JPH0350615Y2 - - Google Patents
Info
- Publication number
- JPH0350615Y2 JPH0350615Y2 JP13105587U JP13105587U JPH0350615Y2 JP H0350615 Y2 JPH0350615 Y2 JP H0350615Y2 JP 13105587 U JP13105587 U JP 13105587U JP 13105587 U JP13105587 U JP 13105587U JP H0350615 Y2 JPH0350615 Y2 JP H0350615Y2
- Authority
- JP
- Japan
- Prior art keywords
- connector
- resin
- filled
- filling
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 30
- 229920005989 resin Polymers 0.000 claims description 30
- 238000000605 extraction Methods 0.000 claims 1
- 238000005452 bending Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Multi-Conductor Connections (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Description
【考案の詳細な説明】
本考案は信頼性向上を目的として、電子回路搭
載基板をケースに収納し、樹脂で充填封止する電
子装置に係り特に電極取出し用接続子の構造に関
するものである。[Detailed Description of the Invention] The present invention relates to an electronic device in which an electronic circuit board is housed in a case and filled and sealed with resin for the purpose of improving reliability, and particularly relates to the structure of a connector for taking out an electrode.
樹脂封止型電子装置は、一般には第１図に断面
図を示すように、プリント基板の表面にデイスク
リート部品（Ｔ１，Ｃ１，Ｒ１等）、裏面にチツ
プ部品（Ｔ５，Ｃ５，Ｒ５等）が搭載（固着）さ
れ、所要の電子回路が形成された電子回路搭載基
板１と、該基板より入出力取り出しの為の接続子
２と、これらを収納するケース３及び充填封止す
る充填樹脂４により構成されている。従来、この
種の樹脂封止型電子装置に使用される接続子２
は、第２図に断面の拡大図を示すように、基板１
に挿入した後、デイスクリート部品、チツプ部品
と同時にハンダ付するが、ハンダ付近傍は位置出
しする為のヘツダー部５を設けた、Snメツキ又
はハンダメツキを施こした単線の銅線を使用して
いる。 Resin-sealed electronic devices generally have discrete components (T1, C1, R1, etc.) on the front surface of a printed circuit board, and chip components (T5, C5, R5, etc.) on the back surface, as shown in the cross-sectional view in Figure 1. An electronic circuit mounting board 1 on which is mounted (fixed) and a necessary electronic circuit formed, a connector 2 for taking out input and output from the board, a case 3 housing these, and a filling resin 4 for filling and sealing. It is made up of. Conventionally, a connector 2 used in this type of resin-sealed electronic device
As shown in the enlarged cross-sectional view of FIG.
After inserting the parts into the PCB, solder them at the same time as the discrete and chip parts, using a Sn-plated or solder-plated single copper wire with a header part 5 for positioning near the solder. There is.
このような構造の樹脂封止型電子装置は銅
（Snメツキ又ハンダメツキ）の単線の接続子２が
充填樹脂４より露出している為、次のような問題
点を有する。 The resin-sealed electronic device having such a structure has the following problem because the copper (Sn plating or solder plating) single wire connector 2 is exposed from the filled resin 4.
１ 第３図に充填樹脂４を注入硬化後の詳細を示
すが、充填樹脂４が接続子２にはい上つて硬化
すること。従つてケース３高さ寸法規則がきび
しい時は規格値に入らない場合がある。1. Fig. 3 shows details after the filling resin 4 is injected and hardened, and the filling resin 4 creeps onto the connector 2 and hardens. Therefore, when the case 3 height dimension rules are strict, the height may not fall within the standard value.
２ 樹脂充填硬化後に於いては、接続子２に種々
の外圧が加わるが、第４図ａに示すように接続
子２の折り曲げの力に対しては、接続子２は充
填樹脂４の外側のみで曲がるのではなく、充填
樹脂４の内側より折り曲がる為、硬い充填樹脂
及び軟らかい充填樹脂の場合に於いても、充填
樹脂４と接続子２の密着は剥離し、接続子２を
元にもどしても元通りには直らず、接続子２と
充填樹脂４の間に間隙を生じさせ信頼性を低下
させる欠点がある。さらに接続子２が太く、充
填樹脂４が軟らかい場合、内部の電子回路搭載
基板１にも応用が加わるなど、信頼性に及ぼす
影響は大きい。さらに樹脂を充填する場合、接
続子が曲がつた状態で充填されると各接続子間
隔のバラツキが多くなる等の欠点がある。2 After the resin is filled and cured, various external pressures are applied to the connector 2, but as shown in Figure 4a, the connector 2 only responds to the bending force of the connector 2 on the outside of the filled resin 4. Since the connector 2 is bent from the inside of the filling resin 4 instead of bending, the close contact between the filling resin 4 and the connector 2 will peel off even in the case of hard and soft filling resins, and the connector 2 will be returned to its original position. However, it does not return to its original state, and there is a drawback that a gap is created between the connector 2 and the filled resin 4, reducing reliability. Furthermore, if the connector 2 is thick and the filling resin 4 is soft, the internal electronic circuit mounting board 1 will also have to be used, which will have a large effect on reliability. Furthermore, when filling with resin, there is a drawback that if the connectors are filled in a bent state, the spacing between the connectors increases.
この為、一般には第４図ｂに示すように蓋９を
設けて、接続子の折りまげに対して蓋の部分が支
点となつて曲がるように工夫している例も見受け
られる。しかし、この様に蓋を取付けた場合、充
填樹脂が多く注入されるとケース周辺に充填樹脂
が這い上がり蓋が出来ない等の欠点も多い。 For this reason, there are cases in which a lid 9 is generally provided as shown in FIG. 4b, so that the lid part serves as a fulcrum and bends when the connector is folded. However, when the lid is attached in this manner, there are many drawbacks, such as when a large amount of the filling resin is injected, the filling resin creeps up around the case, making it impossible to form a lid.
本考案は係る欠点を解消し、一般の樹脂封止型
電子装置の信頼性向上に寄与する装置を提供する
ものである。 The present invention eliminates such drawbacks and provides a device that contributes to improving the reliability of general resin-sealed electronic devices.
第５図〜第７図は、本考案に通用される接続子
６形状の一例を示す。この接続子は、外部に露出
して他の回路等に接続する為に、容易に変形する
接続子部分６−１と、主として充填樹脂に充填さ
れ、前述の容易に変形する接続子部分６−１より
も折り曲げ強度を向上させる為に直径を大きく
し、容易に変形しない接続子部分６−２を設けた
ことに特徴がある。尚６−３は従来接続子と同
様、基板と接続する部分である。 5 to 7 show an example of the shape of the connector 6 that is applicable to the present invention. This connector includes a connector portion 6-1 which is exposed to the outside and is easily deformed in order to be connected to other circuits, etc., and a connector portion 6-1 which is mainly filled with filling resin and which is easily deformed as described above. The connector part 6-2 is characterized by having a larger diameter than the connector part 6-2 which is not easily deformed in order to improve the bending strength than the connector part 6-2. Note that 6-3 is a part that connects to the board, similar to the conventional connector.
第９図は、本考案の一実施例構造を示し、樹脂
封止型電子装置の接続子６付近の断面図を示す
が、容易に変形しない接続子部分６−２の大半は
充填の這い上がりを含んで充填樹脂４内に位置す
ると共に、容易に変形しない接続子部分６−２の
上側の型の部分６−４に充填樹脂４の這い上がり
がないことが特徴であり、次のような利点を有す
る。 FIG. 9 shows the structure of an embodiment of the present invention, and shows a cross-sectional view of the vicinity of the connector 6 of a resin-sealed electronic device. Most of the connector portion 6-2, which is not easily deformed, is filled with creeping up. It is characterized by the fact that the filling resin 4 does not creep up on the upper mold part 6-4 of the connector part 6-2, which is located in the filling resin 4 and does not easily deform. has advantages.
イ 第１０図は充填樹脂を充填、キユアー後に於
いて接続子を折り曲げた状態を示すが、接続子
は、外部に露出している細い、容易に変形する
接続子部分６−１で曲がるため、充填樹脂４
と、容易に変形しない接続子部分６−２との間
に間隙を発生させることがない。さらに内部の
基板１に応力が加わることも防止できる。(a) Fig. 10 shows the state in which the connector is bent after filling with the filling resin and curing, but since the connector bends at the thin and easily deformed connector part 6-1 exposed to the outside, Filled resin 4
A gap is not generated between the connector portion 6-2 and the connector portion 6-2, which does not easily deform. Furthermore, it is possible to prevent stress from being applied to the internal substrate 1.
ロ 充填樹脂４の注入に於いては、第９図に示す
ように、容易に変形しない接続子部分６−２で
行う必要があるが形状が明確な為、這い上がり
を含んで所要の位置におさえることは可能であ
り、外形上の前述の寸法問題も解決することも
可能である。(b) When injecting the filling resin 4, it is necessary to inject the connector part 6-2, which does not easily deform, as shown in Figure 9, but since the shape is clear, it can be injected into the required position including the creeping up. It is possible to suppress the size, and it is also possible to solve the above-mentioned dimensional problem regarding the external shape.
第１１図は本考案の他の実施例構造を示し、充
填樹脂４の上端に位置する部分に鍔部７を設けた
例である。鍔部７より下側の樹脂充填される容易
に変形しない接続子部分６−２は、鍔部を含んで
外部に露出している容易に変形する接続子部分６
−１より直径が太い為、その効果は同様である。 FIG. 11 shows another embodiment of the present invention, in which a flange 7 is provided at the upper end of the filled resin 4. As shown in FIG. The connector portion 6-2 that is filled with resin and is not easily deformed below the flange 7 is the connector portion 6 that is easily deformed and is exposed to the outside including the flange.
Since the diameter is thicker than -1, the effect is the same.
なお第８図は、従来の接続子２にハトメ８を挿
入し、接続子２とハトメ８の間をハンダ９つけし
た例を示すが、これについても同様の効果が得ら
れることは明白である。 FIG. 8 shows an example in which an eyelet 8 is inserted into the conventional connector 2 and solder 9 is attached between the connector 2 and the eyelet 8, but it is clear that the same effect can be obtained with this as well. .
又第１２図は充填樹脂が浅い場合に好適な接続
子を示し、充填樹脂内で接続子が折り曲がること
を防止する。 FIG. 12 also shows a connector suitable for cases where the resin filling is shallow and prevents the connector from bending within the resin filling.
更に第１３図は充填樹脂４表面付近の接続子断
面を示すが、図ａに対しｂは充填樹脂４の量が少
なく、容易に変形しない接続子部分６−２が一部
露出しているが効果としては同じである。 Furthermore, FIG. 13 shows a cross section of the connector near the surface of the filled resin 4, and compared to FIG. The effect is the same.
因みに本考案装置において、切削加工の他、太
い容易に変形しない接続子部分６−２をヘツダー
加工により制作することも可能であり、さらには
容易に変形しない接続子部分６−２に対し、容易
に変形する接続子部分６−１を引き抜き加工、又
はダイス加工により所要の形状に仕上げることも
可能である。 Incidentally, with the device of the present invention, in addition to cutting, it is also possible to produce the thick connector part 6-2 that does not easily deform by header processing, and furthermore, it is possible to produce the connector part 6-2 that is not easily deformed by easily deforming the connector part 6-2. It is also possible to finish the connector portion 6-1, which deforms into a desired shape, by drawing or die processing.
以上の実施例では本案を電子回路装置に適用し
た例について説明したが半導体装置等にも応用可
能であることは明白である。 In the above embodiments, an example in which the present invention is applied to an electronic circuit device has been described, but it is obvious that the present invention can also be applied to a semiconductor device, etc.
以上の説明により明らかなように、本考案によ
れば特殊構造の接続子を樹脂封止型電子装置に適
用した結果、充填樹脂の硬、軟に左右されること
なく良好な結果が得られたので、装置の信頼性向
上に絶大な効果を得ることが可能であり、実用上
の効果は大きい。 As is clear from the above explanation, according to the present invention, as a result of applying the specially structured connector to a resin-sealed electronic device, good results were obtained regardless of the hardness or softness of the filled resin. Therefore, it is possible to obtain a tremendous effect in improving the reliability of the device, and the practical effect is great.
第１図及び第２図〜第４図は従来装置の断面図
及びその説明図、第５図〜第８図及び第１２図は
本考案に適用される接続子の構造図、第９図及び
第１１図は本考案の実施例構造図、第１０図、及
び第１３図は本考案実施例装置の説明図である。
図中、１は電子回路搭載基板、２は従来の接続
子、３はケース、４は充填樹脂、５はヘツダー、
６は本考案の接続子、６−１は接続子の外部に露
出し容易に変形する接続子部分、６−２は接続子
の容易に変形しない接続子部分、６−３は接続子
の基板と接続する部分、６−４は接続子の肩の部
分、７は接続子の鍔部、８はハトメである。
1, 2 to 4 are cross-sectional views of the conventional device and their explanatory diagrams, FIGS. 5 to 8, and 12 are structural diagrams of the connector applied to the present invention, and FIGS. FIG. 11 is a structural diagram of an embodiment of the present invention, and FIGS. 10 and 13 are explanatory diagrams of an apparatus according to an embodiment of the present invention. In the figure, 1 is an electronic circuit mounting board, 2 is a conventional connector, 3 is a case, 4 is a filled resin, 5 is a header,
6 is a connector of the present invention, 6-1 is a connector portion that is exposed to the outside of the connector and is easily deformed, 6-2 is a connector portion that is not easily deformed, and 6-3 is a board of the connector. 6-4 is the shoulder part of the connector, 7 is the flange of the connector, and 8 is the eyelet.
Claims (1)
型電子装置に於いて外部に露出して他の回路等
と接続する為に容易に変形する接続子部分Ａと
主として充填樹脂内に位置して容易に変形しな
い接続子部分Ｂと、基板等と接続する接続子部
分より構成された接続子を備え且つ該接続子の
線径がＢ＞Ａであることを特徴とする樹脂封止
型電子装置。 (2) 充填樹脂を接続子部分Ｂ近傍まで充填したこ
とを特徴とする実用新案登録請求の範囲第(1)項
記載の樹脂封止型電子装置。[Claims for Utility Model Registration] (1) In a resin-sealed electronic device having a connector for input/output extraction, a connector portion that is exposed to the outside and easily deforms for connection to other circuits, etc. A, a connector part B that is mainly located in the filled resin and does not deform easily, and a connector part that connects to a board etc., and the wire diameter of the connector is B>A. A resin-sealed electronic device characterized by: (2) The resin-sealed electronic device according to claim (1) of the utility model registration, characterized in that the filling resin is filled up to the vicinity of the connector portion B.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13105587U JPH0350615Y2 (en) | 1987-08-28 | 1987-08-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13105587U JPH0350615Y2 (en) | 1987-08-28 | 1987-08-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6435672U JPS6435672U (en) | 1989-03-03 |
| JPH0350615Y2 true JPH0350615Y2 (en) | 1991-10-29 |
Family
ID=31386769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13105587U Expired JPH0350615Y2 (en) | 1987-08-28 | 1987-08-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0350615Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0661205B2 (en) * | 1992-08-25 | 1994-08-17 | アース製薬株式会社 | Electric mosquito catcher |
| JP6194859B2 (en) * | 2014-07-10 | 2017-09-13 | 株式会社デンソー | Semiconductor device and manufacturing method thereof |
-
1987
- 1987-08-28 JP JP13105587U patent/JPH0350615Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6435672U (en) | 1989-03-03 |
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