JPH0349510U - - Google Patents
Info
- Publication number
- JPH0349510U JPH0349510U JP9296690U JP9296690U JPH0349510U JP H0349510 U JPH0349510 U JP H0349510U JP 9296690 U JP9296690 U JP 9296690U JP 9296690 U JP9296690 U JP 9296690U JP H0349510 U JPH0349510 U JP H0349510U
- Authority
- JP
- Japan
- Prior art keywords
- optical
- molded
- converts
- fiber cable
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims description 7
- 239000013307 optical fiber Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第１図は本考案の一実施例における光リンクの
斜視図、第２図はその光リンクにおけるインナー
およびアウターモールド部分の側断面図、第３図
はその光リンクにおけるインナーおよびアウター
モールド部分の正面図、第４図はその光リンクに
おけるインナーおよびアウターモールド部分の斜
視図である。
１……発光素子または受光素子、２……リード
端子、３……光フアイバケーブル、４……インナ
ーモールド部、５……アウターモールド部、６…
…ハウジング、７……リング。
Fig. 1 is a perspective view of an optical link according to an embodiment of the present invention, Fig. 2 is a side sectional view of the inner and outer mold parts of the optical link, and Fig. 3 is a front view of the inner and outer mold parts of the optical link. 4 are perspective views of the inner and outer mold portions of the optical link. DESCRIPTION OF SYMBOLS 1... Light emitting element or light receiving element, 2... Lead terminal, 3... Optical fiber cable, 4... Inner mold part, 5... Outer mold part, 6...
...Housing, 7...Ring.
Claims (1)
信号を電気信号に変換する受光素子と光フアイバ
ケーブルの端面とを、光信号の授受を行なわせる
ことができるように対向させて位置決めする樹脂
によるモールド部と、そのモールド部および光フ
アイバケーブルの前記モールド部からの引出し部
分をおおう樹脂によつてモールド成形されたハウ
ジング部とによつて構成された光リンク。 A resin mold that positions a light emitting element that converts an electrical signal into an optical signal or a light receiving element that converts an optical signal into an electrical signal and the end face of an optical fiber cable so that they face each other so that optical signals can be sent and received. and a housing portion molded with resin to cover the molded portion and a portion of the optical fiber cable pulled out from the molded portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9296690U JPH0349510U (en) | 1990-09-04 | 1990-09-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9296690U JPH0349510U (en) | 1990-09-04 | 1990-09-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0349510U true JPH0349510U (en) | 1991-05-15 |
Family
ID=31642372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9296690U Pending JPH0349510U (en) | 1990-09-04 | 1990-09-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0349510U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5478147A (en) * | 1977-12-05 | 1979-06-22 | Hitachi Ltd | Light guide |
| JPS6180207A (en) * | 1984-09-28 | 1986-04-23 | Hitachi Ltd | Substrate for electrical and optical circuit element |
-
1990
- 1990-09-04 JP JP9296690U patent/JPH0349510U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5478147A (en) * | 1977-12-05 | 1979-06-22 | Hitachi Ltd | Light guide |
| JPS6180207A (en) * | 1984-09-28 | 1986-04-23 | Hitachi Ltd | Substrate for electrical and optical circuit element |