JPH0350441U - - Google Patents
Info
- Publication number
- JPH0350441U JPH0350441U JP11235689U JP11235689U JPH0350441U JP H0350441 U JPH0350441 U JP H0350441U JP 11235689 U JP11235689 U JP 11235689U JP 11235689 U JP11235689 U JP 11235689U JP H0350441 U JPH0350441 U JP H0350441U
- Authority
- JP
- Japan
- Prior art keywords
- heating resistor
- thermal head
- density
- laminated
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 claims description 2
- 239000011241 protective layer Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
Landscapes
- Electronic Switches (AREA)
Description
第１図は本考案のサーマルヘツドの一実施例を
示す断面図と平面図、第２図Ａ，Ｂは本考案のサ
ーマルヘツドにおいて、一段目の電極パターニン
グ後の断面図と平面図、第３図Ａ，Ｂは本考案の
サーマルヘツドにおいて、二段目の抵抗体パター
ニング後の断面図と平面図、第４図は従来のサー
マルヘツドの説明図、第５図は印字濃度比較結果
を示す説明図である。
１……絶縁基板、２……グレーズ層、３……発
熱抵抗体、４……電極、５……保護層、６……プ
ラテン、７……感熱紙。
FIG. 1 is a sectional view and a plan view showing an embodiment of the thermal head of the present invention, FIGS. 2A and B are a sectional view and a plan view of the thermal head of the present invention after the first stage electrode patterning, and Figures A and B are a sectional view and a plan view of the thermal head of the present invention after the second stage resistor patterning, Figure 4 is an explanatory diagram of a conventional thermal head, and Figure 5 is an explanation showing the print density comparison results. It is a diagram. DESCRIPTION OF SYMBOLS 1... Insulating substrate, 2... Glaze layer, 3... Heat generating resistor, 4... Electrode, 5... Protective layer, 6... Platen, 7... Thermal paper.
Claims (1)
配線および保護層を順次積層してなるサーマルヘ
ツドにおいて、該電極と発熱抵抗体を多層に積層
させ、電極密度を発熱抵抗体密度より低くしたこ
とを特徴とするサーマルヘツド。 In a thermal head in which a glaze layer, a heating resistor, electrode wiring, and a protective layer are sequentially laminated on an insulating substrate, the electrodes and the heating resistor are laminated in multiple layers, and the electrode density is lower than the density of the heating resistor. A thermal head featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11235689U JPH0350441U (en) | 1989-09-26 | 1989-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11235689U JPH0350441U (en) | 1989-09-26 | 1989-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0350441U true JPH0350441U (en) | 1991-05-16 |
Family
ID=31660803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11235689U Pending JPH0350441U (en) | 1989-09-26 | 1989-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0350441U (en) |
-
1989
- 1989-09-26 JP JP11235689U patent/JPH0350441U/ja active Pending