JPH0348227U - - Google Patents
Info
- Publication number
- JPH0348227U JPH0348227U JP1989109552U JP10955289U JPH0348227U JP H0348227 U JPH0348227 U JP H0348227U JP 1989109552 U JP1989109552 U JP 1989109552U JP 10955289 U JP10955289 U JP 10955289U JP H0348227 U JPH0348227 U JP H0348227U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- die bonding
- circuit board
- infrared
- infrared source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/0711—
-
- H10W90/724—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989109552U JPH0348227U (enExample) | 1989-09-19 | 1989-09-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989109552U JPH0348227U (enExample) | 1989-09-19 | 1989-09-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0348227U true JPH0348227U (enExample) | 1991-05-08 |
Family
ID=31658139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989109552U Pending JPH0348227U (enExample) | 1989-09-19 | 1989-09-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0348227U (enExample) |
-
1989
- 1989-09-19 JP JP1989109552U patent/JPH0348227U/ja active Pending
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