JPH0345915B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to an automatic mounting device for electronic components that automatically mounts chip-shaped electronic components to predetermined locations on a substrate such as a printed circuit board, and particularly to Regarding an adsorption device.

(B) Prior art In general, chip-shaped electronic components without lead wires are pasted or stored in a strip or inserted into a magazine, and after the chip-shaped electronic components are sucked by a vacuum suction nozzle, they are positioned. Therefore, a method is adopted in which the device is attached to a predetermined position on a printed circuit board.

An example is Japanese Patent Application Laid-open No. 57-62590, in which the vertical force of a suction nozzle is used to open and close a positioning pawl, and a cylinder is used for the vertical drive.

(c) Problems to be Solved by the Invention According to the above-mentioned conventional example, since the speed of the vertical movement of the suction nozzle cannot be precisely controlled by using a cylinder for the vertical movement, when positioning the chip-shaped electronic component, the electronic There is a possibility that the parts may break, so it would be better to slow down the closing speed of the claws, but the disadvantage is that the cycle of one process becomes longer and the working process time becomes longer. In addition, if the upper and lower limit positions of the suction nozzle are constant and the chip-shaped electronic component is large in thickness, the chip-shaped electronic component may break due to the impact of the suction nozzle during suction and mounting. Ta.

SUMMARY OF THE INVENTION An object of the present invention is to provide a new suction device for chip-shaped electronic components that eliminates the above-mentioned drawbacks, reduces cracking of the chip-shaped electronic components, and shortens the working process time.

(d) Means for Solving the Problems Therefore, the present invention provides an automatic mounting device for electronic components that mounts chip-shaped electronic components at predetermined locations on a circuit board, in which the chip-shaped electronic components are moved up and down by a driving means in the vertical direction. a suction nozzle that suctions a component; a positioning pawl that positions the component by opening and closing in conjunction with the vertical movement of the suction nozzle; and a positioning pawl that moves up and down after the suction nozzle moves up after the component is suctioned. and a control section for controlling the drive means so as to slow down the upward movement speed of the suction nozzle at least immediately before positioning the component, thereby slowing down the closing operation of the positioning pawl.

(E) Effect With the above configuration, the suction nozzle is moved downward by the driving means to pick up a component, and then is moved upward and the positioning claw positions the component. At this time, just before that, the control unit controls the driving means to reduce the upward movement speed of the suction nozzle, so that the positioning claw, which closes in conjunction with the upward movement of the suction nozzle, slowly closes. It will be done.

(F) Embodiments The present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view of a main part of a suction device for chip-shaped electronic components of the present invention, and FIG. 2 is a perspective view showing an automatic mounting device for chip-shaped electronic components. Figures 3 and 3 are sectional views of essential parts showing suction mounting of a chip-shaped electronic component according to the present invention, and Figure 4 is an explanatory characteristic diagram of the same device.

In the drawing, 2 is a chip-shaped electronic component, 3 is a positioning block to which positioning claws 4 and 5 are attached by pins 6 and 7 so that they can be opened and closed, 8 is a block for opening and closing the claws, and 9 is for stopping the positioning block from descending. stoppers, 10 and 11 are levers for opening and closing the claws, 1
2 is a roller, 13 is a lever for vertical movement, 14 is an engagement plate for vertical movement, 15 is a first spring that biases the positioning pawl in the direction of closing, 16 is a base plate, 17 is a nozzle mounting shaft, 18 1 is a pipe serving as an air flow path for sucking chip-shaped electronic components by vacuum at the tip of the suction nozzle 34;
9 is a ball screw for vertically moving the lever for vertical movement; 20 is a servo motor as a driving means for applying rotational force to the ball screw; 21 is a control section for controlling the motor; a second spring that presses the suction nozzle downward; 23 is a housing; 24 is a printed circuit board;
25 and 26 are conveyors for moving the printed circuit board, 27 is a head portion in which the suction nozzle 34 and the like are housed, and 28, 29, and 30 are reels of a component cartridge in which chip-shaped electronic components are housed, and a component magazine. and a parts tray, and 31 represents a head moving section for moving the head section.

Next, the suction device for chip-shaped electronic components of the present invention will be explained with reference to the drawings. First, the head portion 27 is moved to, for example, directly above the chip-shaped electronic component 2 on the component tray 30, and then the suction nozzle 34 is moved. descend,
As shown in FIG. 1, it comes into contact with a chip-shaped electronic component 2. At this time, the ball screw 19 is rotated by the driving force of the motor 20, and the vertical movement lever 1 is rotated accordingly.
The vertically moving lever 13 is moved downward by being screwed into a threaded groove provided inside the base 32 of the vertically moving lever 13. The engagement piece 14 for vertical movement placed above the pressing piece 33 provided on the lever 13 for vertical movement is connected to the pressing piece 3.
3 moves downward as the suction nozzle 34
The electronic component 2 is attracted by suction. In the above state,
A downward pressing force is applied by the second spring 22, and the right end of the positioning block 3 comes into contact with the stopper 9, and a downward pressing force is applied by the second spring 22, causing the positioning block 3 to be pinned. 6,
The positioning claws 4 and 5 rotatably attached at 7 are
The roller 12 provided at the tip of the positioning pawl 4 contacts the stopper 8 and rotates in the direction in which the positioning pawl 4 opens, and as the opening/closing lever 10 rotates downward, the positioning pawl 11 is pressed downward and the positioning pawl 5 also opens. The state will be as follows. The positioning block 3 is a stopper 9
When the positioning block 3 comes into contact with the positioning block 3, the downward movement of the positioning block 3 is stopped, and at the same time the positioning claws 4 and 5 stop opening.

On the other hand, the suction nozzle 34 continues to descend,
As shown in FIG. 1, the tip of the suction nozzle 34 comes into contact with the upper surface of the chip-shaped electronic component 2 on the component tray 30, and the suction nozzle 34 stops.

Next, suction is applied by a vacuum suction source, such as a vacuum pump (not shown) connected to the pipe 18, and the chip-shaped electronic component 2 is sucked by the suction nozzle 34.
The suction nozzle 34 rotates the motor 20 based on a signal from the control unit 21, the ball screw 19 rotates accordingly, and the vertical movement lever 13 screwed into the ball screw 19 rotates. moves upward, and the vertically moving engagement plate 14 is accordingly pushed upward. When the vertically moving engagement plate 14 moves upward, the nozzle mounting shaft 17 and suction nozzle 34, which are integrated together, move upward at the same time. The stepped portion 35 of the nozzle mounting shaft comes into contact with the lower surface 36 of the positioning block 3, and the positioning block 3 also moves upward against the elastic force of the second spring 22. Since the roller 12 does not rise, the pin 6 , 7, the positioning claws 4, 5 are closed while being rotated by the pressing force of the first spring.

Next, the head section 27 is moved by the head moving section 31 shown in FIG. The chip-shaped electronic component 2 is mounted on the printed circuit board 24 by switching from suction by a vacuum pump provided at the tip of the chip 18 to jetting air.

A predetermined portion of the printed circuit board 24 is coated with an adhesive having adhesive properties such as bond in advance,
After temporarily fixing the chip-shaped electronic component 2 in the mounting process of the chip-shaped electronic component and mounting the chip-shaped electronic component 2, the bond is cured in a curing device, and then the printed circuit board 2 is
The chip-shaped electronic component 2
By soldering the terminals, the chip-shaped electronic component 2
Attachment to the printed circuit board 24 is completed.

Therefore, the characteristics of each operation in the above process are shown in FIG. First, when the suction nozzle 34 starts to descend (in the range indicated by
T _A ), and when the positioning claws 4 and 5 have finished opening, they are lowered at high speed (period T _B ), and the suction nozzle 3
Immediately before the suction nozzle 4 contacts the chip-shaped electronic component 2, the speed is reduced again and the suction nozzle 34 is lowered at a low speed (during the period T _C ), and the suction nozzle 3
4 comes into contact with the chip-shaped electronic component 2, the suction nozzle 34 stops, and the suction nozzle 34 suctions the chip-shaped electronic component 2. (In the part, period T _D ) After suctioning the chip-shaped electronic component 2, the suction nozzle 34 rises at high speed (in the part, period T _E ),
Immediately before the chip-shaped electronic component 2 is positioned by the positioning claws 4, 5, the suction nozzle 34 is raised again at low speed (for a period T _F ), and the positioning claws 4, 5 are gently closed. The control of each high speed or low speed and the stop position is performed by changing the rotation speed of the servo motor 20 by the control section 21.

As is clear from the above configuration, the device of the present invention changes the vertical movement speed of the suction nozzle 34, and is slow when opening/closing the positioning pawl and when picking up and mounting the chip-shaped electronic component 2, while being fast at other times. The structure is such that the suction nozzle is moved up and down.

Note that the positioning claws are not limited to the above-mentioned embodiments, but may include four claws, with opposing claws provided at positions 90 degrees apart from each other.
The chip-shaped electronic component may be positioned from four directions.

Further, by adding a rotational direction to the suction nozzle and the positioning claw, it becomes possible to mount the chip-shaped electronic component in any direction.

Furthermore, although a ball screw and a lever for vertical movement are screwed together to convert the drive to vertical movement of the suction nozzle by the servo motor, other methods such as vertical movement using a wire may be used.

(G) Effects of the Invention According to the chip-shaped electronic component suction device of the present invention, when positioning a chip-shaped electronic component, the upward movement speed of the suction nozzle is reduced just before positioning, and the closing operation of the positioning pawl is made gentle. , the working process time does not become so long, and it becomes possible to position the chip-shaped electronic component without damaging it.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view of a main part of a suction device for chip-shaped electronic components of the present invention, FIG. 2 is a perspective view showing an automatic mounting device for chip-shaped electronic components, and FIG. 3 is a suction device for chip-shaped electronic components of the present invention. FIG. 4 is a cross-sectional view of a main part of the device, and FIG. 4 is an explanatory characteristic diagram of the device. Explanation of main drawing numbers, 2...Chip-shaped electronic components, 3
...Positioning block, 4,5...Positioning claw,
8, 9... Stopper, 12... Roller, 13
... Lever for vertical movement, 14 ... Engagement plate for vertical movement, 19 ... Ball screw, 20 ... Servo motor, 21 ... Control unit, 24 ... Printed circuit board, 2
7...Head part, 34...Suction nozzle.

Claims (1)

[Claims] 1. In an automatic electronic component mounting device that mounts a chip-shaped electronic component to a predetermined location on a board, a suction nozzle that moves up and down by a driving means in a vertical direction to suction the component, and a vertical movement of the suction nozzle. a positioning pawl that positions the component by opening and closing in conjunction with the movement of the suction nozzle; 1. A suction device for chip-shaped electronic components, comprising: a control section that controls the drive means so as to slow down the upward movement speed to slow down the closing operation of the positioning pawl.