JPH0350747A - Manufacture of semiconductor device - Google Patents

Abstract

PURPOSE:To constitute manufacturing process in a continuous assembly line process, evade the increase of manufacturing equipment, and improve productivity by a method wherein, after a semiconductor chip is bonded to the tip of a lead terminal out of each lead terminal pair, said chip is connected with other lead terminal, a molding die is fitted with the tip of each lead terminal pair, and each pot is filled with synthetic resin, which is then hardened. CONSTITUTION:A metal wire 11 wherein a cup part 12a is formed at the tip is cut to form a metal wire segment 11a; by bending said segment, an U-shaped lead terminal pair segment 11b having a cathode lead terminal 12 and an anode lead terminal 13 is formed. A plurality of the terminal pair segments 11b are arranged in parallel on the upper surface of a carrier tape member H, at specified intervals in the longitudinal direction, and a pressing tape J is stuck thereon. Said tape member H is transferred in the longitudinal direction; chips 14 are bonded in order inside the cup parts 12a at the tips of the terminals 12; the chips 14 and the tips of the terminals 13 are connected in order by using metal thin wires 15; after the tape member H is twisted 180 deg., a molding die M is fixed in order to the tip of each terminal pair segment 11b; pots M2 are filled with liquid type synthetic resin, which is hardened; after each of the molding dies M is taken out from the tape member H, connection parts 11b; are cut.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to connecting at least two lead terminals to one semiconductor chip, such as a light emitting diode, The present invention relates to a method of manufacturing a semiconductor component by molding a sealing portion made of plastic.

[Conventional technology]

Conventionally, the manufacturing of the light emitting diode has been carried out, for example, in
As described in 8-85357 and JP-A-59-229884, and as shown in FIG. A lead frame 1 is used which is punched out so as to form a large number of anode lead terminals 3 at appropriate pitches, and at the tip of each cathode lead terminal 2 in this lead frame 1, as shown in FIG.
After each semiconductor chip 4 is bonded, the tips of each semiconductor chip 4 and each anode lead terminal 3 are connected with a thin metal wire 5, and then each cathode lead on the lead frame 1 is connected as shown in FIG. The tips of the terminal 2 and the anode lead terminal 3 are molded into a synthetic resin sealing mold B.
14, by injecting synthetic resin in a liquid state into each pot b and curing the synthetic resin, molding the sealing part 6 made of synthetic resin as shown in FIG. 14. By doing this, - lead frame l
A plurality of light emitting diodes a are manufactured for each light emitting diode a, and each light emitting diode a is cut away from the lead frame 1.

Furthermore, conventionally, as shown in FIG. 15, the light emitting diode a manufactured as described above and cut out from the lead frame 1 has a fixed length in the longitudinal direction with respect to the carrier tape member C in the form of a long strip. This process is called taping) and the products are shipped to the market in this state.

[Problem to be solved by the invention]

However, this conventional manufacturing method uses a lead frame 1 punched to an appropriate length from a metal plate as a raw material.
There is a lot of material loss, and the cost of materials increases significantly.

Moreover, since the conventional manufacturing method uses a rectangular lead frame 1 of an appropriate length rather than a long strip, the step of bonding the semiconductor chip 4 to each cathode lead terminal 2 is necessary. and the step of connecting each semiconductor chip 4 and anode lead terminal 3 with a thin metal wire 5,
While this can be carried out while the strip-shaped lead frame 1 is being transferred in its longitudinal direction, when molding the synthetic resin molding section 6, the strip-shaped lead frame 1 must be removed from the transfer path. Each light emitting diode a cut out from each strip lead frame 1 must be placed one by one in a mold B to mold the synthetic resin sealing part 6. Furthermore, each light emitting diode a cut from each strip lead frame 1 is It is necessary to tape the carrier tape member C while aligning it, and there are a process of joining the semiconductor chips, a process of connecting them with thin metal wires, a process of molding the synthetic resin molding part, and a process of attaching the semiconductor chips to the carrier tape member C. Since the taping process cannot be made into a continuous assembly line process, productivity is low, the manufacturing equipment becomes enormous, and the above-mentioned material costs increase, resulting in high manufacturing costs. I was going to upload it.

An object of the present invention is to provide a manufacturing method that solves the problems of the conventional manufacturing method.

[Means to solve the problem]

In order to achieve this object, the present invention provides a carrier tape member in which a lead terminal pair having at least two lead terminals made of metal wire is formed into a long strip shape from a flexible material. a step of bonding a semiconductor chip to the tip of one lead terminal of each pair of lead terminals while the carrier tape member is being held at a constant interval along the longitudinal direction and is being transferred in the longitudinal direction; The mold is attached so as to fit over the tip of a tool for connecting the semiconductor chip and other lead terminals, and after filling the mold with synthetic resin, a step of curing the synthetic resin is performed.

[Action/effect of the invention]

In this way, by holding the lead terminal pair having at least two lead terminals made of metal wire at an appropriate interval with respect to the carrier tape member, the carrier tape member provided with the lead terminal pair can be held in the longitudinal direction. During the process of transferring the semiconductor chip to one lead terminal of each pair of lead terminals, a process of connecting the semiconductor chip to the other lead terminal, and a synthetic resin sealing part. The process of molding can be performed, and these processes are
This can be done through a series of continuous assembly lines.

Moreover, since the semiconductor components can be manufactured while being held at appropriate intervals with respect to the carrier tape member, the product semiconductor components can be marketed as they are, that is, while being held in the carrier tape member used during manufacturing. can be shipped to.

In addition, since the lead terminals in each lead terminal pair are made of metal wire, material loss is far greater than in the conventional method in which strip-shaped glue frames are punched from a metal plate. It becomes less.

Therefore, according to the present invention, the manufacturing process can be made into a continuous assembly process, and it is possible to avoid the expansion of the manufacturing equipment, improve productivity, and reduce material costs. This has the effect of significantly reducing the cost required to manufacture parts.

〔Example〕

EMBODIMENT OF THE INVENTION Hereinafter, embodiments of the present invention will be described in the case where a two-terminal type light emitting diode is manufactured as a semiconductor component.

In FIG. 1, reference numeral 11 indicates a metal wire that is drawn out from a reel (not shown) while being straightened into a straight line by a plurality of straightening rollers D, and the tip of the metal wire 11 is held between a pair of left and right clamps E. In this state, a header F is hit against the tip of the metal wire 11 to form a cup portion 12a at the tip of the metal wire 11. At the same time, the metal wire 11 is cut with a cutter G at an appropriate length S from the cup portion 12a.
As shown in FIG. 2, a metal wire piece 11a having an appropriate length S is produced by cutting the metal wire piece 11a with a forming machine (not shown), as shown in FIG.
By bending it into a U-shape, the cathode lead terminal 1
2 and an anode lead terminal 13 are formed into a U-shaped lead terminal pair piece 11b.

Next, as shown in FIG. 4, a plurality of these U-shaped square terminal pairs 11b were made into long strips from a flexible and non-conductive material such as soft synthetic resin. After placing the carrier tape member H side by side in parallel at regular intervals in the longitudinal direction, a presser tape J (this presser tape Similarly to the carrier tape member H, each U-shaped terminal pair is attached by pasting a flexible and non-conductive material such as soft synthetic resin. A plurality of pieces 11b are immovably held at regular intervals in the longitudinal direction of the carrier tape member H.

Then, the carrier tape member H holds the U-shaped terminal pair 11b at a constant interval in the manner described above.
is transferred in its longitudinal direction as indicated by the arrow in FIG.

At the first stage during this transfer, a fifth
As shown in the figure, the semiconductor chips 14 are sequentially bonded, and in the next second stage, a thin metal wire 15 is connected between the semiconductor chip 14 and the tip of the anode lead terminal 13 as shown in FIG. Connect sequentially by

Next, in a third stage located ahead of the second stage along the transfer direction, the carrier tape member H is moved so that the tips of the U-shaped terminal pairs 11b held therein are directed downward. After twisting the carrier tape member H by 180 degrees, as shown in FIG.
A mold M for molding the synthetic resin sealing part 16 in the light emitting diode A is used for each U-shaped terminal pair piece 11b.
Attach it in a removable manner so that it fits onto the tip of the

That is, as shown in FIG. 8, this molding die M is made of a suitable material such as polypropylene and includes a main body M1 having a boss M2, and a pair of left and right parts that protrude upward from both left and right sides of the main body M1. Clip part M3. M4, and the mold M is configured to detachably lock the pair of left and right clip portions M3 and M4 to the carrier tape member H.

Then, while transporting the tape member H in the longitudinal direction,
After filling the pot M2 of each molding mold M with liquid synthetic resin and curing it, each molding mold M is removed from the carrier tape member H, and as shown in FIG. A synthetic resin sealing portion 16 is sequentially molded at the tip of the molded terminal pair piece 11b.

In this case, as shown in the figure, each mold M is not integrated for a large number of U-shaped lead terminal pair pieces 11b, but is formed independently for each U-shaped lead terminal pair piece 11b. If a plurality of U-shaped terminal pairs 11b such as 2 to 5 U-shaped terminal pairs 11b are integrated, it will be easier to transport the carrier tape member H in the longitudinal direction. , while being able to allow smooth bending in the carrier tape member H and allowing the carrier tape member H to meander in a meandering manner during curing of the synthetic resin;
This makes it possible to avoid an increase in the length of the transport path for the carrier tape member H.

Next, a fourth
In the th stage, each U
Cathode lead terminal 1 in molded terminal pair piece 11b
After cutting the connecting portion 11b' between the light emitting diode A and the anode lead terminal 13, the cathode lead terminal 12 and the anode lead terminal 13 are energized to perform a performance test, thereby producing the light emitting diode A as a completed product.

Of the manufactured light emitting diodes A held on the carrier tape member H, those determined to be defective by the above inspection are replaced with good light emitting diodes and then placed on the carrier tape member H. It is shipped to the market in its preserved state.

In addition, although the above-mentioned embodiment explained the case of manufacturing a light-emitting diode having two lead terminals, the present invention is not limited to the manufacture of this two-terminal type light-emitting diode.
By attaching one lead terminal to each pair of U-shaped terminals 11b, it can be applied to the manufacture of three-terminal type semiconductor components such as diodes, and two It goes without saying that the use of the U-shaped square terminal pair 11b can be applied to the production of other semiconductor parts, such as the production of four-terminal type semiconductor parts.

[Brief explanation of drawings]

Figures 1 to 10 show examples of the present invention; Figure 1 is a diagram of a metal wire being cut, Figure 2 is a diagram of a cut metal wire, and Figure 3 is a diagram of a metal wire being formed. Figure 4 is a diagram showing the U-shaped piece held on the carrier tape member, Figure 5 is
Figure 6 is a diagram of semiconductor chips bonded together, Figure 6 is a diagram of thin metal wires connected, Figure 7 is a diagram with a mold attached, Figure 8
The figure is a perspective view of the molding die, Figure 9 is a diagram when the synthetic resin sealing part is molded, Figure 10 is a diagram when the connection part of the U-shaped piece is cut, Figures 11 and 12 13, 14, and 15 are diagrams showing the conventional case. A...Light emitting diode, 11...Material metal wire,
11a...metal wire piece, llb...U-shaped square terminal pair piece, Ilb'...connection part of U-shaped square terminal pair piece, 12.13...lead terminal , 14... Semiconductor chip, 15... Fine metal wire, 16... Synthetic resin sealing part, D... Correction roller, E... Clamp, F... Header. , G... cutter, H... carrier tape member, J... presser tape, M...
Mold for molding.

Claims (1)

[Claims] (1) A lead terminal pair having at least two lead terminals made of metal wire is attached to a carrier tape member formed into a long strip of flexible material along the longitudinal direction of the carrier tape member. A step of bonding a semiconductor chip to the tip of one lead terminal of each pair of lead terminals while holding the carrier tape member at a constant interval and transferring the carrier tape member in its longitudinal direction; Then, a mold for molding the synthetic resin sealing portion is attached to the carrier tape member so as to fit over the tip of each pair of lead terminals, and 1. A method for manufacturing a semiconductor component, comprising a step of filling a mold with synthetic resin and then curing the synthetic resin.