JPH0349937B2 - - Google Patents
Info
- Publication number
- JPH0349937B2 JPH0349937B2 JP24101883A JP24101883A JPH0349937B2 JP H0349937 B2 JPH0349937 B2 JP H0349937B2 JP 24101883 A JP24101883 A JP 24101883A JP 24101883 A JP24101883 A JP 24101883A JP H0349937 B2 JPH0349937 B2 JP H0349937B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- weight
- powder
- resin
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- -1 polypropylene Polymers 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 9
- 239000000835 fiber Substances 0.000 claims description 9
- 238000002844 melting Methods 0.000 claims description 9
- 230000008018 melting Effects 0.000 claims description 9
- 239000000805 composite resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 229920003002 synthetic resin Polymers 0.000 claims description 7
- 239000000057 synthetic resin Substances 0.000 claims description 7
- 229910001369 Brass Inorganic materials 0.000 claims description 6
- 239000010951 brass Substances 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- 238000010008 shearing Methods 0.000 claims description 6
- 239000012255 powdered metal Substances 0.000 claims description 5
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 3
- 229930040373 Paraformaldehyde Natural products 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 239000004793 Polystyrene Substances 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 claims description 3
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 3
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 3
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 3
- 229920006324 polyoxymethylene Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 229920002223 polystyrene Polymers 0.000 claims description 3
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 3
- 239000004800 polyvinyl chloride Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 229920006337 unsaturated polyester resin Polymers 0.000 claims description 3
- 239000000463 material Substances 0.000 description 9
- 238000004898 kneading Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 239000003973 paint Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
本発明は複合樹脂組成物に関し、詳しくは電磁
波シールド性能が極めて高く、加工品の形状等に
かかわらずシールド性能にばらつきがなく、成形
流動性、成形外観等が優れている複合樹脂組成物
に関する。
従来より、電磁波をシールドする材料として金
属、金属含有樹脂、樹旨と金属の積層物、金属粉
含有塗料をコーテイングあるいはメツキしたもの
等が知られている。しかしながら、金属はシール
ド性能は良好であるが、形状加工が複雑であつ
て、バリの処理、研摩などの二次処理が必要であ
る。金属含有樹脂あるいは金属と樹脂の積層物に
おいては、シールド性能が低い。加工品の部
位によりシールド性能にばらつきがあり、シール
ド性能が不安定である、成形加工性、特に成形
流動性に劣りそのため、大型成形物の成形が困難
である、成形品の外観が不良で、表面の二次加
工処理が必要である等の問題がある。また、金属
粉含有塗料をコーテイングあるいはメツキしたも
のは基材への塗料の密着性が不良であり、特に経
時的密着力の低下が著しく、複雑な形状の物品へ
のコーテイングあるいはメツキが困難であるなど
の欠点を有している。
このように、従来は電磁波のシールド材料とし
て充分満足し得る材料が提案されていなかつた。
そこで、本発明者らはシールド性能、成形性等
が良好である材料を開発すべく研究した結果、合
成樹脂に特定の金属を配合した組成物がシールド
材料として優れていることを見い出し、この知見
に基づいて本発明を完成した。
すなわち本発明は、(A)合成樹脂(以下、(A)成分
という。)4〜30重量%、(B)低融点および/ある
いは剪断で可塑化可能である金属(以下、(B)成分
という。)90〜10重量%、(C)繊維状金属(以下、
(C)成分という。)3〜30重量%および(D)粉末状金
属(以下、(D)成分という。)3〜30重量%からな
る組成物であつて、
前記(A)合成樹脂がアクリロニトリル−ブタジエ
ン−スチレン樹脂、ポリプロピレン、ポリエチレ
ン、ポリスチレン、ポリ塩化ビニル、ポリアミ
ド、ポリメチルメタクリレート、ポリカーボネー
ト、ポリオキシメチレン、ポリエチレンテレフタ
レート、ポリブチレンテレフタレート、不飽和ポ
リエステル樹脂またはエポキシ樹脂であり、
前記(B)低融点および/あるいは剪断で可塑化可
能である金属が鉛、スズ、ハンダの1種あるいは
2種以上であり、
前記(C)繊維状金属が黄銅フアイバー、ニツケル
フアイバー、アルミニウムフアイバーの1種ある
いは2種以上であり、
前記(D)粉末状金属が黄銅粉、ニツケル粉、亜鉛
粉、鉄粉の1種あるいは2種以上
であることを特徴とする複合樹脂組成物である。
本発明の(A)成分である合成樹脂として具体的に
はアクリロニトリル−ブタジエン−スチレン樹脂
(ABS樹脂)、ポリプロピレン、ポリエチレン、
ポリスチレン、ポリ塩化ビニル、ナイロン−6や
ナイロン−6,6などのポリアミド、ポリメチル
メタクリレート、ポリカーボネート、ポリオキシ
メチレン、ポリエチレンテレフタレート、ポリブ
チレンテレフタレート、不飽和ポリエステル樹
脂、エポキシ樹脂が挙げられる。
次に、本発明の(B)成分である低融点および/あ
るいは剪断で可塑化可能である金属とは、融点が
上記合成樹脂の分解温度以下の低い温度であるこ
とおよび剪断、例えば通常の成形加工機、混練機
による剪断などにより、融点以下の温度において
可塑状態になり変形可能であることのいずれか一
方または両方の性質を有する金属である。ここ
で、低融点金属としては特に融点500℃以下のも
のが好ましい。(B)成分は、上記条件を満足するも
のであれば、単体金属のほか合金であつても良
く、これらを組み合わせたものでもよい。
(B)成分として具体的には鉛、スズ、ハンダの1
種あるいは2種以上が用いられる。
本発明の(C)成分は繊維状金属であつて、黄銅フ
アイバー、ニツケルフアイバー、アルミニウムフ
アイバーの1種または2種以上を用いる。形状と
しては特に制限はないが、通常は長さ1〜5mm、
好ましくは2〜3mm、径5〜80μ、好ましくは10
〜60μのものを用いる。
次に、本発明の(D)成分は粉末状金属であつて、
黄銅粉、ニツケル粉、亜鉛粉、鉄粉の1種または
2種以上を用いる。粉末の大きさについては特に
制限はないが、通常は粒径1〜10μ、好ましくは
2〜8μである。粒径が10μを超えると、機械的物
性が低下し、1μ未満であると、分散が不良とな
り好ましくない。
本発明において各成分の配合量は使用する樹脂
あるいは金属の種類により、さらには目的とする
物性などにより異なるが、通常は(A)成分4〜30重
量%、(B)成分90〜10重量%、(C)成分3〜30重量
%、(D)成分3〜30重量%の範囲で配合され、好ま
しくは(A)成分5〜23重量%、(B)成分87〜15重量
%、(C)成分5〜25重量%、(D)成分5〜25重量%で
ある。
本発明の複合樹脂組成物は上記成分を混練する
ことにより得られる。各成分の混練は通常行なわ
れている方法、例えばバンバリーミキサー、一軸
押出機、二軸押出機等の混練機を用いて行なわれ
る。混練条件は例えばバンバリーミキサーで行な
う場合、温度100〜150℃にて15〜30分間行なわ
れ、また、押出機を用いる場合は混練温度200〜
250℃で行なうことが好ましい。
このようにして得られる複合樹脂組成物は、電
磁波シールド性能が極めて高いものである。ま
た、成形品とした場合においても、部位によるシ
ールド性能のばらつきが非常に小さく安定してい
る。さらに、成形流動性に優れ、成形外観も良好
であつて、小型から大型の成形品まで生産性よく
二次加工なども必要とせず、製造することができ
る。
したがつて、本発明の複合樹脂組成物はシール
ド材料として特に好適であり、コンピユーター機
器、ビデオ・オーデイオ製品、事務機器、電子機
器、家電製品、自動車部品、通信機器などの材料
として巾広く有効に利用し得る。
次に、実施例により本発明を詳しく説明する。
実施例1〜29および比較例1〜12
第1表に示した成分を所定量配合し、バンバリ
ーミキサーにて第1表に示す温度で混練押出しを
した後、10オンス射出成形機(東芝機械(株)製)に
て第1表に示す温度で150mm×150mm×3mmのプレ
ート、ASTM D−256に準拠したテストピース
60mm×85mm×120mmの箱状成形品を成形した。
得られた成形品について、評価を行なつた。結
果を第2表に示す。なお、評価方法は以下の方法
により行なつた。
評価方法
1 体積固有抵抗
射出成形して得られた60mm×85mm×120mmの
箱状成形品の60mm×120mmの面(ゲートを有す
る)の中心点をA、85mm×120mmの面の中心点
をB、60mm×85mmの面の中心点をCとして各々
の点の体積固有抵抗をソリツドステート式抵抗
ブリツジSW−1−TRを用いて測定した。
2 アイゾツド衝撃試験
ASTM D−256の準拠
3 成形性
スパイラルフロー長さ(S.F.L.)
JIS K−7210に準拠
The present invention relates to a composite resin composition, and more particularly to a composite resin composition that has extremely high electromagnetic shielding performance, has no variation in shielding performance regardless of the shape of the processed product, and has excellent molding fluidity, molded appearance, etc. Conventionally, as materials for shielding electromagnetic waves, metals, metal-containing resins, laminates of wood and metal, and materials coated or plated with metal powder-containing paints have been known. However, although metal has good shielding performance, it is complicated to shape and requires secondary treatments such as burr treatment and polishing. Shielding performance is low in metal-containing resins or laminates of metal and resin. The shielding performance varies depending on the part of the processed product, making the shielding performance unstable. The molding processability, especially the molding fluidity, is poor, making it difficult to mold large molded products. The appearance of the molded product is poor. There are problems such as the need for secondary processing of the surface. Additionally, paints coated or plated with metal powder-containing paints have poor adhesion to the base material, and in particular, the adhesion deteriorates significantly over time, making it difficult to coat or plate objects with complex shapes. It has drawbacks such as: Thus, until now, no material has been proposed that is fully satisfactory as a material for shielding electromagnetic waves. Therefore, the present inventors conducted research to develop a material with good shielding performance, moldability, etc., and found that a composition containing a specific metal in a synthetic resin is excellent as a shielding material. The present invention was completed based on this. That is, the present invention comprises (A) a synthetic resin (hereinafter referred to as (A) component) of 4 to 30% by weight, (B) a metal having a low melting point and/or which can be plasticized by shearing (hereinafter referred to as (B) component). ) 90-10% by weight, (C) fibrous metal (hereinafter referred to as
It is called component (C). ) 3 to 30% by weight and (D) powdered metal (hereinafter referred to as component (D)) 3 to 30% by weight, wherein the (A) synthetic resin is an acrylonitrile-butadiene-styrene resin, Polypropylene, polyethylene, polystyrene, polyvinyl chloride, polyamide, polymethyl methacrylate, polycarbonate, polyoxymethylene, polyethylene terephthalate, polybutylene terephthalate, unsaturated polyester resin or epoxy resin, and (B) has a low melting point and/or shear. The plasticizable metal is one or more of lead, tin, and solder, and the fibrous metal (C) is one or more of brass fiber, nickel fiber, and aluminum fiber, and ( D) A composite resin composition characterized in that the powdered metal is one or more of brass powder, nickel powder, zinc powder, and iron powder. Specifically, the synthetic resin that is component (A) of the present invention includes acrylonitrile-butadiene-styrene resin (ABS resin), polypropylene, polyethylene,
Examples include polystyrene, polyvinyl chloride, polyamides such as nylon-6 and nylon-6,6, polymethyl methacrylate, polycarbonate, polyoxymethylene, polyethylene terephthalate, polybutylene terephthalate, unsaturated polyester resins, and epoxy resins. Next, the component (B) of the present invention, which is a metal that has a low melting point and/or can be plasticized by shearing, has a melting point that is lower than the decomposition temperature of the synthetic resin, and a metal that can be plasticized by shearing, such as normal molding. It is a metal that has one or both of the properties of becoming plastic and deformable at a temperature below its melting point by shearing by a processing machine or a kneading machine. Here, the low melting point metal is particularly preferably one with a melting point of 500°C or lower. Component (B) may be a single metal, an alloy, or a combination of these as long as it satisfies the above conditions. (B) Specifically, the ingredients are lead, tin, and solder.
One species or two or more species may be used. Component (C) of the present invention is a fibrous metal, and one or more of brass fibers, nickel fibers, and aluminum fibers are used. There are no particular restrictions on the shape, but the length is usually 1 to 5 mm,
Preferably 2-3 mm, diameter 5-80μ, preferably 10
~60μ is used. Next, component (D) of the present invention is a powdered metal,
One or more of brass powder, nickel powder, zinc powder, and iron powder is used. There are no particular restrictions on the size of the powder, but the particle size is usually 1 to 10 microns, preferably 2 to 8 microns. If the particle size exceeds 10 μm, the mechanical properties will deteriorate, and if the particle size is less than 1 μm, dispersion will be poor, which is not preferable. In the present invention, the blending amount of each component varies depending on the type of resin or metal used and the desired physical properties, but usually component (A) is 4 to 30% by weight and component (B) is 90 to 10% by weight. , (C) component 3 to 30% by weight, (D) component 3 to 30% by weight, preferably (A) component 5 to 23% by weight, (B) component 87 to 15% by weight, (C) component 3 to 30% by weight. ) component is 5 to 25% by weight, and component (D) is 5 to 25% by weight. The composite resin composition of the present invention can be obtained by kneading the above components. The components are kneaded by a conventional method, for example, using a kneading machine such as a Banbury mixer, a single-screw extruder, or a twin-screw extruder. For example, when using a Banbury mixer, the kneading is performed at a temperature of 100 to 150°C for 15 to 30 minutes, and when using an extruder, the kneading is performed at a temperature of 200 to 150°C.
Preferably, it is carried out at 250°C. The composite resin composition thus obtained has extremely high electromagnetic shielding performance. Furthermore, even when it is made into a molded product, the variation in shielding performance depending on the part is very small and stable. Furthermore, it has excellent molding fluidity and a good molded appearance, and can be manufactured from small to large molded products with high productivity without the need for secondary processing. Therefore, the composite resin composition of the present invention is particularly suitable as a shielding material, and can be widely used as a material for computer equipment, video/audio products, office equipment, electronic equipment, home appliances, automobile parts, communication equipment, etc. It can be used. Next, the present invention will be explained in detail with reference to Examples. Examples 1 to 29 and Comparative Examples 1 to 12 The ingredients shown in Table 1 were blended in predetermined amounts, and the mixture was kneaded and extruded using a Banbury mixer at the temperature shown in Table 1. 150mm x 150mm x 3mm plate, test piece compliant with ASTM D-256, at the temperature shown in Table 1.
A box-shaped molded product measuring 60 mm x 85 mm x 120 mm was molded. The obtained molded product was evaluated. The results are shown in Table 2. The evaluation method was as follows. Evaluation method 1 Volume resistivity The center point of the 60 mm x 120 mm surface (with a gate) of the 60 mm x 85 mm x 120 mm box-shaped molded product obtained by injection molding is A, and the center point of the 85 mm x 120 mm surface is B. The volume resistivity at each point was measured using a solid-state resistance bridge SW-1-TR, with the center point of the 60 mm x 85 mm surface being C. 2 Izod impact test Compliant with ASTM D-256 3 Formability Spiral flow length (SFL) Compliant with JIS K-7210
【表】
外観
体積固有抵抗測定に用いた成形品の外観を
目視により判定した。
〇…美観
△…若干繊維状に毛羽立ち
×…繊維状に毛羽立ち激しい[Table] Appearance The appearance of the molded product used for volume resistivity measurement was visually judged. 〇…Aesthetics △…Slightly fibrous and fluffy ×…Strong fibrous fluff
【表】【table】
【表】【table】
【表】【table】
Claims (1)
あるいは剪断で可塑化可能である金属90〜10重量
%、(C)繊維状金属3〜30重量%および(D)粉末状金
属3〜30重量%からなる組成物であつて、 前記(A)合成樹脂がアクリロニトリル−ブタジエ
ン−スチレン樹脂、ポリプロピレン、ポリエチレ
ン、ポリスチレン、ポリ塩化ビニル、ポリアミ
ド、ポリメチルメタクリレート、ポリカーボネー
ト、ポリオキシメチレン、ポリエチレンテレフタ
レート、ポリブチレンテレフタレート、不飽和ポ
リエステル樹脂またはエポキシ樹脂であり、 前記(B)低融点および/あるいは剪断で可塑化可
能である金属が鉛、スズ、ハンダの1種あるいは
2種以上であり、 前記(C)繊維状金属が黄銅フアイバー、ニツケル
フアイバー、アルミニウムフアイバーの1種ある
いは2種以上であり、 前記(D)粉末状金属が黄銅粉、ニツケル粉、亜鉛
粉、鉄粉の1種あるいは2種以上 であることを特徴とする複合樹脂組成物。[Scope of Claims] 1 (A) 4 to 30% by weight of synthetic resin, (B) low melting point and/or
Alternatively, a composition comprising 90 to 10% by weight of a metal that can be plasticized by shearing, (C) 3 to 30% by weight of a fibrous metal, and (D) 3 to 30% by weight of a powdered metal, which comprises (A) The synthetic resin is acrylonitrile-butadiene-styrene resin, polypropylene, polyethylene, polystyrene, polyvinyl chloride, polyamide, polymethyl methacrylate, polycarbonate, polyoxymethylene, polyethylene terephthalate, polybutylene terephthalate, unsaturated polyester resin or epoxy resin, (B) The metal that has a low melting point and/or can be plasticized by shearing is one or more of lead, tin, and solder, and (C) the fibrous metal is one of brass fiber, nickel fiber, and aluminum fiber. A composite resin composition characterized in that the powdered metal (D) is one or more of brass powder, nickel powder, zinc powder, and iron powder.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24101883A JPS60133057A (en) | 1983-12-22 | 1983-12-22 | Composite resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24101883A JPS60133057A (en) | 1983-12-22 | 1983-12-22 | Composite resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60133057A JPS60133057A (en) | 1985-07-16 |
JPH0349937B2 true JPH0349937B2 (en) | 1991-07-31 |
Family
ID=17068105
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24101883A Granted JPS60133057A (en) | 1983-12-22 | 1983-12-22 | Composite resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60133057A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63238163A (en) * | 1987-03-27 | 1988-10-04 | Toshiba Chem Corp | Electrically conductive resin composition |
JPS63235368A (en) * | 1987-03-25 | 1988-09-30 | Toshiba Chem Corp | Electrically conductive resin composition and molded product thereof |
US5232962A (en) * | 1991-10-09 | 1993-08-03 | Quantum Materials, Inc. | Adhesive bonding composition with bond line limiting spacer system |
GB2315698A (en) * | 1996-07-26 | 1998-02-11 | Harold Moore | A moulded tool |
-
1983
- 1983-12-22 JP JP24101883A patent/JPS60133057A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS60133057A (en) | 1985-07-16 |
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