JPH0348194Y2 - - Google Patents
Info
- Publication number
- JPH0348194Y2 JPH0348194Y2 JP1985065651U JP6565185U JPH0348194Y2 JP H0348194 Y2 JPH0348194 Y2 JP H0348194Y2 JP 1985065651 U JP1985065651 U JP 1985065651U JP 6565185 U JP6565185 U JP 6565185U JP H0348194 Y2 JPH0348194 Y2 JP H0348194Y2
- Authority
- JP
- Japan
- Prior art keywords
- wall
- plasma
- cylindrical
- opening
- processing chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Physical Or Chemical Processes And Apparatus (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985065651U JPH0348194Y2 (cs) | 1985-04-30 | 1985-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985065651U JPH0348194Y2 (cs) | 1985-04-30 | 1985-04-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61180140U JPS61180140U (cs) | 1986-11-10 |
| JPH0348194Y2 true JPH0348194Y2 (cs) | 1991-10-15 |
Family
ID=30597834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985065651U Expired JPH0348194Y2 (cs) | 1985-04-30 | 1985-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0348194Y2 (cs) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5928535U (ja) * | 1982-08-12 | 1984-02-22 | トヨタ自動車株式会社 | プラズマ処理装置 |
-
1985
- 1985-04-30 JP JP1985065651U patent/JPH0348194Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61180140U (cs) | 1986-11-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5611863A (en) | Semiconductor processing apparatus and cleaning method thereof | |
| US8684015B2 (en) | Tools and methods for processing microelectronic workpieces using process chamber designs that easily transition between open and closed modes of operation | |
| CN1200773A (zh) | 用于半导体处理的气体注射系统 | |
| WO2020056237A1 (en) | Apparatus for multi-flow precursor dosage | |
| US4678644A (en) | Apparatus and method for plasma treatment of resin material | |
| TW202346634A (zh) | 混氣裝置及半導體製程設備 | |
| KR20030028986A (ko) | 원자층 증착 장치 및 그 구동 방법 | |
| US6227236B1 (en) | Widely variable conductance valve | |
| KR20010021330A (ko) | 진공 처리 장치 | |
| JPH0348194Y2 (cs) | ||
| TW201625811A (zh) | 反應氣體輸送裝置及化學氣相沉積或磊晶層成長反應器 | |
| US20210388582A1 (en) | Manifold with insert for waterway assembly | |
| US4874453A (en) | Apparatus and method for plasma treatment of resin material | |
| EP0152511B1 (en) | Apparatus and method for plasma treatment of resin material | |
| US20230098293A1 (en) | Limited volume coaxial valve block | |
| CN114107953A (zh) | 原子层沉积装置及其喷淋板 | |
| CN222838787U (zh) | 一种可调工艺参数的布气结构及离子刻蚀装置 | |
| CN220550223U (zh) | 炉管结构及热炉 | |
| CN219696391U (zh) | 一种等离子刻蚀设备 | |
| JPH0545382Y2 (cs) | ||
| CN116576452B (zh) | 一种饱和蒸汽型减温减压系统 | |
| JPH0453126A (ja) | 表面処理装置 | |
| JPH04151079A (ja) | バルブ | |
| JPH046214B2 (cs) | ||
| JPH0417552Y2 (cs) |