JPH035046B2 - - Google Patents
Info
- Publication number
- JPH035046B2 JPH035046B2 JP59276543A JP27654384A JPH035046B2 JP H035046 B2 JPH035046 B2 JP H035046B2 JP 59276543 A JP59276543 A JP 59276543A JP 27654384 A JP27654384 A JP 27654384A JP H035046 B2 JPH035046 B2 JP H035046B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- capacitor
- capacitor element
- exterior
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 38
- 239000011347 resin Substances 0.000 claims description 38
- 239000003990 capacitor Substances 0.000 claims description 24
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 229920001187 thermosetting polymer Polymers 0.000 description 7
- 238000007598 dipping method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は樹脂デイツプ型コンデンサの製造方法
に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method of manufacturing a resin dip type capacitor.
（従来の技術）
樹脂デイツプ型コンデンサは、コンデンサ素子
を熱硬化性樹脂等の樹脂中にデイツプし、加熱硬
化して製造される。(Prior Art) A resin dip type capacitor is manufactured by dipping a capacitor element in a resin such as a thermosetting resin and curing the resin by heating.
ところで、コンデンサ素子を樹脂中にデイツプ
すると、通常、コンデンサ素子から引き出されて
いるリード端子に樹脂が這い上がる。このリード
端子に這い上がつた樹脂は、コンデンサを印刷配
線板に取り付け難くする原因となるため、除去さ
れることがある。 By the way, when a capacitor element is dipped in resin, the resin usually creeps up onto the lead terminals drawn out from the capacitor element. This resin creeping up onto the lead terminals may make it difficult to attach the capacitor to the printed wiring board, so it may be removed.
リード端子に這い上がつた樹脂を除去する方法
として、従来、例えば熱硬化性樹脂中にコンデン
サ素子をデイツプした後、加熱して樹脂を半硬化
状態とし、継いで円板状のカツターによりリード
端子に付着した樹脂の任意の箇所に切れ目を入
れ、余分な樹脂をブラシ等により除去し、その
後、加熱して樹脂を完全に硬化している。 Conventionally, as a method for removing the resin that has climbed up to the lead terminals, for example, the capacitor element is dipped in a thermosetting resin, the resin is heated to a semi-hardened state, and then the lead terminals are removed using a disc-shaped cutter. A cut is made at an arbitrary point in the resin adhering to the material, excess resin is removed with a brush, etc., and the resin is then heated to completely cure it.
（発明が解決しようとする問題点）
しかしながら、リード線に付着した樹脂に円板
状のカツターにより切れ目を入れると、外装とし
て必要な部分にヒビ割れが生じる欠点があつた。
また、金属化プラスチツクコンデンサ等の場合に
はリード端子とメタリコンとの接続が不良となる
欠点もあつた。(Problems to be Solved by the Invention) However, when the resin adhered to the lead wire is cut with a disk-shaped cutter, there is a drawback that cracks occur in the portion required for the exterior.
Further, in the case of metallized plastic capacitors, etc., there was a drawback that the connection between the lead terminal and the metallized capacitor was poor.
本発明の目的は以上の欠点を改良し、樹脂外装
にヒビ割れ等の生じることのないかつリード端子
の接続不良を防止しうる樹脂テイツプ型コンデン
サの製造方法を提供するものである。 SUMMARY OF THE INVENTION An object of the present invention is to improve the above-mentioned drawbacks and to provide a method for manufacturing a resin tape type capacitor that does not cause cracks or the like in the resin exterior and prevents poor connection of lead terminals.
（問題点を解決するための手段）
本発明は、以上の欠点を改良するために、コン
デンサ素子を樹脂中にデイツプして外装を形成し
リード端子を該外装から引き出したコンデンサの
製造方法において、コンデンサ素子に付着した樹
脂を完全に硬化させた後にリード端子に付着した
前記樹脂をウオータージエツトにより切断し、除
去することを特徴とする樹脂デイツプ型コンデン
サの製造方法を提供するものである。(Means for Solving the Problems) In order to improve the above-mentioned drawbacks, the present invention provides a capacitor manufacturing method in which a capacitor element is dipped in resin to form an exterior, and lead terminals are drawn out from the exterior. There is provided a method for manufacturing a resin dip type capacitor, characterized in that the resin adhering to a capacitor element is completely cured, and then the resin adhering to a lead terminal is cut and removed by a water jet.
（作用）
本発明は、以上の通り、樹脂を完全に硬化させ
た後に水を数千気圧という高圧で吹き付けるウオ
ータージエツトにより切れ目を入れる等している
ため、他の樹脂外装に加わるストレスが少なく、
ヒビ割れを防止できるとともに、リード端子は樹
脂の外装により確実に固定されているため接続不
良をも防止できる。(Function) As described above, in the present invention, after the resin is completely cured, cuts are made using a water jet that sprays water at a high pressure of several thousand atmospheres, so that less stress is applied to other resin exteriors. ,
Cracks can be prevented, and since the lead terminals are securely fixed by the resin exterior, connection failures can also be prevented.
（実施例） 以下、本発明を実施令に基づいて説明する。(Example) The present invention will be explained below based on the implementation order.
先ず、金属化プラスチツクフイルムコンデンサ
素子や金属化紙コンデンサ素子等のコンデンサ素
子を予じめ加熱し、粉末状エポキシ樹脂等の熱硬
化性樹脂中にデイツプする。次に、コンデンサ素
子を熱硬化性樹脂から引き出し、加熱して付着し
た樹脂を完全に硬化する。樹脂を完全に硬化した
後、リード端子に付着した熱硬化性樹脂の部分に
ウオータージエツトにより切れ目を入れる。熱硬
化性樹脂に切れ目を入れた後、切れ目からリード
端子の先端の方に付着している熱硬化性樹脂をブ
ラシ等により除去する。 First, a capacitor element such as a metallized plastic film capacitor element or a metallized paper capacitor element is preheated and dipped into a thermosetting resin such as a powdered epoxy resin. Next, the capacitor element is pulled out of the thermosetting resin and heated to completely cure the attached resin. After the resin is completely cured, a water jet is used to make cuts in the thermosetting resin attached to the lead terminals. After making a cut in the thermosetting resin, the thermosetting resin adhering to the tip of the lead terminal from the cut is removed using a brush or the like.
（発明の効果）
以上の通り、本発明によれば、ウオータージエ
ツトにより切れ目を入れる等しているために外装
のヒビ割れを防止しうるとともに、樹脂が完全に
硬化しているためにリード端子の接続不良を防止
しうる樹脂デイツプ型コンデンサの製造方法が得
られる。(Effects of the Invention) As described above, according to the present invention, cracks in the exterior can be prevented because the water jet makes cuts, etc., and the resin is completely cured, so the lead terminal A method for manufacturing a resin dip type capacitor that can prevent poor connection is obtained.
Claims (1)
上を形成しリード端子を該外装から引き出したコ
ンデンサの製造方法において、コンデンサ素子に
付着した樹脂を完全に硬化させた後にリード端子
に付着した前記樹脂をウオータージエツトにより
切断し、除去することを特徴とする樹脂デイツプ
型コンデンサの製造方法。1. In a method for manufacturing a capacitor in which a capacitor element is dipped in a resin to form an exterior and a lead terminal is drawn out from the exterior, the resin attached to the lead terminal is removed after the resin attached to the capacitor element is completely cured. A method for manufacturing a resin dip type capacitor, which is characterized by cutting and removing the resin dip type capacitor using a water jet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59276543A JPS61156806A (en) | 1984-12-28 | 1984-12-28 | Manufacture of resin dip type capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59276543A JPS61156806A (en) | 1984-12-28 | 1984-12-28 | Manufacture of resin dip type capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61156806A JPS61156806A (en) | 1986-07-16 |
| JPH035046B2 true JPH035046B2 (en) | 1991-01-24 |
Family
ID=17570939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59276543A Granted JPS61156806A (en) | 1984-12-28 | 1984-12-28 | Manufacture of resin dip type capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61156806A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7094633B2 (en) | 2003-06-23 | 2006-08-22 | Sandisk Corporation | Method for efficiently producing removable peripheral cards |
-
1984
- 1984-12-28 JP JP59276543A patent/JPS61156806A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61156806A (en) | 1986-07-16 |
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