ2に取
付けられる際、配線基板lの図のBで示す部分の外周部
の6箇所に形成された切欠き20に挿入され、あるいは
配線基板1の縁部に嵌着された後に、シャーシ2の内側
方向に折曲げることにより、シャーシ2に配線基板1を
互いにはずれないように取付けるためのものである。
These bins 6a to lla are inserted into respective terminal insertion holes 12, 13, 14, 15.degree. 16.17 of the wiring board 1 when the wiring board 1 is attached to the chassis 2, respectively. Furthermore, claw portions 19 extending downward in the figure are integrally formed at six locations on the lower edge of the chassis 2. When the wiring board 1 is attached to the chassis 2, each of these claws 19 is inserted into the notches 20 formed at six locations on the outer periphery of the portion of the wiring board l shown by B in the figure, or This is for attaching the wiring board 1 to the chassis 2 so that the wiring board 1 will not come off from each other by being bent inward of the chassis 2 after the wiring board 1 is fitted onto the edge of the chassis 2 .

次に第1図に示す車載用音響装置の各部品の組立作業を
説明する。
Next, the assembly work of each part of the vehicle-mounted audio device shown in FIG. 1 will be explained.

まず配線基板1に符号3ならびに4などによって示す第
1の種類の電気部品を実装し、そのリードを基板の端子
挿入穴に挿入する0次に第2の種類の電気部品6〜11
がねじなどにより固定されたシャーシ2を、第1の種類
の電気部品がマウントされた配線基板1の上に載せる。
First, the first type of electrical components indicated by numerals 3 and 4 are mounted on the wiring board 1, and their leads are inserted into the terminal insertion holes of the board.
The chassis 2, which is fixed with screws or the like, is placed on the wiring board 1 on which the first type of electrical components are mounted.

その際、シャーシ2に固定された第2の種類の電気部品
6〜11の各端子6a=11aを配線基板1の各端子挿
通穴12〜17に挿通されると共に、各爪部19は配線
基板1の各切欠き20に挿通させあるいは配線基板1の
縁部に嵌着する。そして各爪部19を内側に折曲げて配
線基板lをシャーシ2に取付ける。
At that time, each terminal 6a = 11a of the second type electrical components 6 to 11 fixed to the chassis 2 is inserted into each terminal insertion hole 12 to 17 of the wiring board 1, and each claw part 19 is inserted into each terminal insertion hole 12 to 17 of the wiring board 1. 1 or fit onto the edge of the wiring board 1. Then, each claw portion 19 is bent inward to attach the wiring board l to the chassis 2.

次にこのようにしてシャーシ2に取付けられた配線基板
1をその裏面(導体パターンが形成された面)が下方に
された状態(第1図に示す状態)のまま図示しない半田
槽の半田噴流部上に進行させ、半田デイツプを行う、こ
れにより、第1および第2の種類の電気部品の双方の各
リードが配線基板1の導体パターンの各ランド部に半田
付されると共に、折曲げられた各爪部19が配線基板1
の裏面に半田付固定されるようになっている。
Next, with the wiring board 1 attached to the chassis 2 in this manner with its back side (the surface on which the conductor pattern is formed) facing downward (as shown in Figure 1), solder jets from a solder bath (not shown) As a result, each lead of both the first and second types of electrical components is soldered to each land of the conductor pattern of the wiring board 1, and is bent. Each claw portion 19 is attached to the wiring board 1.
It is designed to be fixed by soldering to the back side of the .

特にこの実施例では、6つの爪部19のうち所定の2つ
の爪部19は配線基板1のアースパターンのランド部と
半田付されるようになっている。なおこの場合、配線基
板1の各端子挿通穴12〜17には予め第2の種類の電
気部品6〜11の端子6a〜llaが挿通されているの
で、従来のように半田デイツプ工程前にこれらの(第2
の種類の電気部品のリードが挿通されるべき)各端子挿
通穴をいちいちテープ等でマスキングする必要はない、
またこの場合、比較的重量の大きい第2の種類の電気部
品6〜11は予めシャーシ2に固定され支持された状態
でシャーシと一緒に配線基板1にマウントされるので、
半田デイツプ時に第2の種類の電気部品の位置がずれて
しまうなどのおそれはない。
Particularly in this embodiment, two predetermined claws 19 out of six claws 19 are soldered to land portions of the ground pattern of the wiring board 1. In this case, since the terminals 6a to lla of the second type of electrical components 6 to 11 are inserted in advance into the respective terminal insertion holes 12 to 17 of the wiring board 1, these terminals are inserted before the solder dip process as in the conventional case. (2nd
There is no need to mask each terminal insertion hole with tape, etc. (through which the leads of the following types of electrical components should be inserted)
Furthermore, in this case, the second type of electrical components 6 to 11, which are relatively heavy, are mounted on the wiring board 1 together with the chassis while being fixed and supported by the chassis 2 in advance.
There is no fear that the position of the second type of electrical component will shift during soldering.

上記の半田デイツプ後、配線基板1の図のAで示す部分
を割れ目5に沿って図のBで示す部分から切離し、シャ
ーシ2のフロント部分(図のCで示す部分)にねじまた
は接着等により固定させる0以上のようにして、第1お
よび第2の種類の電気部品の配線基板への装着(マウン
トおよび半田付)作業を含む車載用音響装置の組立作業
が行われるようになっている。
After the solder dip described above, the part of the wiring board 1 shown by A in the figure is separated from the part shown by B in the figure along the crack 5, and attached to the front part of the chassis 2 (the part shown by C in the figure) with screws or adhesive. The assembling work of the in-vehicle audio device, which includes the work of mounting (mounting and soldering) the first and second types of electrical components on the wiring board, is performed in a manner of 0 or more.

以上述べたように、本実施例によれば、予めシャーシ2
に固定された第2の種類の電気部品6〜11をシャーシ
2と共に配線基板1に取付けるようにしているので、第
1および第2の種類の電気部品を一緒に配線基板1に半
田デイツプさせることができる。したがって、従来のよ
うに半田デイツプ工程前に第2の種類の電気部品の端子
が挿通されるはずの端子挿通穴をテープ等でマスキング
する工程や半田デイツプ工程後に第2の種類の電気部品
を手作業で半田付する工程が不要となるので、組立作業
の大幅な簡略化および低コスト化が実現されるようにな
る。
As described above, according to this embodiment, the chassis 2
Since the second type of electrical components 6 to 11 fixed to the chassis 2 are attached to the wiring board 1 together with the chassis 2, the first and second types of electrical components can be soldered together on the wiring board 1. I can do it. Therefore, the conventional process of masking the terminal insertion hole into which the terminal of the second type of electrical component is supposed to be inserted before the solder dipping process, or the process of manually inserting the second type of electrical component after the solder dipping process. Since the soldering process is no longer necessary, assembly work can be greatly simplified and costs can be reduced.

なお本発明の実施例は、車載用音響装置の組立作業の中
の電気部品の配線基板への装着作業に適用されているが
、本発明はこれに限られるものではなく、あらゆる種類
の電気部品の配線基板への装着に適用できることは勿論
である。
Although the embodiments of the present invention are applied to the work of mounting electrical components onto a wiring board during the assembly work of an in-vehicle audio device, the present invention is not limited to this and is applicable to all kinds of electrical parts. Of course, it can be applied to mounting on a wiring board.

〔考案の効果〕[Effect of idea]

以上のように本発明によれば、予め第2の種類の電気部
品をシャーシに固定させておき、その後筒2の種類の電
気部品をシャーシと共に配線基板に取付けるよ、うにし
ているので、第2の種類の電気部品を第1の種類の電気
部品と一緒に半田デイツプさせることが可能となる。し
かも第2の種類の電気部品はシャーシに固定され支持さ
れた状態で配線基板にマウントされているので、半田デ
イツプ時に第2の位置がずれてしまうおそれはない、し
たがって、従来のように半田デイツブ工程の前後に第2
の種類の電気部品用の端子挿通穴をマスクする工程や第
2の種類の電気部品を手作業で半田付する工程を入れる
ことが不要となり、組立作業を大幅に簡素化させ且つ低
コスト化させることが可能となる6
As described above, according to the present invention, the second type of electric component is fixed to the chassis in advance, and then the tube 2 type of electric component is attached to the wiring board together with the chassis. It becomes possible to solder dip two types of electrical components together with a first type of electrical component. Moreover, since the second type of electrical component is mounted on the wiring board while being fixed and supported by the chassis, there is no risk of the second position shifting during soldering. 2nd before and after the process
This eliminates the need for the process of masking the terminal insertion holes for the first type of electrical components and the process of manually soldering the second type of electrical components, greatly simplifying the assembly work and reducing costs. 6.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例に係る電気部品の配線基板へ
の装着方法を説明するための図で、車載用音響装置の組
立時における配線基板とシャーシおよびこれらに取付け
られる電気部品を示す斜視図である。 1・・・配線基板、2・・・シャーシ、3.4・・・第
1の種類の電気部品、6.7,8,9.10.11・・
・第2の種類の電気部品、6a、7a、8a。 9a、10a、lla・・・リード、12.13゜14
.15,16.17・・・端子挿通穴。
FIG. 1 is a diagram for explaining a method for attaching electrical components to a wiring board according to an embodiment of the present invention, and shows a wiring board, a chassis, and electrical components attached to these during assembly of an in-vehicle audio device. FIG. 1... Wiring board, 2... Chassis, 3.4... First type of electrical component, 6.7, 8, 9.10.11...
- Second type of electrical components, 6a, 7a, 8a. 9a, 10a, lla... lead, 12.13°14
.. 15, 16, 17...Terminal insertion hole.

Claims (1)

【特許請求の範囲】[Claims] 1.配綿基板に実装されてそのリードが配線基板に形成
された導体パターンに半田付けされる第1の種類の電気
部品と、前記配線基板が取付けられるシャーシに固定さ
れ且つその端子が前記配線基板の導体パターンに半田付
けされる第2の種類の電気部品とを装着する方法であっ
て、以下に列記する工程を含むことを特徴とする電気部
品の配線基板への実装方法 (イ)配線基板に第1の種類の電気部品を実装して、こ
の電気部品のリードを配線基板の端子挿通穴に挿入する
工程、 (ロ)上記第1の種類の電気部品が実装されている配線
基板を前記シャーシに取付けるとともに、このシャーシ
に予め固定されている第2の種類の電気部品の端子を配
線基板の端子挿入穴に挿入する工程、 (ハ)シャーシに取付けられた状態の配線基板を半田槽
に供給して、前記第1の種類の電気部品のリードと第2
の種類の電気部品の端子とを配線基板に形成された導体
パターンに対して同時に半田付けする工程、
1. A first type of electrical component is mounted on a distribution board and has its leads soldered to a conductive pattern formed on the wiring board, and a first type of electrical component is fixed to a chassis to which the wiring board is attached and whose terminals are soldered to a conductive pattern formed on the wiring board. A method for mounting an electrical component on a wiring board, the method comprising: a second type of electrical component to be soldered to a conductor pattern, the method comprising the steps listed below (a) on a wiring board; a step of mounting a first type of electrical component and inserting the lead of the electrical component into a terminal insertion hole of the wiring board; (b) moving the wiring board on which the first type of electrical component is mounted to the chassis; (c) supplying the wiring board attached to the chassis to the solder bath; and the lead of the first type of electrical component and the second type of electrical component.
A process of simultaneously soldering the terminals of the types of electrical components to the conductor pattern formed on the wiring board,
JP18634289A 1989-07-18 1989-07-18 Mounting of electrical component onto wiring board Pending JPH0350799A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18634289A JPH0350799A (en) 1989-07-18 1989-07-18 Mounting of electrical component onto wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18634289A JPH0350799A (en) 1989-07-18 1989-07-18 Mounting of electrical component onto wiring board

Publications (1)

Publication Number Publication Date
JPH0350799A true JPH0350799A (en) 1991-03-05

Family

ID=16186679

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18634289A Pending JPH0350799A (en) 1989-07-18 1989-07-18 Mounting of electrical component onto wiring board

Country Status (1)

Country Link
JP (1) JPH0350799A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110020033A (en) * 2009-08-21 2011-03-02 주식회사 포스코 Conveyer chute

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110020033A (en) * 2009-08-21 2011-03-02 주식회사 포스코 Conveyer chute

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