JP3101960B2 - Manufacturing method of printed wiring board - Google Patents
Manufacturing method of printed wiring boardInfo
- Publication number
- JP3101960B2 JP3101960B2 JP04352440A JP35244092A JP3101960B2 JP 3101960 B2 JP3101960 B2 JP 3101960B2 JP 04352440 A JP04352440 A JP 04352440A JP 35244092 A JP35244092 A JP 35244092A JP 3101960 B2 JP3101960 B2 JP 3101960B2
- Authority
- JP
- Japan
- Prior art keywords
- led
- wiring board
- printed wiring
- land portion
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Led Device Packages (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子装置に搭載する印
刷配線板の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board mounted on an electronic device.
【０００２】[0002]
【従来の技術】印刷配線板には電子装置の機能を満たす
為に色々な電子部品が搭載されており、各々の電子部品
は印刷配線板上のパターンによって接続されている。電
子部品にはＬＥＤ（ＬＥＤはある電圧を加え電流が流れ
た時に発光する部品を言う）があり、ＬＥＤを搭載する
印刷配線板は電子装置の正面側にＬＥＤが所定の位置に
納まるようになっている。その時のＬＥＤと電子装置Ｌ
ＥＤ用窓の位置関係は、図９の如く、印刷配線板９に取
付けられたＬＥＤ３が、電子装置２のＬＥＤ用窓２−１
に納められ、ＬＥＤ用窓２−１の面一か内側に０．５ｍ
ｍ以内の範囲でＬＥＤ３を納めなければならない。2. Description of the Related Art Various electronic components are mounted on a printed wiring board in order to satisfy the function of an electronic device, and each electronic component is connected by a pattern on the printed wiring board. Electronic components include LEDs (LEDs are components that emit light when a certain voltage is applied and a current flows), and the printed wiring board on which the LEDs are mounted is such that the LEDs are located at predetermined positions on the front side of the electronic device. ing. LED and electronic device L at that time
As shown in FIG. 9, the positional relationship of the ED window is such that the LED 3 attached to the printed wiring board 9 is the LED window 2-1 of the electronic device 2.
0.5m inside or inside the window 2-1 for LED
The LED 3 must be accommodated within a range of m or less.
【０００３】図１０は、電子装置２に印刷配線板９が搭
載され、ＬＥＤ用窓２−１にＬＥＤ３を納めた正面図で
ある。このように、ＬＥＤ用窓２−１とＬＥＤ３の位置
関係がある為に、印刷配線板９に取付けるＬＥＤ３の取
付け寸法精度を向上させなくてはならず、印刷配線板９
に対してＬＥＤ３のＸ方向の寸法ａを確保する為に、Ｌ
ＥＤ３のリード３−１を工具により直角に成形し、その
後、印刷配線板９に設けられたＬＥＤ取付穴９−１にリ
ード３−１を挿入するが、印刷配線板９のＬＥＤ取付穴
９−１はリード３−１に対して一般に０．４ｍｍ程度大
きめに仕上げてある為に、リード３−１の半田付け時、
ＬＥＤ取付穴９−１の中心にリード３は必ず位置するこ
とはない。FIG. 10 is a front view in which the printed wiring board 9 is mounted on the electronic device 2 and the LED 3 is accommodated in the LED window 2-1. As described above, since there is a positional relationship between the LED window 2-1 and the LED 3, the mounting dimensional accuracy of the LED 3 to be mounted on the printed wiring board 9 must be improved.
In order to secure the dimension a of the LED 3 in the X direction, L
The lead 3-1 of the ED3 is formed at right angles by a tool, and then the lead 3-1 is inserted into the LED mounting hole 9-1 provided in the printed wiring board 9. 1 is generally about 0.4 mm larger than the lead 3-1. Therefore, when the lead 3-1 is soldered,
The lead 3 is not always located at the center of the LED mounting hole 9-1.
【０００４】その為に半田付け後、ａ寸法が確保されて
いるか否かを測定し、確保されていないものに対して
は、半田修正を施しａ寸法を確保していた。その後、印
刷配線板９に取付けたＬＥＤ３のＹ、Ｚ方向のズレをな
くす為にＬＥＤ３を固定する固定金具９−２を印刷配線
板９に取付け、Ｙ、Ｚ方向のズレをなくすように施して
から電子装置２に組み込んでいた。[0004] For this purpose, after soldering, it is measured whether or not the a-dimension is secured, and if it is not secured, the solder is corrected to secure the a-dimension. After that, in order to eliminate the displacement of the LED 3 attached to the printed wiring board 9 in the Y and Z directions, a fixing bracket 9-2 for fixing the LED 3 is attached to the printed wiring board 9 and applied so as to eliminate the displacement in the Y and Z directions. From the electronic device 2.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら前記従来
技術では、ＬＥＤ３のリード３−１を目視及び手動によ
り成形している為にａ寸法を確保するのは困難である。However, in the prior art, it is difficult to secure the dimension a since the leads 3-1 of the LED 3 are formed visually and manually.
【０００６】ＬＥＤ３のリード３−１の成形を手動から
治具を作成し機械的にプレスにて行なうか、ＬＥＤ製造
メーカーで購入時にリード成形を行ないａ寸法を確保し
たＬＥＤを購入すれば前記問題は除去されるが、これだ
と高価な部品になる。[0006] The above-mentioned problem is caused by forming a jig from the manual and mechanically pressing the lead 3-1 of the LED 3 or by mechanically pressing the LED or purchasing an LED having a dimension a by performing lead forming at the time of purchase by an LED manufacturer. Is removed, but this is an expensive part.
【０００７】また、印刷配線板９にリード３−１の半田
付け後のａ寸法が不確保の為の半田修正及び見直しに時
間及び工数が掛る。また、ＬＥＤ３のズレ防止用の固定
金具９−２を使用している為、組立工数が増えるという
問題点があった。[0007] Further, it takes time and man-hours to correct and review the solder so that the dimension a after soldering the lead 3-1 to the printed wiring board 9 is not secured. Further, since the fixture 9-2 for preventing the displacement of the LED 3 is used, there is a problem that the number of assembling steps is increased.
【０００８】本発明は、上記の問題点を解消するもので
あり、その目的とするところは、ＬＥＤの取付寸法ａを
容易に確保し、ＬＥＤ取付けのズレをなくする印刷配線
板の製造方法を提供することにある。An object of the present invention is to solve the above-mentioned problems, and an object of the present invention is to provide a method for manufacturing a printed wiring board which can easily secure an LED mounting dimension a and eliminate deviation of LED mounting. To provide.
【０００９】[0009]
【課題を解決するための手段】上記目的を達成するため
に、本発明は、印刷配線板に、２つの端子を有するＬＥ
Ｄの各々の端子をハンダ付けする同一形状の第１のラン
ド部及び第２のランド部を、これらが平行になるように
設け、当該第１のランド部及び第２のランド部の各々の
一端側に、前記ＬＥＤの端子が挿入される取付穴を設け
ると共に、これらの他端側を当該印刷配線板の前記ＬＥ
Ｄが搭載される端面の近傍まで配し、前記印刷配線板
の、前記ＬＥＤが搭載される端面と、前記ＬＥＤの端子
部側の端面とを当接し、折り曲げられた前記ＬＥＤの各
々の端子の端部を、前記第１のランド部及び第２のラン
ド部の各々の前記取付穴に挿入し、かつ、前記ＬＥＤの
各々の端子が前記第１のランド部及び第２のランド部の
各々に平行になるようにして、前記ＬＥＤを所定の位置
に搭載した後、前記ＬＥＤの２つの端子と前記第１のラ
ンド部及び第２のランド部とを半田付けするようにした
ことを特徴とするものである。In order to achieve the above object, the present invention provides an LE having two terminals on a printed wiring board.
D of the same shape for soldering each terminal of D
And a land portion and a second land portion are provided such that they are parallel to each other, and each of the first land portion and the second land portion is provided.
At one end, a mounting hole into which the terminal of the LED is inserted is provided.
And the other end thereof is connected to the LE of the printed wiring board.
D is disposed close to the end face on which the LED is mounted, and the end face of the printed wiring board on which the LED is mounted and the end face on the terminal side of the LED are in contact with each other. End portions are connected to the first land portion and the second run portion.
And inserted into each of the mounting holes of the
Each terminal corresponds to the first land portion and the second land portion .
After mounting the LED at a predetermined position so as to be parallel to each other , two terminals of the LED and the first lamp are mounted.
And a second land portion which is soldered.
【００１０】[0010]
【作用】印刷配線板の外形仕上りは、目視による切断
（シャー加工）ではなく、ルーター加工により精度を上
げている為、印刷配線板の端面をガイドにＬＥＤを取付
け及び半田付けすることにより、ＬＥＤの取付け寸法ａ
を容易に出すことができ、ＬＥＤ取付けのズレをなくす
ことができる。[Function] Since the external finish of the printed wiring board is improved by router processing instead of visual cutting (shear processing), the LED is attached to the end face of the printed wiring board with a guide and soldered. Mounting dimensions a
Can be easily obtained, and displacement of LED mounting can be eliminated.
【００１１】[0011]
【実施例】以下、本発明の実施例について図面を用いて
詳細を説明する。Embodiments of the present invention will be described below in detail with reference to the drawings.
【００１２】〔実施例１〕図１は本発明の印刷配線板の
製造方法により製造された印刷配線板構造を電子装置本
体に装備した斜視図、図２は同印刷配線板構造の一部省
略した平面図、図３は同側面図、図４は本発明の印刷配
線板の製造工程図、図５は印刷配線板のＬＥＤの取付部
を裏面から見た拡大図、図６は自動半田付け後印刷配線
板にＬＥＤを取付けた拡大図である。Embodiment 1 FIG. 1 is a perspective view of a printed wiring board structure manufactured by a method of manufacturing a printed wiring board according to the present invention mounted on an electronic device main body, and FIG. 3, FIG. 3 is a side view, FIG. 4 is a manufacturing process diagram of the printed wiring board of the present invention, FIG. 5 is an enlarged view of the LED mounting portion of the printed wiring board viewed from the back surface, and FIG. It is the enlarged view which attached the LED to the back printed wiring board.
【００１３】図４において、印刷配線板の製造は、印刷
配線板１は絶縁板に銅箔を張り付けた銅張積層板に電子
部品の取付穴１−３の穴明けをし、回路パターンを印刷
し、回路パターン以外の不必要な銅箔をエッチングする
ことで除去し、回路パターン上でＬＥＤ３のリード３−
１を印刷配線板１に固定する為のランド部１−２を除い
て絶縁樹脂であるレジストを印刷することによって、回
路パターン上にコーティングを施す。In FIG. 4, in the manufacture of the printed wiring board, the printed wiring board 1 is formed by forming mounting holes 1-3 for electronic components on a copper-clad laminate obtained by attaching copper foil to an insulating plate, and printing a circuit pattern. Then, unnecessary copper foil other than the circuit pattern is removed by etching, and the lead 3 of the LED 3 is placed on the circuit pattern.
A coating is applied on the circuit pattern by printing a resist, which is an insulating resin, except for a land portion 1-2 for fixing 1 to the printed wiring board 1.
【００１４】更に、部品品名及び記号、機能名等を印刷
配線板１上に表示するシルク印刷を施した後、印刷配線
板１としての外形加工をルーター加工にて仕上げる工程
になっている。このルーター加工の精度は、目視による
切断（シャー加工）よりははるかに良い。Further, after performing silk printing for displaying the names of parts, symbols, functions, and the like on the printed wiring board 1, the outer shape processing of the printed wiring board 1 is finished by router processing. The accuracy of this router processing is much better than the visual cutting (shear processing).
【００１５】このランド部１−２は出来るだけ印刷配線
板１の端面１−１に近い所まで設けた方が良い。その
後、印刷配線板１としての機能チェックをし、表面処理
として表面に防錆処理が施された印刷配線板１が構成さ
れる。It is preferable that the land portion 1-2 be provided as close to the end surface 1-1 of the printed wiring board 1 as possible. After that, the function of the printed wiring board 1 is checked, and the printed wiring board 1 having a surface subjected to rust prevention treatment as a surface treatment is configured.
【００１６】そして、組立工程では、印刷配線板１に設
けた取付穴１−３に電子部品であるＬＥＤ３（およびＩ
Ｃ，抵抗、コンデンサ等）を自動搭載及び手組み搭載に
より搭載し、自動半田付装置に送り込まれて、フラック
ス塗布、半田付けが行われる。In the assembling step, the LED 3 (and I) as an electronic component is inserted into the mounting hole 1-3 provided in the printed wiring board 1.
C, resistors, capacitors, etc.) are mounted by automatic mounting and manual mounting, sent to an automatic soldering apparatus, and flux application and soldering are performed.
【００１７】図２乃至図６において、ＬＥＤ３のリード
３−１を直角に成形し、印刷配線板１の端面１−１をガ
イドにＬＥＤ３のケース３−２を密着状態で当て、前記
取付穴１−３にＬＥＤ３のＬＥＤリード３−１を挿入
し、ランド部１−２にＬＥＤ３のリード３−１を平行に
なるように位置決め後、半田付けを行なう。2 to 6, the lead 3-1 of the LED 3 is formed at a right angle, and the case 3-2 of the LED 3 is brought into close contact with the end surface 1-1 of the printed wiring board 1 as a guide. -3 is inserted into the LED lead 3-1 of the LED 3, and the lead 3-1 of the LED 3 is positioned parallel to the land 1-2, and then soldered.
【００１８】これにより寸法ａが確保出来る。また、
Ｘ，Ｙ，Ｚ方向のズレがなくなる様になる。その後、印
刷配線板１の外観及び性能検査し、電子装置本体に組み
込まれる。Thus, the dimension a can be secured. Also,
The displacement in the X, Y, and Z directions is eliminated. Thereafter, the appearance and performance of the printed wiring board 1 are inspected, and the printed wiring board 1 is incorporated into the electronic device main body.
【００１９】［実施例２］ この実施例においては、図７に示すように前記印刷配線
板１の端面１−１にＬＥＤ３の形状に合わせた嵌合凹部
７−１を設けて、この嵌合凹部７―１の端面を印刷配線
板１の端面１―１の一部とし、ＬＥＤのリード３−１を
直角に成形し、印刷配線板１の嵌合凹部７―１の端面１
―１にＬＥＤ３のケース３−２を当接させて、前記取付
穴１−３にＬＥＤ３―１を挿入し、ランド部１―２にＬ
ＥＤ３のリード３―１を平行になるように位置決め後、
半田付けを行なう。この場合、ＬＥＤ３の固定は充分に
行なえい得て、ＬＥＤ３の取付寸法精度も良好になる。[Embodiment 2] In this embodiment, as shown in FIG. 7, a fitting recess 7-1 corresponding to the shape of the LED 3 is provided on an end face 1-1 of the printed wiring board 1, and this fitting is performed. The end face of the recess 7-1 is made a part of the end face 1-1 of the printed wiring board 1, the LED lead 3-1 is formed at a right angle, and the end face 1 of the fitting recess 7-1 of the printed wiring board 1 is formed.
-1 is brought into contact with the case 3-2 of the LED3, the LED3-1 is inserted into the mounting hole 1-3, and the L is inserted into the land 1-2.
After positioning the lead 3-1 of ED3 so as to be parallel,
Perform soldering. In this case, LED3 fixed is obtained not performed sufficiently, even the better LED3 mounting dimensional accuracy.
【００２０】［実施例３］ この実施例では、なんらかの突出部をＬＥＤ３部の箇所
に設置する場合、印刷配線板１のＬＥＤ３部を切欠き、
突出部を収納できる構成にしてある。すなわち、図８に
示すように、印刷配線板８の端部に、スリット８−４及
びミシン目８−５を設けて印刷配線板本体８―８とは別
の切離し部８―２が形成してあり、この切離し部８―２
の端面がＬＥＤガイド用の端面８―１になされている。
そして、印刷配線板本体８―８の端部にはランド部８―
９とＬＥＤ３の取付け穴８―６とが設けてある。また、
前記切離し部８―２には、ＬＥＤリード３―１の位置決
め用に銅箔にて前記取付け穴８―６に対して垂直な線８
―７が施されている。[Embodiment 3] In this embodiment, when any protruding portion is installed at the location of the LED 3 , the LED 3 portion of the printed wiring board 1 is cut out.
It is configured to be able to store the protrusion. That is, as shown in FIG. 8, a slit 8-4 and a perforation 8-5 are provided at the end of the printed wiring board 8 to form a separated portion 8-2 separate from the printed wiring board main body 8-8. And this separation part 8-2
Is formed as an end surface 8-1 for the LED guide.
A land 8-is attached to the end of the printed wiring board body 8-8.
9 and a mounting hole 8-6 for the LED 3 are provided. Also,
A line 8 perpendicular to the mounting hole 8-6 is formed of copper foil for positioning the LED lead 3-1.
-7 is given.
【００２１】そして、切離し部８−２の端面８−１をガ
イドにＬＥＤ３のケース３−２を密着状態に当て、前記
取付穴８−６にＬＥＤ３のリード３−１を挿入し、ラン
ド部８−９にＬＥＤ３のリード３−１を平行になるよう
に位置決めし、前記切離し部８−２の線８−７にＬＥＤ
リード３−１を合わせた後、半田付けを行なう。Then, the case 3-2 of the LED 3 is brought into close contact with the end surface 8-1 of the separating portion 8-2 as a guide, and the lead 3-1 of the LED 3 is inserted into the mounting hole 8-6. -9, the lead 3-1 of the LED 3 is positioned so as to be parallel, and the LED 8 is connected to the line 8-7 of the cut-off portion 8-2.
After aligning the leads 3-1, soldering is performed.
【００２２】すなわち、前記切離し部８−２にはランド
部を設けることは出来ない為、印刷配線板本体８−８の
端部のランド部８−９に半田付けにて固定する。That is, since a land portion cannot be provided in the separating portion 8-2, it is fixed to the land portion 8-9 at the end of the printed wiring board main body 8-8 by soldering.
【００２３】その後、切離し部８−２をスリット８−４
及びミシン目８−５の部分から取り除くことにより、前
記突出部が収納できる部分を形成する。After that, the separating portion 8-2 is connected to the slit 8-4.
Then, by removing the protruding portion from the perforation 8-5, a portion capable of storing the protruding portion is formed.
【００２４】この実施例では、ａ寸法は実施例１、２と
同等に確保できるが、Ｙ方向の寸法精度を出す為には、
上記のように印刷配線板８にＬＥＤリード３−１の位置
決め用に銅箔にてＬＥＤの取付け穴８−６に対して垂直
な線８−７を施し、ＬＥＤ３取付け時にその銅箔で残さ
れた線８−７をＬＥＤリード３−１を合わせて取付ける
ために、Ｙ方向のズレはなく取付けが可能になる。しか
し、切離し部８−２をＬＥＤ取付け後、取り除く為に、
外部からのストレスによりＬＥＤ３は実施例１、２と比
較すると、Ｙ、Ｚ方向のズレは大きくなる。In this embodiment, the dimension a can be ensured equal to that of the first and second embodiments.
As described above, a line 8-7 perpendicular to the LED mounting hole 8-6 is formed on the printed wiring board 8 with a copper foil for positioning the LED lead 3-1, and the copper foil is left when the LED 3 is mounted. Since the wire 8-7 is attached together with the LED lead 3-1, there is no deviation in the Y direction, and attachment becomes possible. However, in order to remove the separation part 8-2 after attaching the LED,
Due to external stress, the deviation of the LED 3 in the Y and Z directions is larger than that in the first and second embodiments.
【００２５】また、実施例３は印刷配線板８からリード
３−１が出ている為にＹ、Ｚ方向のズレはいく分出てし
まうが、電子装置を小型化する為に利用すれば良好であ
る。In the third embodiment, since the leads 3-1 protrude from the printed wiring board 8, some deviations in the Y and Z directions may occur. However, it is preferable if the electronic apparatus is used to reduce the size. It is.
【００２６】[0026]
【発明の効果】以上説明したように、本発明によれば、
印刷配線板の端面を基準（ガイド）としてＬＥＤのケー
スを当接にしてこのＬＥＤを印刷配線板に取付けるよう
にしたので、ＬＥＤの取付け寸法ａを容易に出すことが
できるし、また、ＬＥＤのリード成形治具を必要としな
いし、また、ＬＥＤのズレは無くすことができる。As described above, according to the present invention,
Since the LED case is brought into contact with the end surface of the printed wiring board as a reference (guide) and the LED is mounted on the printed wiring board, the mounting dimension a of the LED can be easily obtained. No lead forming jig is required, and the deviation of the LED can be eliminated.
【図１】本発明の印刷配線板の製造方法により製造され
た印刷配線板構造を電子装置本体に装備した斜視図であ
る。FIG. 1 is a perspective view in which a printed wiring board structure manufactured by a method for manufacturing a printed wiring board of the present invention is mounted on an electronic device main body.
【図２】同印刷配線板構造の一部省略した平面図であ
る。FIG. 2 is a partially omitted plan view of the printed wiring board structure.
【図３】同側面図である。FIG. 3 is a side view of the same.
【図４】印刷配線板の製造工程図である。FIG. 4 is a manufacturing process diagram of the printed wiring board.
【図５】印刷配線板のＬＥＤの取付部を裏面から見た拡
大図である。FIG. 5 is an enlarged view of the LED mounting portion of the printed wiring board as viewed from the back surface.
【図６】自動半田付け後印刷配線板にＬＥＤを取付けた
拡大図である。FIG. 6 is an enlarged view in which an LED is attached to a printed wiring board after automatic soldering.
【図７】本発明の第２の実施例の印刷配線板の製造方法
により製造された印刷配線板構造の一部省略した平面図
である。FIG. 7 is a partially omitted plan view of a printed wiring board structure manufactured by the method for manufacturing a printed wiring board according to the second embodiment of the present invention.
【図８】本発明の第３の実施例３の印刷配線板の製造方
法により製造された印刷配線板構造の一部省略した平面
図である。FIG. 8 is a partially omitted plan view of a printed wiring board structure manufactured by the method for manufacturing a printed wiring board according to the third embodiment of the present invention.
【図９】従来における印刷配線板の製造方法により製造
された印刷配線板構造を電子装置本体に組み込んで成る
電子装置の一部省略した断面図である。FIG. 9 is a partially omitted cross-sectional view of an electronic device in which a printed wiring board structure manufactured by a conventional method for manufacturing a printed wiring board is incorporated in an electronic device main body.
【図１０】同電子装置の正面図である。FIG. 10 is a front view of the electronic device.
【図１１】従来における印刷配線板の製造方法により製
造された印刷配線板構造の一部省略した平面図である。FIG. 11 is a partially omitted plan view of a printed wiring board structure manufactured by a conventional printed wiring board manufacturing method.
【図１２】同正面図である。FIG. 12 is a front view of the same.
１ 印刷配線板 １−１ 端面 １−２ ランド部 １−３ 取付穴 ３ ＬＥＤ ３−１ リード ３−２ ケース DESCRIPTION OF SYMBOLS 1 Printed wiring board 1-1 End surface 1-2 Land part 1-3 Mounting hole 3 LED 3-1 Lead 3-2 Case
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 実開 平４−72687（ＪＰ，Ｕ) 実開 平４−127666（ＪＰ，Ｕ) 実開 昭62−147378（ＪＰ，Ｕ) 実開 昭58−187175（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 1/18 H01L 33/00 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A 4-72687 (JP, U) JP-A 4-127666 (JP, U) JP-A 62-147378 (JP, U) JP-A 58- 187175 (JP, U) (58) Fields investigated (Int. Cl. 7 , DB name) H05K 1/18 H01L 33/00
Claims (2)
Ｄの各々の端子をハンダ付けする同一形状の第１のラン
ド部及び第２のランド部を、これらが平行になるように
設け、当該第１のランド部及び第２のランド部の各々の一端側
に、前記ＬＥＤの端子が挿入される取付穴を設けると共
に、これらの他端側を当該印刷配線板の前記ＬＥＤが搭
載される端面の近傍まで配し、 前記印刷配線板の、前記ＬＥＤが搭載される端面と、前
記ＬＥＤの端子部側の端面とを当接し、折り曲げられた
前記ＬＥＤの各々の端子の端部を、前記第１のランド部
及び第２のランド部の各々の前記取付穴に挿入し、か
つ、前記ＬＥＤの各々の端子が前記第１のランド部及び
第２のランド部の各々に平行になるようにして、前記Ｌ
ＥＤを所定の位置に搭載した後、前記ＬＥＤの２つの端
子と前記第１のランド部及び第２のランド部とを半田付
けするようにしたことを特徴とする印刷配線板の製造方
法。1. An LE having two terminals on a printed wiring board
D of the same shape for soldering each terminal of D
The de portion and a second land portion, they are provided <br/> in parallel, one end of each of the first land portion and the second land portion
And a mounting hole into which the terminal of the LED is inserted.
The other end of the printed wiring board is mounted with the LED.
An end portion of each of the terminals of the LED, which is disposed close to an end surface on which the LED is mounted, abuts an end surface of the printed wiring board on which the LED is mounted, and an end surface of the LED on a terminal portion side, and is bent. The first land portion
And the second land portion is inserted into each of the mounting holes, and each terminal of the LED is connected to the first land portion and
The L is set so as to be parallel to each of the second land portions.
A printed wiring board, wherein after mounting the ED at a predetermined position, two terminals of the LED are soldered to the first land portion and the second land portion. Manufacturing method.
ＥＤの形状に合わせた嵌合凹部を設けたことを特徴とす
る請求項１記載の印刷配線板の製造方法。2. The end face on which the LED is mounted is provided with the L
2. The method for manufacturing a printed wiring board according to claim 1, wherein a fitting concave portion corresponding to the shape of the ED is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04352440A JP3101960B2 (en) | 1992-12-11 | 1992-12-11 | Manufacturing method of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04352440A JP3101960B2 (en) | 1992-12-11 | 1992-12-11 | Manufacturing method of printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06181374A JPH06181374A (en) | 1994-06-28 |
| JP3101960B2 true JP3101960B2 (en) | 2000-10-23 |
Family
ID=18424094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP04352440A Expired - Fee Related JP3101960B2 (en) | 1992-12-11 | 1992-12-11 | Manufacturing method of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3101960B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8080120B2 (en) | 2006-12-11 | 2011-12-20 | Sumitomo (Sei) Steel Wire Corp. | Method and apparatus of manufacturing annular concentric stranded bead cord |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013095292A (en) * | 2011-11-01 | 2013-05-20 | Stanley Electric Co Ltd | Led light |
| JP2014229722A (en) * | 2013-05-22 | 2014-12-08 | 三菱電機エンジニアリング株式会社 | Chip led mounted printed circuit board and electronic apparatus including the same |
-
1992
- 1992-12-11 JP JP04352440A patent/JP3101960B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8080120B2 (en) | 2006-12-11 | 2011-12-20 | Sumitomo (Sei) Steel Wire Corp. | Method and apparatus of manufacturing annular concentric stranded bead cord |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06181374A (en) | 1994-06-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5266739A (en) | Chip electronic device with a resin housing and manufacturing process thereof | |
| US6163461A (en) | Terminal mounting structure for a printed circuit board | |
| JP3101960B2 (en) | Manufacturing method of printed wiring board | |
| JP2863981B2 (en) | Lug terminal and its mounting method | |
| JP2872715B2 (en) | Solder dip mask | |
| JP2526170Y2 (en) | Electronic circuit board | |
| JPH0864916A (en) | Circuit board and its manufacture | |
| JP3384121B2 (en) | Electronic circuit module | |
| JPS6223478B2 (en) | ||
| JP3000742B2 (en) | Microphone unit mounting method | |
| JPH0729659Y2 (en) | Socket insertion board | |
| JPH06169152A (en) | Printed wiring board structure | |
| JPS5923437Y2 (en) | Electrical component mounting equipment on printed wiring boards | |
| JPH051098Y2 (en) | ||
| JP3354308B2 (en) | Large current circuit board and method of manufacturing the same | |
| JPH05234630A (en) | Electronic circuit unit | |
| JPH05206617A (en) | Printed board for power circuit wiring | |
| JP2000012995A (en) | Mounting apparatus for terminal components on printed circuit board | |
| JPH06164117A (en) | Manufacture of wiring board with connector attached | |
| JP2938010B1 (en) | Semiconductor device mounting positioning jig and semiconductor device mounting positioning method | |
| JPH08321665A (en) | Printed board | |
| JPS5833710Y2 (en) | Printed board | |
| JPH05308174A (en) | Printed wiring board and component mounting method | |
| JPS63197308A (en) | Manufacture of signal line filter | |
| JPH0690098A (en) | Component mounting method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |