JPH0348193Y2 - - Google Patents

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a processing device using an activated gas for modifying the surface of a molded product made of synthetic resin such as polypropylene or polyethylene.

(Prior art) In general, synthetic resin materials such as polypropylene and polyethylene have high rigidity and sufficient mechanical strength, so these synthetic resin materials have recently been used as structural materials such as the outer panels of automobile bodies. things are being done.

However, due to the characteristics of the material itself, such synthetic resin materials have poor adhesion and adhesion between the surface of the synthetic resin material and the paint film during painting, resulting in the problem of peeling of the paint film.

Therefore, conventionally, when applying the above coating, oxygen gas is activated by, for example, plasma discharge, and a synthetic resin material (molded product) as the object to be treated is placed in the activated oxygen gas, and its surface is oxidized (polar group introduction) or etching (improving anchor effect)
By doing so, modification processing is carried out to increase the adhesion and adhesion with the paint film. For example, Japanese Patent Laid-Open No. 12032/1983 discloses a modification processing device using activated gas. There is a known prior art technique.

In this known technology, an injection part for emitting oxygen gas activated by, for example, plasma discharge is provided at the upper end of a drum-shaped reaction chamber, and a plurality of works carried into the reaction chamber are sequentially rotated to spray the front surface of the injection part. By passing the activated gas ejected from the ejecting section, each workpiece is uniformly irradiated (sprayed) with the activated gas.

Therefore, in this conventional technique, a rotatable workpiece holding mechanism and its drive mechanism are required in order to sequentially move a plurality of workpieces in the reaction chamber, which increases the size of the apparatus itself and increases costs. It was hot. Furthermore, since an extra mechanism is installed in the reaction chamber in addition to the workpieces, the number of workpieces that can be processed in the process is limited, and the time required for one cycle of rotation is long, resulting in a considerably low processing capacity. There were some flaws as well.

(Purpose of the invention) The present invention has been made in order to improve the above-mentioned problems, and is to locate the activated gas jetting part in the center of a plurality of workpieces, and to place the activated gas jetting part behind each workpiece. The object of the present invention is to provide a processing device using activated gas that eliminates the need for the conventional work rotation and drive mechanism and improves processing capacity by locating the activated gas discharge port. .

(Means for Achieving the Object) In order to achieve the above object, the present invention provides an activated gas jetting section in the approximate center of the reaction chamber, and a plurality of activated gas jetting sections at equal distances around the activated gas jetting section. A workpiece holding jig having a workpiece setting part is arranged, and a workpiece is placed in the workpiece setting part of the workpiece holding jig with the surface side facing the activated gas ejection part, and each of the workpieces is further set. The device is characterized in that an activated gas discharge port is provided at the rear of the gas ejection direction.

(Function) According to the above means, each of the plurality of workpiece installation parts corresponding to each jetting port of the activated gas jetting part are all placed opposite each other at equal distances in the radial direction.
The exposure state of the activated gas to each workpiece becomes uniform.

Moreover, the workpieces installed in the workpiece installation section are all held in accurate positions with their front surfaces facing the activated gas jetting section, so that the surface side of each workpiece to be processed is It will now be possible to finish with high precision and with exactly the same quality.

Furthermore, since an activated gas discharge port is provided behind each of the workpiece installation sections, the activated gas ejected from the jetting port of the above-mentioned jetting section will flow straight through each workpiece. Since a plurality of radial flows are formed that converge in one direction, there is no wasteful dispersion (diffusion) of the flows, and they act on the surface of each workpiece in a high density state, resulting in high processing efficiency.

Moreover, since there is no need to rotate the workpiece at all, the time required for processing can be increased to the same level as conventional processing of a single workpiece by increasing the amount of activated gas ejected per unit time. becomes.

(Example) FIGS. 1 to 3 show the configuration of a processing apparatus using activated gas according to an example of the present invention.

First, FIG. 1 is a partially cutaway side view showing the structure of the entire system of the above-mentioned apparatus, and reference numeral 1 is a drum-shaped reaction chamber main body as shown in detail in FIG. A reaction chamber 2 consisting of a circular space extending in the longitudinal direction is formed within the main body 1.
In the center of the reaction chamber 2 (for example, the central axis of the reaction chamber main body 1), a plurality of (three in the drawings of this embodiment) activated gas introduction pipes 4, which will be described later, are connected at predetermined intervals. Connected cylindrical activated gas ejection part 3
is provided extending in the longitudinal direction of the reaction chamber 2, and this activated gas jetting section 3 is connected to a plurality of activated gas introduction tubes 4 made of, for example, quartz tubes as described above.
It is connected to each connection part 5 outside the reaction chamber 2 via. Each connecting portion 5 is further connected to a quartz tube 6, and the quartz tube 6 is connected to a plasma generating tube 7.

The plasma generation tube 7 is further connected via a gas supply tube 8 to a gas cylinder 9 containing, for example, oxygen gas. Note that the reference numeral 10 is a flow meter provided in a part of the gas supply pipe 8. On the other hand, a plasma generation furnace 11 is provided near the plasma generation tube 7 of the gas supply pipe 8, and this plasma generation furnace 11 is connected to a three-stub tuner 13 and a power monitor 1 through a microwave waveguide 12.
4. Microwave oscillator 1 via isolator 15
6.

Therefore, first, the flow meter 10 is connected to the gas cylinder 9.
The oxygen gas supplied to the plasma generation furnace 11 through the steps is irradiated with microwaves of a predetermined power and a predetermined frequency supplied from the microwave oscillator 16 in the plasma generation furnace 11 to become a high-temperature gas, and then The activated gas is supplied to the plasma generation tube 7 and becomes an activated gas in a plasma state.

Then, this activated oxygen gas is supplied to the activated gas spouting part 3 at a predetermined pressure via the quartz tube 6, the connecting part 5, and the gas introduction pipe 4, and is directed in the radial direction of the spouting part 3. The liquid is ejected radially into the reaction chamber 2 from a plurality of opened ejection ports.

On the other hand, the reference numeral 20 indicates a vehicle body, for example, an automobile body, which is installed in the reaction chamber 2 at a constant circumferential interval at positions equidistant from each activated gas jetting port in the radial direction with the activated gas jetting portion 3 as the center. The workpieces 20 are a plurality of workpieces such as outer panels, and each workpiece 20 is delivered into the reaction chamber 2 as described above using a jig 21 as shown in FIG. 3, for example.

That is, the jig 21 includes a pair of substantially octagonal side plates 23 having a plurality of notches 22 formed in the radial direction;
23 and a plurality of connecting members 24 that connect the pair of side plates 23, 23 to each other at their respective corner portions. And the pair of side plates 2
A pair of notches 22 and 22 located at opposite positions of the notches 22 of 3 and 23 serve as fitting and locking parts for each of the works 20, and one of them (the one at the upper end position) ) is cut out larger than the others to form a slit 26 that is continuous with the circular hole 25 in the center of the side plate 23. The cylindrical activated gas ejection part 3 extending in the longitudinal direction is fitted and fixed between the slits 26, 26.

On the other hand, behind each workpiece 20 installed in the reaction chamber 2 as described above, an activated gas outlet 27 for depressurization, which penetrates the reaction chamber body 1 and is open to the outside, is provided. ing.

Therefore, the activated gas ejected in the radial direction from the activated gas ejecting section 3 first uniformly strokes the surface of each workpiece 20 and flows, and is finally discharged from the activated gas outlet 27. Become. Therefore, the overall flow of activated gas in the reaction chamber 2 forms a plurality of flows that oppose each work 20 and converge in the direction of the discharge port 27, as shown in FIG. The oxidizing gas acts effectively on each workpiece 20 with high density and no waste, and the processing speed is also increased. Since each of the works 20 is located at the same distance from the ejection section 3, the processing effect of the activated gas is also uniform.

(Effects of the invention) As explained above, the present invention has an activated gas jetting part provided in the approximate center of the reaction chamber, and a plurality of workpiece installation parts provided at equidistant positions around the activated gas jetting part. A workpiece holding jig is arranged, and a workpiece is placed in the workpiece installation part of the workpiece holding jig with the front side facing the activated gas spouting part, and the workpiece is placed behind each of the workpiece installation parts in the gas spouting direction. The device is characterized by having an activated gas outlet.

Therefore, according to the present invention, each of the plurality of workpiece installation parts corresponding to each jetting port of the activated gas jetting part are all arranged at equal distances in the radial direction, so that the activation gas to each workpiece is All exposure conditions will be uniform.

Moreover, the workpieces installed in the workpiece installation section are all held in accurate positions with their front surfaces facing the activated gas jetting section, so that the surface side of each workpiece to be processed is It will now be possible to finish with high precision and with exactly the same quality.

Furthermore, since an activated gas discharge port is provided behind each of the workpiece installation sections, the activated gas ejected from the jetting port of the above-mentioned jetting section will flow straight through each workpiece. Since a plurality of radial flows are formed that converge in one direction, there is no wasteful dispersion (diffusion) of the flows, and they act on the surface of each workpiece in a high density state, resulting in high processing efficiency.

Moreover, since there is no need to rotate the workpiece at all, the time required for processing can be increased to the same level as conventional processing of a single workpiece by increasing the injection amount of activated gas per unit time. becomes.

[Brief explanation of drawings]

FIG. 1 is a partially cutaway side view showing the structure of the entire system of a processing device using activated gas according to an embodiment of the present invention, and FIG. 2 is a front view showing the structure of the reaction chamber main body of the device. FIG. 3 is a perspective view of a jig for fixing a workpiece, etc. in the same apparatus. 2... Reaction chamber, 3... Activated gas ejection part, 20
...Work, 27...Activated gas discharge port.

Claims (1)

[Scope of utility model registration request] An activated gas jetting section is provided approximately in the center of the reaction chamber,
A workpiece holding jig having a plurality of workpiece installation parts is arranged equidistantly around the activated gas spouting part, and a surface side of the workpiece installation part of the workpiece holding jig faces the activated gas spouting part. 1. A processing apparatus using an activated gas, characterized in that a workpiece is installed in a state where the workpiece is placed in the same position as the workpiece, and an activated gas discharge port is provided behind each of the workpiece installation parts in the direction of gas ejection.