JPH0346996B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a component positioning method for mounting ICs for surface mounting called FPP, PLCC, and LCC.

(Conventional technology and problems) Conventionally, the positioning method for surface-mounted ICs is as follows:
The methods shown in FIGS. 4 to 7 have been proposed.

In the method shown in FIG. 4, the package 4 of the surface-mounted IC 3 is held and positioned from four directions by claws 2 provided coaxially with the suction pin 1, and mounted onto the printed circuit board 6. in this case,
The dimensions of the surface-mounted IC 3 are precisely defined at the tips of the leads 5, and if the package 4 is positioned, the positioning accuracy of the tips of the leads will deteriorate.
Another drawback is that the mechanism on the suction pin side is complicated and heavy.

In the method shown in FIG. 5, the leads 5 of the surface-mounted IC 3 are held and positioned from four directions by claws 2A provided coaxially with the suction pins 1, and mounted onto the printed circuit board 6. In this case, force is applied to the lead 5, which tends to bend the lead 5, making positioning difficult. Moreover, the mechanism on the suction pin side becomes complicated and heavy.

The method shown in Fig. 6 involves preparing a jig 8 with a concave recess 7 that matches the shape of the surface-mounting IC, and positioning the surface-mounting IC by inserting it into this jig 8. be. This method uses surface-mounted
A number of jigs are required depending on the type of IC, and they must be replaced each time the type of surface-mounted IC changes. Furthermore, a gap is required between the surface-mounted IC and the jig in order to take the surface-mounted IC in and out, which impairs positioning accuracy.

In the method shown in FIG. 7, the package or lead portion of a surface-mounted IC is held from four directions by claws 10 provided around a component support pin 9 coaxially opposed to the suction pin, as in the case shown in FIG. It is used for positioning. In this case as well, the dimensions of the surface-mount IC are precisely specified at the tip of the lead, and positioning the package with the package will degrade the positioning accuracy of the tip, and holding the tip of the lead will cause the lead to bend. It is easy to hold, and the clamping tends to become unstable.

(Means and effects for solving the problems) In view of the above points, the present invention enables accurate positioning of surface-mounted ICs, etc. whose leads protrude outside the package cage without bending the leads. The aim is to provide a method for positioning parts.

The present invention provides a positioning member that has at least two orthogonal vertical reference planes and is supported horizontally, and a component mounting table on which a component is placed is provided in close contact with the lower surface of the positioning member so as to be movable within a horizontal plane. When the component mounting table is moving in a direction that includes both a velocity component toward one of the two vertical reference planes and a velocity component toward the other surface, the component is placed on the component mounting table. The above conventional problems are solved by taking out the component in the vertical direction with a suction means when the component is placed in a positioning state by contacting the two vertical reference surfaces due to the movement of the component mounting table. are doing.

(Example) Hereinafter, an example of the component positioning method according to the present invention will be described with reference to the drawings.

In FIGS. 1 to 3, reference numeral 11 denotes a positioning member, which is supported and fixed horizontally by a support block 12. As shown in FIGS. The positioning member 11 has two vertical reference planes 13A, 13B.
B are mutually orthogonal.

On the other hand, a component mounting table 15 is mounted on a slider 16 in close contact with the lower surface of the positioning member 11 and movable within a horizontal plane.
The slider 16 is reciprocated by means of an air cylinder 18, which is fixed to the support block 17, for example. The direction of the reciprocating motion is the diagonal direction (arrow P in FIG. 1) when considering a rectangle having two sides on the perpendicular reference plane.

Such a positioning structure is disposed, for example, as a positioning station between an electronic component supply section and a transfer section that supports a printed circuit board in an electronic component mounting machine.

Now, positioning of the components is performed in the direction in which the component mounting table 15 approaches the vertical reference planes 13A, 13B (the reference plane 13
This is performed during a period when the vehicle is moving in a direction including both a velocity component toward A and a velocity component toward the reference surface 13B. First, the component mounting table 15 moving in the P1 direction
IC for surface mounting with suction pins etc. as suction means on top
3 is placed as shown in Figure 2. Then, due to the movement of the component mounting table 15, the surface-mounted IC 3 enters the state shown in FIG. 3 in which the tips of the leads 5 are in contact with the reference surfaces 13A and 13B of the positioning member 11, that is, the positioning state. At this time, P1 of the component mounting table 15
Since the movement in the direction continues, the positioning state between the surface mounting IC 3 and the reference surfaces 13A and 13B is maintained due to the friction between the component mounting table 15 and the surface mounting IC 3, and at this time, the suction Hold the center position of the surface-mounted IC3 with a pin, etc., and take it out in the vertical direction. In other words, since the external dimensions (dimensions up to the outer circumference of the leads) of the surface-mount IC 3 are known, for example, the center point of the surface-mount IC from the reference surfaces 13A and 13B is calculated by a program, and the suction pin etc.
Just hold it at the center of the IC.

Note that the component mounting table 15 is moved in a direction in which a velocity component toward one of the vertical reference planes 13A, 13B is equal to a velocity component toward the other surface.
In general, it is considered most efficient to allow the robot to move.

Further, the component mounting table 15 may be driven by a combination of a pulse motor and a cam mechanism instead of an air cylinder.

Further, the positioning member may have a square hole, and two orthogonal faces of the square hole may be set as reference planes.

(Effects of the Invention) As explained above, according to the component positioning method of the present invention, the following effects can be obtained.

(1) Square electronic components, especially FPP, PLCC, LCC
It is suitable for positioning when mounting a surface-mounted IC called ``FPP'', and is highly effective for FPPs where the leads protrude from the package.

(2) In surface-mount ICs, the dimensional accuracy of the outer circumference of the lead is controlled, and the tip of this lead is positioned, so in principle highly accurate positioning is possible.

(3) Since the components on the component mounting table are moved by frictional force, they can be positioned without applying excessive force to the leads. Therefore, the leads will not be bent due to positioning.

(4) Components can be easily applied to the two reference surfaces of the positioning member, and positioning accuracy can be improved.

(5) It is possible to easily and smoothly set parts on the positioning member and take out the positioned parts again.

(6) Even if the external dimensions of the parts differ, it can be accommodated without replacing the positioning member. That is, since the external dimensions of the component are known, a suction pin or the like can be brought to the center of the component using a program, for example.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing an embodiment of the component positioning method according to the present invention, FIGS. 2 and 3 are plan views showing the operation of the embodiment, and FIGS. 4 and 5 are respectively conventional methods for positioning parts. A front cross-sectional view showing the method;
6 and 7 are perspective views showing other conventional examples, respectively. 3... IC for surface mounting, 5... Lead, 11...
Positioning member, 13A, 13B... vertical reference plane,
15... Parts mounting table.

Claims (1)

[Claims] 1. With respect to a horizontally supported positioning member having at least two orthogonal vertical reference planes, a component mounting table on which a component is placed is movable in a horizontal plane in close contact with the lower surface of the positioning member. when the component mounting table is moving in a direction including both a velocity component toward one of the two vertical reference planes and a velocity component toward the other surface. A method for positioning a component, comprising placing a component on the table, and taking out the component in the vertical direction with a suction means when the component is in a positioning state by contacting the two vertical reference surfaces due to the movement of the component mounting table. 2. The component positioning method according to claim 1, wherein the component mounting table moves in a direction in which a velocity component toward one of the two vertical reference planes and a velocity component toward the other surface are equal. .