JPH0345745B2 - - Google Patents
Info
- Publication number
- JPH0345745B2 JPH0345745B2 JP58215851A JP21585183A JPH0345745B2 JP H0345745 B2 JPH0345745 B2 JP H0345745B2 JP 58215851 A JP58215851 A JP 58215851A JP 21585183 A JP21585183 A JP 21585183A JP H0345745 B2 JPH0345745 B2 JP H0345745B2
- Authority
- JP
- Japan
- Prior art keywords
- acid
- weight
- parts
- vinyl chloride
- phosphite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 claims description 21
- 229920002857 polybutadiene Polymers 0.000 claims description 17
- 239000005062 Polybutadiene Substances 0.000 claims description 16
- 239000003822 epoxy resin Substances 0.000 claims description 14
- 229920000647 polyepoxide Polymers 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- 150000007524 organic acids Chemical class 0.000 claims description 12
- 239000004014 plasticizer Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 8
- 239000011342 resin composition Substances 0.000 claims description 8
- 150000003839 salts Chemical class 0.000 claims description 6
- 150000003751 zinc Chemical class 0.000 claims description 5
- 229920001577 copolymer Polymers 0.000 description 20
- -1 t-dodecylphenol Chemical compound 0.000 description 18
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical class OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 13
- 239000002253 acid Substances 0.000 description 12
- 239000000203 mixture Substances 0.000 description 12
- 239000004593 Epoxy Chemical class 0.000 description 9
- 229910019142 PO4 Inorganic materials 0.000 description 6
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 235000021317 phosphate Nutrition 0.000 description 6
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 6
- 239000007983 Tris buffer Substances 0.000 description 5
- ZJIPHXXDPROMEF-UHFFFAOYSA-N dihydroxyphosphanyl dihydrogen phosphite Chemical compound OP(O)OP(O)O ZJIPHXXDPROMEF-UHFFFAOYSA-N 0.000 description 5
- 238000009472 formulation Methods 0.000 description 5
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 5
- 239000010452 phosphate Substances 0.000 description 5
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 4
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 235000014113 dietary fatty acids Nutrition 0.000 description 4
- 239000000194 fatty acid Substances 0.000 description 4
- 229930195729 fatty acid Natural products 0.000 description 4
- 150000004665 fatty acids Chemical class 0.000 description 4
- 239000003381 stabilizer Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000005711 Benzoic acid Substances 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 3
- 239000004803 Di-2ethylhexylphthalate Substances 0.000 description 3
- IYFATESGLOUGBX-YVNJGZBMSA-N Sorbitan monopalmitate Chemical compound CCCCCCCCCCCCCCCC(=O)OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O IYFATESGLOUGBX-YVNJGZBMSA-N 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 235000010233 benzoic acid Nutrition 0.000 description 3
- 229910052793 cadmium Inorganic materials 0.000 description 3
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- AXRSHKZFNKUGQB-UHFFFAOYSA-N octyl diphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OCCCCCCCC)OC1=CC=CC=C1 AXRSHKZFNKUGQB-UHFFFAOYSA-N 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- 235000011071 sorbitan monopalmitate Nutrition 0.000 description 3
- 239000001570 sorbitan monopalmitate Substances 0.000 description 3
- 229940031953 sorbitan monopalmitate Drugs 0.000 description 3
- 238000010186 staining Methods 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 2
- ULQISTXYYBZJSJ-UHFFFAOYSA-N 12-hydroxyoctadecanoic acid Chemical compound CCCCCCC(O)CCCCCCCCCCC(O)=O ULQISTXYYBZJSJ-UHFFFAOYSA-N 0.000 description 2
- XDOFQFKRPWOURC-UHFFFAOYSA-N 16-methylheptadecanoic acid Chemical compound CC(C)CCCCCCCCCCCCCCC(O)=O XDOFQFKRPWOURC-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
- XOUQAVYLRNOXDO-UHFFFAOYSA-N 2-tert-butyl-5-methylphenol Chemical compound CC1=CC=C(C(C)(C)C)C(O)=C1 XOUQAVYLRNOXDO-UHFFFAOYSA-N 0.000 description 2
- OAOABCKPVCUNKO-UHFFFAOYSA-N 8-methyl Nonanoic acid Chemical compound CC(C)CCCCCCC(O)=O OAOABCKPVCUNKO-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- 229920003319 Araldite® Polymers 0.000 description 2
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 2
- NIQCNGHVCWTJSM-UHFFFAOYSA-N Dimethyl phthalate Chemical compound COC(=O)C1=CC=CC=C1C(=O)OC NIQCNGHVCWTJSM-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 2
- 229910052788 barium Inorganic materials 0.000 description 2
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 125000006267 biphenyl group Chemical group 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- NZNMSOFKMUBTKW-UHFFFAOYSA-N cyclohexanecarboxylic acid Chemical compound OC(=O)C1CCCCC1 NZNMSOFKMUBTKW-UHFFFAOYSA-N 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- JQCXWCOOWVGKMT-UHFFFAOYSA-N diheptyl phthalate Chemical compound CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC JQCXWCOOWVGKMT-UHFFFAOYSA-N 0.000 description 2
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 2
- VKOBVWXKNCXXDE-UHFFFAOYSA-N icosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCC(O)=O VKOBVWXKNCXXDE-UHFFFAOYSA-N 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000479 mixture part Substances 0.000 description 2
- FBUKVWPVBMHYJY-UHFFFAOYSA-N nonanoic acid Chemical compound CCCCCCCCC(O)=O FBUKVWPVBMHYJY-UHFFFAOYSA-N 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 235000005985 organic acids Nutrition 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 2
- 229920002587 poly(1,3-butadiene) polymer Polymers 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 239000000344 soap Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 239000003549 soybean oil Substances 0.000 description 2
- 235000012424 soybean oil Nutrition 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- 229920001897 terpolymer Polymers 0.000 description 2
- YODZTKMDCQEPHD-UHFFFAOYSA-N thiodiglycol Chemical compound OCCSCCO YODZTKMDCQEPHD-UHFFFAOYSA-N 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 2
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 2
- IWXHSRGWGDFCKC-UHFFFAOYSA-N (2,4-ditert-butylphenyl) bis(8-methylnonyl) phosphite Chemical compound CC(C)CCCCCCCOP(OCCCCCCCC(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C IWXHSRGWGDFCKC-UHFFFAOYSA-N 0.000 description 1
- JNYAEWCLZODPBN-JGWLITMVSA-N (2r,3r,4s)-2-[(1r)-1,2-dihydroxyethyl]oxolane-3,4-diol Chemical compound OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O JNYAEWCLZODPBN-JGWLITMVSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- 229920003067 (meth)acrylic acid ester copolymer Polymers 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- QWUWMCYKGHVNAV-UHFFFAOYSA-N 1,2-dihydrostilbene Chemical group C=1C=CC=CC=1CCC1=CC=CC=C1 QWUWMCYKGHVNAV-UHFFFAOYSA-N 0.000 description 1
- BPXVHIRIPLPOPT-UHFFFAOYSA-N 1,3,5-tris(2-hydroxyethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound OCCN1C(=O)N(CCO)C(=O)N(CCO)C1=O BPXVHIRIPLPOPT-UHFFFAOYSA-N 0.000 description 1
- LRQGFQDEQPZDQC-UHFFFAOYSA-N 1-Phenyl-1,3-eicosanedione Chemical compound CCCCCCCCCCCCCCCCCC(=O)CC(=O)C1=CC=CC=C1 LRQGFQDEQPZDQC-UHFFFAOYSA-N 0.000 description 1
- RMSGQZDGSZOJMU-UHFFFAOYSA-N 1-butyl-2-phenylbenzene Chemical group CCCCC1=CC=CC=C1C1=CC=CC=C1 RMSGQZDGSZOJMU-UHFFFAOYSA-N 0.000 description 1
- LFYSWCFSJAZQJJ-UHFFFAOYSA-L 1-dodecylpyridin-1-ium;sulfate Chemical compound [O-]S([O-])(=O)=O.CCCCCCCCCCCC[N+]1=CC=CC=C1.CCCCCCCCCCCC[N+]1=CC=CC=C1 LFYSWCFSJAZQJJ-UHFFFAOYSA-L 0.000 description 1
- VBICKXHEKHSIBG-UHFFFAOYSA-N 1-monostearoylglycerol Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(O)CO VBICKXHEKHSIBG-UHFFFAOYSA-N 0.000 description 1
- RZRNAYUHWVFMIP-KTKRTIGZSA-N 1-oleoylglycerol Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCC(O)CO RZRNAYUHWVFMIP-KTKRTIGZSA-N 0.000 description 1
- WMQUXDYWSTWBNC-UHFFFAOYSA-N 1-phenylheptane-1,6-dione Chemical compound CC(=O)CCCCC(=O)C1=CC=CC=C1 WMQUXDYWSTWBNC-UHFFFAOYSA-N 0.000 description 1
- FRPZMMHWLSIFAZ-UHFFFAOYSA-N 10-undecenoic acid Chemical compound OC(=O)CCCCCCCCC=C FRPZMMHWLSIFAZ-UHFFFAOYSA-N 0.000 description 1
- 229940114072 12-hydroxystearic acid Drugs 0.000 description 1
- OFOWUDSDZLONKT-UHFFFAOYSA-N 12-oxo-octadecanoic acid Chemical compound CCCCCCC(=O)CCCCCCCCCCC(O)=O OFOWUDSDZLONKT-UHFFFAOYSA-N 0.000 description 1
- PXSSNPBEHHJLDH-UHFFFAOYSA-N 2,3,4,5-tetramethylphenol Chemical compound CC1=CC(O)=C(C)C(C)=C1C PXSSNPBEHHJLDH-UHFFFAOYSA-N 0.000 description 1
- STMRWVUTGPZZER-UHFFFAOYSA-N 2,3-bis(2-methylpropyl)phenol Chemical compound CC(C)CC1=CC=CC(O)=C1CC(C)C STMRWVUTGPZZER-UHFFFAOYSA-N 0.000 description 1
- JKTAIYGNOFSMCE-UHFFFAOYSA-N 2,3-di(nonyl)phenol Chemical compound CCCCCCCCCC1=CC=CC(O)=C1CCCCCCCCC JKTAIYGNOFSMCE-UHFFFAOYSA-N 0.000 description 1
- BXSHAIASGAPXAC-UHFFFAOYSA-N 2,3-ditert-butylbenzoic acid Chemical compound CC(C)(C)C1=CC=CC(C(O)=O)=C1C(C)(C)C BXSHAIASGAPXAC-UHFFFAOYSA-N 0.000 description 1
- NAOSNNNYJHAZGY-UHFFFAOYSA-N 2,4-diisopropyl-3-methylphenol Chemical compound CC(C)C1=CC=C(O)C(C(C)C)=C1C NAOSNNNYJHAZGY-UHFFFAOYSA-N 0.000 description 1
- MOBNLCPBAMKACS-UHFFFAOYSA-N 2-(1-chloroethyl)oxirane Chemical compound CC(Cl)C1CO1 MOBNLCPBAMKACS-UHFFFAOYSA-N 0.000 description 1
- XSXWOBXNYNULJG-UHFFFAOYSA-N 2-(2,4,4-trimethylpentan-2-yl)phenol Chemical compound CC(C)(C)CC(C)(C)C1=CC=CC=C1O XSXWOBXNYNULJG-UHFFFAOYSA-N 0.000 description 1
- RRKBRXPIJHVKIC-UHFFFAOYSA-N 2-(2-ethylhexyl)phenol Chemical compound CCCCC(CC)CC1=CC=CC=C1O RRKBRXPIJHVKIC-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- SZBYVOSSTHEBFR-UHFFFAOYSA-N 2-(2-methyloctan-2-yl)phenol Chemical compound CCCCCCC(C)(C)C1=CC=CC=C1O SZBYVOSSTHEBFR-UHFFFAOYSA-N 0.000 description 1
- QJQIVZBVEBCTKR-UHFFFAOYSA-N 2-(3-methylbutyl)phenol Chemical compound CC(C)CCC1=CC=CC=C1O QJQIVZBVEBCTKR-UHFFFAOYSA-N 0.000 description 1
- LLIGXYDULHXBDJ-UHFFFAOYSA-N 2-(4-methylpentyl)phenol Chemical compound CC(C)CCCC1=CC=CC=C1O LLIGXYDULHXBDJ-UHFFFAOYSA-N 0.000 description 1
- NFAOATPOYUWEHM-UHFFFAOYSA-N 2-(6-methylheptyl)phenol Chemical compound CC(C)CCCCCC1=CC=CC=C1O NFAOATPOYUWEHM-UHFFFAOYSA-N 0.000 description 1
- YEVQZPWSVWZAOB-UHFFFAOYSA-N 2-(bromomethyl)-1-iodo-4-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=CC=C(I)C(CBr)=C1 YEVQZPWSVWZAOB-UHFFFAOYSA-N 0.000 description 1
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- IZBZQUREHISXFJ-UHFFFAOYSA-N 2-[4-chloro-5-methyl-3-(trifluoromethyl)pyrazol-1-yl]acetic acid Chemical compound CC1=C(Cl)C(C(F)(F)F)=NN1CC(O)=O IZBZQUREHISXFJ-UHFFFAOYSA-N 0.000 description 1
- BHIIOLWIZLICII-UHFFFAOYSA-N 2-butyl-5-methylphenol Chemical compound CCCCC1=CC=C(C)C=C1O BHIIOLWIZLICII-UHFFFAOYSA-N 0.000 description 1
- BMRVLXHIZWDOOK-UHFFFAOYSA-N 2-butylnaphthalene-1-sulfonic acid Chemical compound C1=CC=CC2=C(S(O)(=O)=O)C(CCCC)=CC=C21 BMRVLXHIZWDOOK-UHFFFAOYSA-N 0.000 description 1
- IKCLCGXPQILATA-UHFFFAOYSA-N 2-chlorobenzoic acid Chemical compound OC(=O)C1=CC=CC=C1Cl IKCLCGXPQILATA-UHFFFAOYSA-N 0.000 description 1
- DQNLLSNNESIVOE-UHFFFAOYSA-N 2-chlorooctadecanoic acid Chemical compound CCCCCCCCCCCCCCCCC(Cl)C(O)=O DQNLLSNNESIVOE-UHFFFAOYSA-N 0.000 description 1
- MVRPPTGLVPEMPI-UHFFFAOYSA-N 2-cyclohexylphenol Chemical compound OC1=CC=CC=C1C1CCCCC1 MVRPPTGLVPEMPI-UHFFFAOYSA-N 0.000 description 1
- FEFCILUKYGHITK-UHFFFAOYSA-N 2-decoxycarbonylbenzoic acid Chemical compound CCCCCCCCCCOC(=O)C1=CC=CC=C1C(O)=O FEFCILUKYGHITK-UHFFFAOYSA-N 0.000 description 1
- FDIPWBUDOCPIMH-UHFFFAOYSA-N 2-decylphenol Chemical compound CCCCCCCCCCC1=CC=CC=C1O FDIPWBUDOCPIMH-UHFFFAOYSA-N 0.000 description 1
- CGMMPMYKMDITEA-UHFFFAOYSA-N 2-ethylbenzoic acid Chemical compound CCC1=CC=CC=C1C(O)=O CGMMPMYKMDITEA-UHFFFAOYSA-N 0.000 description 1
- XKZGIJICHCVXFV-UHFFFAOYSA-N 2-ethylhexyl diphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OCC(CC)CCCC)OC1=CC=CC=C1 XKZGIJICHCVXFV-UHFFFAOYSA-N 0.000 description 1
- MFSJUURIAOOSJR-UHFFFAOYSA-N 2-hydroxy-5-(2,4,4-trimethylpentan-2-yl)benzoic acid Chemical compound CC(C)(C)CC(C)(C)C1=CC=C(O)C(C(O)=O)=C1 MFSJUURIAOOSJR-UHFFFAOYSA-N 0.000 description 1
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- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000000594 mannitol Substances 0.000 description 1
- 235000010355 mannitol Nutrition 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 239000006078 metal deactivator Substances 0.000 description 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- BQGNQVJKQHKEPD-UHFFFAOYSA-N n-(triazin-4-yldisulfanyl)aniline Chemical compound C=1C=CC=CC=1NSSC1=CC=NN=N1 BQGNQVJKQHKEPD-UHFFFAOYSA-N 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- 229940117969 neopentyl glycol Drugs 0.000 description 1
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- ZWLPBLYKEWSWPD-UHFFFAOYSA-N o-toluic acid Chemical compound CC1=CC=CC=C1C(O)=O ZWLPBLYKEWSWPD-UHFFFAOYSA-N 0.000 description 1
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- YAFOVCNAQTZDQB-UHFFFAOYSA-N octyl diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(=O)(OCCCCCCCC)OC1=CC=CC=C1 YAFOVCNAQTZDQB-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- MFPCPCHVMQLDJN-UHFFFAOYSA-N phenyl ditridecyl phosphite Chemical compound CCCCCCCCCCCCCOP(OCCCCCCCCCCCCC)OC1=CC=CC=C1 MFPCPCHVMQLDJN-UHFFFAOYSA-N 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 125000005498 phthalate group Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002285 poly(styrene-co-acrylonitrile) Polymers 0.000 description 1
- 229920005671 poly(vinyl chloride-propylene) Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000259 polyoxyethylene lauryl ether Polymers 0.000 description 1
- 239000000256 polyoxyethylene sorbitan monolaurate Substances 0.000 description 1
- 235000010486 polyoxyethylene sorbitan monolaurate Nutrition 0.000 description 1
- 235000010483 polyoxyethylene sorbitan monopalmitate Nutrition 0.000 description 1
- 239000000249 polyoxyethylene sorbitan monopalmitate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- WBHHMMIMDMUBKC-XLNAKTSKSA-N ricinelaidic acid Chemical compound CCCCCC[C@@H](O)C\C=C\CCCCCCCC(O)=O WBHHMMIMDMUBKC-XLNAKTSKSA-N 0.000 description 1
- 229960003656 ricinoleic acid Drugs 0.000 description 1
- FEUQNCSVHBHROZ-UHFFFAOYSA-N ricinoleic acid Natural products CCCCCCC(O[Si](C)(C)C)CC=CCCCCCCCC(=O)OC FEUQNCSVHBHROZ-UHFFFAOYSA-N 0.000 description 1
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 1
- 229960001860 salicylate Drugs 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 229940116351 sebacate Drugs 0.000 description 1
- CXMXRPHRNRROMY-UHFFFAOYSA-L sebacate(2-) Chemical compound [O-]C(=O)CCCCCCCCC([O-])=O CXMXRPHRNRROMY-UHFFFAOYSA-L 0.000 description 1
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 1
- 235000019333 sodium laurylsulphate Nutrition 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 229960004274 stearic acid Drugs 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 239000003760 tallow Substances 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
- 229950006389 thiodiglycol Drugs 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- XTTGYFREQJCEML-UHFFFAOYSA-N tributyl phosphite Chemical compound CCCCOP(OCCCC)OCCCC XTTGYFREQJCEML-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- IVIIAEVMQHEPAY-UHFFFAOYSA-N tridodecyl phosphite Chemical compound CCCCCCCCCCCCOP(OCCCCCCCCCCCC)OCCCCCCCCCCCC IVIIAEVMQHEPAY-UHFFFAOYSA-N 0.000 description 1
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 description 1
- QFGWYYQGDCVPFQ-UHFFFAOYSA-M triethyl(hexadecyl)azanium;iodide Chemical compound [I-].CCCCCCCCCCCCCCCC[N+](CC)(CC)CC QFGWYYQGDCVPFQ-UHFFFAOYSA-M 0.000 description 1
- 125000005591 trimellitate group Chemical group 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- WTLBZVNBAKMVDP-UHFFFAOYSA-N tris(2-butoxyethyl) phosphate Chemical compound CCCCOCCOP(=O)(OCCOCCCC)OCCOCCCC WTLBZVNBAKMVDP-UHFFFAOYSA-N 0.000 description 1
- XUHUMYVYHLHMCD-UHFFFAOYSA-N tris(2-cyclohexylphenyl) phosphite Chemical compound C1CCCCC1C1=CC=CC=C1OP(OC=1C(=CC=CC=1)C1CCCCC1)OC1=CC=CC=C1C1CCCCC1 XUHUMYVYHLHMCD-UHFFFAOYSA-N 0.000 description 1
- ILLOBGFGKYTZRO-UHFFFAOYSA-N tris(2-ethylhexyl) phosphite Chemical compound CCCCC(CC)COP(OCC(CC)CCCC)OCC(CC)CCCC ILLOBGFGKYTZRO-UHFFFAOYSA-N 0.000 description 1
- LIPMRGQQBZJCTM-UHFFFAOYSA-N tris(2-propan-2-ylphenyl) phosphate Chemical compound CC(C)C1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C(C)C)OC1=CC=CC=C1C(C)C LIPMRGQQBZJCTM-UHFFFAOYSA-N 0.000 description 1
- JZNDMMGBXUYFNQ-UHFFFAOYSA-N tris(dodecylsulfanyl)phosphane Chemical compound CCCCCCCCCCCCSP(SCCCCCCCCCCCC)SCCCCCCCCCCCC JZNDMMGBXUYFNQ-UHFFFAOYSA-N 0.000 description 1
- QQBLOZGVRHAYGT-UHFFFAOYSA-N tris-decyl phosphite Chemical compound CCCCCCCCCCOP(OCCCCCCCCCC)OCCCCCCCCCC QQBLOZGVRHAYGT-UHFFFAOYSA-N 0.000 description 1
- OMSBTUDVUBACQY-UHFFFAOYSA-N tris[2-(2-butoxyethoxy)ethyl] phosphite Chemical compound CCCCOCCOCCOP(OCCOCCOCCCC)OCCOCCOCCCC OMSBTUDVUBACQY-UHFFFAOYSA-N 0.000 description 1
- WRSPWQHUHVRNFV-UHFFFAOYSA-N tris[3,5-di(nonyl)phenyl] phosphite Chemical compound CCCCCCCCCC1=CC(CCCCCCCCC)=CC(OP(OC=2C=C(CCCCCCCCC)C=C(CCCCCCCCC)C=2)OC=2C=C(CCCCCCCCC)C=C(CCCCCCCCC)C=2)=C1 WRSPWQHUHVRNFV-UHFFFAOYSA-N 0.000 description 1
- 239000002383 tung oil Substances 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 229960002703 undecylenic acid Drugs 0.000 description 1
- 235000015112 vegetable and seed oil Nutrition 0.000 description 1
- 239000008158 vegetable oil Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Description
本発明は、塩化ビニル樹脂組成物、詳しくは、
塩化ビニル樹脂に対し、可塑剤、有機酸の亜鉛
塩、有機酸の第a又はa族金属塩、エポキシ
樹脂及び液状ポリブタジエンを添加してなる、熱
安定性、着色性、耐候性に優れ、加工時のロール
汚れが改良され、またブツ発生の抑制された、特
に農業用に適した塩化ビニル樹脂組成物に関す
る。
一般に、塩化ビニル樹脂は熱及び光に対する安
定性に難があり、加熱成形加工を行う際に主とし
て脱塩化水素に起因する熱分解を起こし易く、こ
のため加工製品の機械的性質の低下、色調の悪化
を生じ、著しい不利益を招く欠点をもつている。
また、農業用等の長期間屋外で使用される場合に
おいても、色調の悪化、強度の低下等の問題を生
じ、その実用性を損なうことが多かつた。
かかる不利益をさけるために、鉛、バリウム、
カルシウム、カドミウム、マグネシウム、亜鉛等
の金属石鹸、有機錫化合物、有機ホスフアイト化
合物、エポキシ化合物等を各種組み合わせて配合
することにより、熱安定性の面ではほぼ満足すべ
き結果が得られている。
しかしながら、カドミウム及び鉛化合物等は毒
性が強く、現在ではその使用は大きく制限されて
いる。従つて、カドミウム等を使用しない系で無
害又は低毒性金属化合物と非金属安定剤とを組み
合わせて相乗効果を狙う方法が考えられてきた。
しかし、このような方法による場合、ある程度の
熱安定性が得られるが、安定剤としての技術的課
題を満足させるには充分とはいえない。
エポキシ化合物は塩化ビニル樹脂組成物の安定
化助剤として知られ、一般に広く使用されている
が、亜鉛石鹸の熱安定性の不足を補うためエポキ
シ化大豆油、エポキシ化アマニ油等の可塑剤型の
エポキシ化合物を多量に使用するとブリード現象
が発生して成形品の表面が粘着性を呈するように
なるために実用的な製品が得られない。そこで、
このような欠点のないエポキシ化合物として樹脂
型のエポキシ化合物を使用すれば、多量に使用し
てもブリード性が少ないので製品の表面物性の改
良に効果があることが認められている。また、エ
ポキシ樹脂はエポキシ化植物油に比して耐候性、
汚れ、防黴性等に秀れるが、成形加工時に高温及
び安定剤の金属塩によるエポキシ化合物の重縮合
により、カレンダー加工の場合にはストレーナー
のブレーカー・プレート及びテークオフロールに
プレートアウト現象が生じ、T−ダイ加工の場合
にはダイスの目ヤニ現象としてプレートアウト現
象が生じ、何れの場合もロングラン性を著しく低
下させる。しかも、エポキシ樹脂を用いた場合は
加工後数ケ月経過時点でブツ現象が生じ、その商
品価値が損なわれるという大きな欠点もあつた。
本発明者らは、かかる現状に鑑み、エポキシ樹
脂の使用に伴う欠点を解消するために鋭意検討を
重ねた結果、塩化ビニル樹脂100重量部に、(a)可
塑剤20〜90重量部、(b)有機酸の亜鉛塩0.01〜10重
量部、(c)有機酸の第a又はa族金属塩0.01〜
10重量部、(d)エポキシ樹脂0.01〜10重量部及び(e)
平均分子量500〜10000の液状ポリブタジエン又は
その変性品0.005〜3重量部を配合することによ
り、長期熱安定性、着色防止性、耐候性に優れ、
特にプレートアウト及びブツ発生の抑制された塩
化ビニル樹脂組成物、特に農業用に好適な塩化ビ
ニル樹脂組成物が得られることを見い出し本発明
に到達した。
以下、上記特徴を以てなる本発明の塩化ビニル
樹脂組成物について詳述する。
本発明において使用される可塑剤としては、ジ
ブチルフタレート、ジイソノニルフタレート、ブ
チルベンジルフタレート、ジラウリルフタレー
ト、ジヘプチルフタレート、ジメチルフタレー
ト、ジイソデシルフタレート、ジオクチルフタレ
ート、ジシクロヘキシルフタレート等のフタレー
ト系、ジオクチルアジペート、ジイソデシルアジ
ペート、ジイソノニルアジペート、ジブチルジグ
リコールアジペート等のアジペート系、トリクレ
ジルホスフエート、トリス(イソプロピルフエニ
ル)ホスフエート、トリブチルホスフエート、ト
リエチルホスフエート、トリオクチルホスフエー
ト、トリブトキシエチルホスフエート、トリフエ
ニルホスフエート、オクチルジフエニルホスフエ
ート、トリキシリルホスフエート等のホスフエー
ト系、その他ポリエステル系、テトラヒドロフタ
レート系、アゼレート系、セバケート系、ステア
リン酸系、クエン酸系、トリメリテート系があげ
られる。
これらの可塑剤の添加量は塩化ビニル樹脂100
重量部に対して20〜90重量部、好ましくは30〜80
重量部である。
また、これらの可塑剤の中でもフタレート系の
可塑剤が本発明において特に有用であり、特に高
度の耐候性を要求される場合にはフタレート系の
可塑剤とホスフエート系の可塑剤を併用すること
が好ましく、この場合はホスフエート系の可塑剤
を塩化ビニル樹脂100重量部に対して1〜15重量
部用いることが好ましい。
本発明において使用される、有機酸の亜鉛塩及
び有機酸の第a又はa族金属塩を構成する有
機酸としては、カプロン酸、ペラルゴン酸、ラウ
リン酸、2−エチルへキシル酸、ミリスチン酸、
パルミチン酸、ウンデシレン酸、リシノール酸、
リノール酸、リノレイン酸、ネオデカン酸、オレ
イン酸、スチレン酸、イソデカン酸、イソステア
リン酸、12−ヒドロキシステアリン酸、12−ケト
ステアリン酸、クロロステアリン酸、フエニルス
テアリン酸、アラキン酸、ベヘン酸、エルカ酸、
ブラシジン酸及び類似酸並びに獣脂脂肪酸、やし
油脂肪酸、桐油脂肪酸、大豆油脂肪酸及び綿実油
脂肪酸の如き天然に産出する上記の酸の混合物、
安息香酸、クロル安息香酸、トルイル酸、サリチ
ル酸、p−t−ブチル安息香酸、5−t−オクチ
ルサリチル酸、ナフテン酸、キリシル酸、エチル
安息香酸、イソプロピル安息香酸、ジ−t−ブチ
ル安息香酸、ブロモ安息香酸、モノブチルマレー
ト、モノデシルフタレート、シクロヘキサンカル
ボン酸等があげられる。
また、フエーノール類も有機酸として有用であ
る。該フエノール類としては例えばシクロヘキシ
ルフエノール、t−ブチルフエノール、フエニル
フエノール、ノニルフエノール、ジノニルフエノ
ール、メチル−t−ブチルフエノール、テトラメ
チルフエノール、ポリ(ジ−ペンタ)イソプロピ
ルフエノール、ジイソプロピル−m−クレゾー
ル、ブチルフエノール、イソアミルフエノール、
イソオクチルフエノール、2−エチルヘキシルフ
エノール、t−ノニルフエノール、デシルフエノ
ール、t−ドデシルフエノール、t−オクチルフ
エノール、オクチルフエノール、イソヘキシルヘ
ノール、オクタデシルフエノール、ジイソブチル
フエノール、メチルプロピルフエノール、メチル
−t−オクチルフエノール、ジ−t−ノニルフエ
ノール、ジ−t−ドデシルフエノール等があげら
れる。
金属成分の第a族金属としてはリチウム、ナ
トリウム、カリウム等があげられ、第a族金属
としてはバリウム、カルシウム、マグネシウム、
ストロチウム等があげられる。
これらの有機酸の亜鉛塩及び有機酸のa又は
a族金属塩の添加量は塩化ビニル樹脂100重量
部に対してそれぞれ0.01〜10重量部、好ましくは
0.1〜3重量部である。
本発明において使用されるエポキシ樹脂として
は、多価フエノール類とエピクロルヒドリン又は
メチルエピクロルヒドリンとの反応によつて得ら
れるものがあげられ、特にビスフエノール型及び
ノボラツク型のエポキシ樹脂が好ましい。
ビスフエノール型エポキシ樹脂としては例えば
アラルダイト502(チバガイギー社製;エポキシ当
量233〜250)、アラルダイト508(同;400〜455)、
エピクロン850(大日本インキ化学製;184〜194)、
エピクロン830(同;170〜190)、エピコート828
(シエル社製;184〜194)、エピコート834(同;
230〜270)、スミエポキシELA128(住友化学製;
184〜194)、EP−4100(旭電化製;180〜200)等
があげられ、ノボラツク型エポキシ樹脂としては
例えばDEN431(ダウ社製;エポキシ当量172〜
179)、DEN438(同;175〜182)、エピクロンN−
740(大日本インキ化学製;170〜190)、エピクロ
ンN−680(同;220〜240)、CIBAEPN1139(チバ
ガイギー社製;172〜179)、CIBAECN1273(同;
約225)等があげられる。
これらのエポキシ樹脂の添加量は塩化ビニル樹
脂100重量部に対して0.01〜10重量部、好ましく
は0.1〜5重量部である。
本発明において用いられる液状ポリブタジエン
又はその変性品は、ブタジエンホモポリマー、ブ
タジエンコポリマー、これらの変性品及びこれら
の混合物を包含する。更にブタジエンホモポリマ
ーという語は同様に一般的な意味で使われ、1,
3−ブタジエンの単独重合によつて造られる1,
2−アタクチツクポリブタジエン、1,2−シン
ジオタクチツクポリブタジエン、1,2−アイソ
タクチツクポリブタジエン、1,4−シスポリブ
タジエン及び1,4−トランスポリブタジエン或
いはこれらのブロツクポリマー、グラフトポリマ
ー及び混合物を包含する。同様に、ブタジエンコ
ポリマーは1,3−ブタジエンとオレフイン系単
量体或いは共役ジエン系単量体との共重合によつ
て造られる種々の共重合体を包含する。また、部
分的に変性したポリブタジエンも包含する。ポリ
ブタジエン変性体としては例えば部分エポキシ化
物、末端にヒドロキシル基及び/又はカルボキシ
ル基を有するもの或いは部分的にマレイン化、ハ
ロゲン化、ボイル化、水素添加、アクリル変性、
ウレタン変性及びエステル変性されたポリブタジ
エンを包含する。
本発明の目的には特に1,2−アクタチツクポ
リブタジエンを主成分とする液状ポリブタジエン
又はその変性品液状ポリブタジエン又はその変性
品の添加量は塩化ビニル樹脂100重量部に対して
0.005〜3重量部、好ましくは0.01〜1重量部で
ある。
特に好適な農業用塩化ビニル樹脂組成物を得る
ためには、本発明の組成物に更に有機ホスフアイ
ト化合物及び防曇剤を包含させることが好まし
い。
かかる有機ホスフアイト化合物としては、ジフ
エニルデシルホスフアイト、トリフエニルホスフ
アイト、トリス−ノニルフエニルホスフアイト、
トリデシルホスフアイト、トリス(2−エチルヘ
キシル)ホスフアイト、トリブチルホスフアイ
ト、トリス(ジノニルフエニル)ホスフアイト、
トリラウリルトリチオホスフアイト、トリラウリ
ルホスフアイト、ビス(ネオペンチルグリコー
ル)−1,4−シクロヘキサンジメチルホスフア
イト、ジステアリルペンタエリスリトールジホス
フアイト、ジイソデシルペンタエリスリトールジ
ホスフアイト、トリス(ラウリル−2−チオエチ
ル)ホスフアイト、テトラトリデシル−1,1,
3−トリス(2′−メチル−5′−第3ブチル−4′−
オキシフエニル)ブタンジホスフアイト、テトラ
(C12〜15混合アルキル)4,4′−イソプロピリデン
ジフエニルジホスフアイト、トリス(4−オキシ
−2,5−ジ−第3ブチルフエニル)ホスフアイ
ト、トリス(4−オキシ−3,5−ジ−第3ブチ
ルフエニル)ホスフアイト、2−エチルヘキシル
ジフエニルホスフアイト、トリス(モノ、ジ混合
ノニルフエニル)ホスフアイト、水素化−4,
4′−イソプロピリデンジフエノールポリホスフア
イト、ジフエニル・ビス〔4,4′−n−ブチリデ
ンビス(2−第3ブチル−5−メチルフエノー
ル)〕チオジエタノールジホスフアイト、ビス
(オクチルフエニル)・ビス〔4,4′−n−ブチリ
デンビス(2−第3ブチル−5−メチルフエノー
ル)〕−1,6−ヘキサンジオールジホスフアイ
ト、フエニル−4,4′−イソプロピリデンジフエ
ノール・ベンタエリスリトールジホスフアイト、
フエニルジイソデシルホスフアイト、テトラトリ
デシル−4,4′−n−ブチリデンビス(2−第3
ブチル−5−メチルフエノール)ジホスフアイ
ト、トリス(2,4−ジ−第3ブチルフエニル)
ホスフアイト、トリスステアリルホスフアイト、
オクチルジフエニルホスフアイト、ジフエニルト
リデシルホスフアイト、フエニルジ(トリデシ
ル)ホスフアイト、トリス(2−シクロヘキシル
フエニル)ホスフアイト、ジ(トリデシル)・ジ
(2−シクロヘキシルフエニル)・水添ビスフエノ
ールA・ジホスフアイト、ジ(2,4−ジ−第3
ブチフエニル)シクロヘキシルホスフアイト、
2,4−ジ−第3ブチルフエニル・ジイソデシル
ホスフアイト、トリス(ブトキシエトキシエチ
ル)ホスフアイト、ジフエニルアシドホフアイ
ト、ビス(2−シクロヘキシルフエニル)アシド
ホスフアイト、ビス(2,4−ジ−t−ブチルフ
エニル)アシドホスフアイト、ビス(ノニルフエ
ニル)アシドホスフアイト、ジベンジルアシドホ
スフアイト等があげられる。
これらの有機ホスフアイト化合物の添加量は塩
化ビニル樹脂100重量部に対して0.01〜10重量部、
好ましくは0.1〜5重量部である。
防曇剤としては、非イオン系、アニオン系及び
カチオン系の界面活性剤が使用され、例えばポリ
オキシアルキレンエーテル、多価アルコールの部
分エステル、多価アルコールのアルキレンオキサ
イド付加物の部分エステル、高級アルコール硫酸
エステルアルカリ金属塩、アルキルアリールスル
ホミネート、四級アンモニウム塩、脂肪族アミン
誘導体があげられる。具体的にはポリオキシエチ
レンラウリルエーテル、−ステアリルエーテル、−
ノニルフエニルエーテル、ポリエチレングライコ
ールモノパルミテート、ポリエチレングライコー
ルモノステアレート、ポリオキシエチレンソルビ
タンモノラウレート、ポリオキシエチレンソルビ
タンモノパルミテート、グリセリンモノラウレー
ト、グリセリンモノパルミテート、グリセリンモ
ノステアレート、グリセリンモノオレート、ペン
タエリスリトールモノラウレート、ソルビタンモ
ノパルミテート、ソルビタンモノベヘネート、ソ
ルビタンジステアレート、ジグリセリンモノオレ
ート、トリグリセリンジオレート、ナトリウムラ
ウリルサルフエート、ドデシルベンゼンスルホン
酸ナトリウム、ブチルナフタレンスルホン酸ナト
リウム、セチルトリメチルアンモニウムクロライ
ド、アルキルジメチルベンジルアンモニウムクロ
ライド、ドデシルアミン塩酸塩、ラウリン酸ラウ
リルアミドエチル燐酸塩、トリエチルセチルアン
モニウムイオダイド、オレイルアミノジエチルア
ミン塩酸塩、ドデシルピリジニウム硫酸塩の塩基
性ピリジニウム塩等があげられる。
これらの防曇剤の添加量は塩化ビニル樹脂100
重量部に対して0.01〜10重量部、好ましくは0.1
〜5重量部である。
本発明の組成物に紫外線吸収剤を添加するなら
ば、光安定性を向上させ得るので、使用目的に応
じて適宜これらを選択して使用することが可能で
ある。これらにはベンゾフエノン系、ベンゾトリ
アゾール系、サリシレート系、置換アクロニトリ
ル系、ピペリジン系等があげられる。
また、本発明の組成物には通常用いられる安定
化助剤を添加することができる。かかる安定化助
剤としては、例えば、2,6−ジ−t−ブチル−
p−クレゾール、ジラウリルチオジプロピオネー
ト、ジフエニルチオ尿素、フエニルインドール、
チオジグリコールビス(アミノクロトネート)、
ペンタエリスリトール、トリス(ヒドロキシエチ
ル)イソシアヌレート、ソルビトール、マニトー
ル、アニリノジチオトリアジン、メラミン、ジペ
ンタエリスリトール、ジペンタエリスリトールア
ジペート、p−t−ブチル安息香酸、デヒドロ酢
酸、デヒドロ酢酸亜鉛、ノニルフエノキシポリエ
トキシ燐酸、安息香酸、ケイヒ酸、ジベンゾイル
メタン、ステアロイルベンゾイルメタン、ベンゾ
イルペンタノイルメタン等があげられる。
その他必要に応じて、例えば顔料、充填剤、表
面処理剤、滑剤、螢光剤、防黴剤、殺菌剤、金属
不活性化剤、赤劣化剤、紫外線吸収剤、加工助
剤、離型剤、補強剤等を包含させることができ
る。
本発明に用いられる塩化ビニル樹脂としては、
塩化ビニルホモポリマー及び塩化ビニル−酢酸ビ
ニル共重合体、塩化ビニル−エチレン酢酸ビニル
共重合体、塩化ビニル−エチレン共重合体、塩化
ビニル−プロピレン共重合体、塩化ビニル−スチ
レン共重合体、塩化ビニル−イソブチレン共重合
体、塩化ビニル−塩化ビニリデン共重合体、塩化
ビニル−スチレン−無水マレイン酸三元共重合
体、塩化ビニル−スチレン−アクリロニトリル共
重合体、塩化ビニル−ブタジエン共重合体、塩化
ビニル−イソプレン共重合体、塩化ビニル−塩素
化プロピレン共重合体、塩化ビニル−塩化ビニリ
デン−酢酸ビニル三元共重合体、塩化ビニル−ア
クリル酸エステル共重合体、塩化ビニル−マレイ
ン酸エステル共重合体、塩化ビニル−メタクリル
酸エステル共重合体、塩化ビニル−アクリロニト
リル共重合体等の塩化ビニル共重合体及び上記樹
脂とポリエチレン、ポリプロピレン、ポリブテ
ン、ポリ−3−メチルブテン等のα−オレフイン
重合体又はエチレン−酢酸ビニル共重合体、エチ
レン−プロピレン共重合体等のポリオレフイン及
びこれらの共重合体、ポリスチレン、アクリル樹
脂、スチレンと他の単量体(例えば無水マレイン
酸、ブタジエン、アクリロニトリル等)との共重
合体、アクリロニトリル−ブタジエン−スチレン
共重合体、アクリル酸エステル−ブタジエン−ス
チレン共重合体、メタクリル酸エステル−ブタジ
エン−スチレン共重合体とのブレンド品等をあげ
ることができる。
以下に、本発明の実施例をあげて、本発明の効
果を明らかにする。
実施例 1
下記の配合物も二本ロールミルにより混練試験
を行い、180℃でのロール上への粘着の開始時間
及びミルテスト20分後のロールの汚れを測定し
た。また、同じ配合により厚さ0.1mmのフイルム
を作成し、1年間屋外暴露し耐候性を評価した。
また、このフイルムを70℃、90%相対湿度の状態
で10日間保存した場合のブツの発生状態を観察し
た。それらの結果を表−1に示す。尚、ブツ発生
の評価は5段階で評価し、1は異常なし、以下数
字が大きくなるに従つてブツが多数発生したこと
を示す。また、ロール汚れは10段階で評価し、1
は異常なし、以下数字が大きくなるに従つて汚れ
が激しくなつたことを示し、5は全体に白色の薄
い被膜が形成されたことを示し、10は白濁した厚
い被膜が形成されたことを示す。
配 合 重量部
ポリ塩化ビニル 100
ジ−2−エチルヘキシルフタレート 50
トリクレジルホスフエート 5
ステアリン酸亜鉛 0.8
ステアリン酸バリウム 0.4
オクチル酸亜鉛 0.3
p−第3ブチル安息香酸バリウム 0.3
オクチルジフエニルホスフアイト 0.6
ソルビタンモノパルミテート 2
エポキシ樹脂(旭電化製;EP−13) 3
液状ポリブタジエン(表−1) 0.1
The present invention relates to a vinyl chloride resin composition, specifically,
It is made by adding a plasticizer, a zinc salt of an organic acid, a Group A or Group A metal salt of an organic acid, an epoxy resin, and a liquid polybutadiene to a vinyl chloride resin, and has excellent heat stability, colorability, and weather resistance. The present invention relates to a vinyl chloride resin composition particularly suitable for agricultural use, which has improved roll staining and suppressed the occurrence of lumps. In general, vinyl chloride resins have poor stability against heat and light, and are prone to thermal decomposition mainly due to dehydrochlorination during thermoforming, resulting in decreased mechanical properties and color tone of processed products. It has the disadvantage of causing deterioration and causing significant disadvantages.
Moreover, when used outdoors for long periods of time, such as in agricultural applications, problems such as deterioration of color tone and decrease in strength often occur, impairing its practicality. In order to avoid such disadvantages, lead, barium,
By blending various combinations of metal soaps such as calcium, cadmium, magnesium, and zinc, organic tin compounds, organic phosphite compounds, epoxy compounds, etc., almost satisfactory results have been obtained in terms of thermal stability. However, cadmium, lead compounds, etc. are highly toxic, and their use is currently largely restricted. Therefore, methods have been considered in which a harmless or low-toxicity metal compound and a non-metal stabilizer are combined in a system that does not use cadmium or the like to achieve a synergistic effect.
However, although a certain degree of thermal stability can be obtained by such a method, it is not sufficient to satisfy the technical problems as a stabilizer. Epoxy compounds are known and widely used as stabilizing agents for vinyl chloride resin compositions, but to compensate for the lack of thermal stability of zinc soap, plasticizers such as epoxidized soybean oil and epoxidized linseed oil are used. If a large amount of epoxy compound is used, a bleeding phenomenon occurs and the surface of the molded product becomes sticky, making it impossible to obtain a practical product. Therefore,
It has been recognized that if a resin-type epoxy compound is used as an epoxy compound that does not have such drawbacks, it will be effective in improving the surface properties of products because it will not bleed even when used in large amounts. In addition, epoxy resin has better weather resistance than epoxidized vegetable oil.
It has excellent stain and mildew resistance, but due to the high temperature during molding and polycondensation of the epoxy compound due to the metal salt used as a stabilizer, plate-out phenomenon occurs on the breaker plate of the strainer and the take-off roll when calendering is performed. In the case of T-die machining, a plate-out phenomenon occurs as a die grain phenomenon, and in either case, long-run performance is significantly reduced. Moreover, when epoxy resin is used, it has a major drawback in that a lump phenomenon occurs several months after processing, which impairs its commercial value. In view of the current situation, the present inventors have made extensive studies to eliminate the drawbacks associated with the use of epoxy resins, and have found that 100 parts by weight of vinyl chloride resin, (a) 20 to 90 parts by weight of plasticizer, ( b) Zinc salt of organic acid 0.01 to 10 parts by weight, (c) Group a or group a metal salt of organic acid 0.01 to 10 parts by weight
10 parts by weight, (d) 0.01 to 10 parts by weight of epoxy resin, and (e)
By blending liquid polybutadiene with an average molecular weight of 500 to 10,000 or 0.005 to 3 parts by weight of its modified products, it has excellent long-term thermal stability, coloration prevention, and weather resistance.
In particular, it has been found that a vinyl chloride resin composition in which plate-out and lump formation are suppressed, particularly a vinyl chloride resin composition suitable for agricultural use, can be obtained, and the present invention has been achieved. Hereinafter, the vinyl chloride resin composition of the present invention having the above characteristics will be described in detail. Examples of plasticizers used in the present invention include phthalates such as dibutyl phthalate, diisononyl phthalate, butylbenzyl phthalate, dilauryl phthalate, diheptyl phthalate, dimethyl phthalate, diisodecyl phthalate, dioctyl phthalate, and dicyclohexyl phthalate, dioctyl adipate, and diisodecyl adipate. , diisononyl adipate, dibutyl diglycol adipate, and other adipates, tricresyl phosphate, tris(isopropylphenyl) phosphate, tributyl phosphate, triethyl phosphate, trioctyl phosphate, tributoxyethyl phosphate, triphenyl phosphate , phosphates such as octyl diphenyl phosphate and tricylyl phosphate, other polyesters, tetrahydrophthalate, azelate, sebacate, stearic acid, citric acid, and trimellitate. The amount of these plasticizers added is 100% of vinyl chloride resin.
20 to 90 parts by weight, preferably 30 to 80 parts by weight
Parts by weight. Furthermore, among these plasticizers, phthalate plasticizers are particularly useful in the present invention, and when particularly high weather resistance is required, phthalate plasticizers and phosphate plasticizers may be used together. Preferably, in this case, 1 to 15 parts by weight of a phosphate plasticizer is used per 100 parts by weight of the vinyl chloride resin. Examples of the organic acids constituting the zinc salt of an organic acid and the group a or a metal salt of an organic acid used in the present invention include caproic acid, pelargonic acid, lauric acid, 2-ethylhexylic acid, myristic acid,
palmitic acid, undecylenic acid, ricinoleic acid,
Linoleic acid, linoleic acid, neodecanoic acid, oleic acid, styrenic acid, isodecanoic acid, isostearic acid, 12-hydroxystearic acid, 12-ketostearic acid, chlorostearic acid, phenylstearic acid, arachidic acid, behenic acid, erucic acid ,
Brassic acid and similar acids and naturally occurring mixtures of the above acids such as tallow fatty acids, coconut oil fatty acids, tung oil fatty acids, soybean oil fatty acids and cottonseed oil fatty acids,
Benzoic acid, chlorobenzoic acid, toluic acid, salicylic acid, pt-butylbenzoic acid, 5-t-octylsalicylic acid, naphthenic acid, xylicylic acid, ethylbenzoic acid, isopropylbenzoic acid, di-t-butylbenzoic acid, bromo Examples include benzoic acid, monobutyl maleate, monodecyl phthalate, and cyclohexanecarboxylic acid. Phenols are also useful as organic acids. Examples of the phenols include cyclohexylphenol, t-butylphenol, phenylphenol, nonylphenol, dinonylphenol, methyl-t-butylphenol, tetramethylphenol, poly(di-penta)isopropylphenol, diisopropyl-m-cresol. , butylphenol, isoamylphenol,
Isooctylphenol, 2-ethylhexylphenol, t-nonylphenol, decylphenol, t-dodecylphenol, t-octylphenol, octylphenol, isohexylphenol, octadecylphenol, diisobutylphenol, methylpropylphenol, methyl-t-octyl Examples include phenol, di-t-nonylphenol, di-t-dodecylphenol, and the like. Group A metals of the metal component include lithium, sodium, potassium, etc., and Group A metals include barium, calcium, magnesium,
Examples include strotium. The amount of the zinc salt of the organic acid and the a or group a metal salt of the organic acid to be added is 0.01 to 10 parts by weight, preferably 0.01 to 10 parts by weight, respectively, per 100 parts by weight of the vinyl chloride resin.
It is 0.1 to 3 parts by weight. Epoxy resins used in the present invention include those obtained by reacting polyhydric phenols with epichlorohydrin or methylepichlorohydrin, with bisphenol type and novolac type epoxy resins being particularly preferred. Examples of bisphenol type epoxy resins include Araldite 502 (manufactured by Ciba Geigy; epoxy equivalent: 233-250), Araldite 508 (manufactured by Ciba Geigy; epoxy equivalent: 233-250),
Epicron 850 (Dainippon Ink Chemical; 184-194),
Epicron 830 (same; 170-190), Epicort 828
(manufactured by Ciel; 184-194), Epicote 834 (manufactured by Ciel;
230-270), Sumiepoxy ELA128 (manufactured by Sumitomo Chemical;
184-194), EP-4100 (manufactured by Asahi Denka; 180-200), and examples of novolak type epoxy resin include DEN431 (manufactured by Dow Corporation; epoxy equivalent 172-200).
179), DEN438 (same; 175-182), Epicron N-
740 (manufactured by Dainippon Ink Chemical; 170-190), Epicron N-680 (manufactured by Dainippon Ink Chemical; 220-240), CIBAEPN1139 (manufactured by Ciba Geigy; 172-179), CIBAECN1273 (manufactured by Ciba Geigy;
Approximately 225) etc. The amount of these epoxy resins added is 0.01 to 10 parts by weight, preferably 0.1 to 5 parts by weight, based on 100 parts by weight of the vinyl chloride resin. The liquid polybutadiene or modified product thereof used in the present invention includes a butadiene homopolymer, a butadiene copolymer, a modified product thereof, and a mixture thereof. Furthermore, the term butadiene homopolymer is also used in a general sense, 1,
1, made by homopolymerization of 3-butadiene
Includes 2-atactic polybutadiene, 1,2-syndiotactic polybutadiene, 1,2-isotactic polybutadiene, 1,4-cis polybutadiene and 1,4-trans polybutadiene, or block polymers, graft polymers and mixtures thereof. . Similarly, butadiene copolymers include various copolymers made by copolymerizing 1,3-butadiene with olefinic monomers or conjugated diene monomers. It also includes partially modified polybutadiene. Modified polybutadienes include, for example, partially epoxidized products, those having a hydroxyl group and/or carboxyl group at the end, or partially maleated, halogenated, boiled, hydrogenated, acrylic modified,
Includes urethane-modified and ester-modified polybutadiene. In particular, for the purpose of the present invention, the amount of liquid polybutadiene containing 1,2-actactic polybutadiene as a main component or a modified product thereof is determined based on 100 parts by weight of vinyl chloride resin.
The amount is 0.005 to 3 parts by weight, preferably 0.01 to 1 part by weight. In order to obtain a particularly suitable agricultural vinyl chloride resin composition, it is preferable to further include an organic phosphite compound and an antifogging agent in the composition of the present invention. Such organic phosphite compounds include diphenyldecyl phosphite, triphenyl phosphite, tris-nonylphenyl phosphite,
Tridecyl phosphite, tris (2-ethylhexyl) phosphite, tributyl phosphite, tris (dinonylphenyl) phosphite,
Trilauryltrithiophosphite, trilaurylphosphite, bis(neopentylglycol)-1,4-cyclohexanedimethylphosphite, distearylpentaerythritol diphosphite, diisodecylpentaerythritol diphosphite, tris(lauryl-2-thioethyl) Phosphite, tetratridecyl-1,1,
3-Tris(2'-methyl-5'-tert-butyl-4'-
oxyphenyl)butane diphosphite, tetra( C12-15 mixed alkyl)4,4'-isopropylidene diphenyl diphosphite, tris(4-oxy-2,5-di-tert-butylphenyl)phosphite, tris(4 -oxy-3,5-di-tert-butylphenyl) phosphite, 2-ethylhexyldiphenyl phosphite, tris(mono-, di-mixed nonylphenyl) phosphite, hydrogenated-4,
4'-isopropylidene diphenol polyphosphite, diphenyl bis[4,4'-n-butylidene bis(2-tert-butyl-5-methylphenol)]thiodiethanol diphosphite, bis(octylphenyl) bis [4,4'-n-butylidene bis(2-tert-butyl-5-methylphenol)]-1,6-hexanediol diphosphite, phenyl-4,4'-isopropylidene diphenol bentaerythritol diphosphite ,
Phenyl diisodecyl phosphite, tetratridecyl-4,4'-n-butylidene bis(2-tertiary)
Butyl-5-methylphenol) diphosphite, tris(2,4-di-tert-butylphenyl)
phosphite, trisstearyl phosphite,
Octyl diphenyl phosphite, diphenyl tridecyl phosphite, phenyl di(tridecyl) phosphite, tris(2-cyclohexyl phenyl) phosphite, di(tridecyl) di(2-cyclohexyl phenyl) hydrogenated bisphenol A diphosphite , di(2,4-di-third
butyphenyl) cyclohexyl phosphite,
2,4-di-tert-butylphenyl diisodecyl phosphite, tris(butoxyethoxyethyl) phosphite, diphenyl acid phosphite, bis(2-cyclohexyl phenyl) acid phosphite, bis(2,4-di-t- Examples thereof include butylphenyl) acid phosphite, bis(nonylphenyl) acid phosphite, dibenzyl acid phosphite, and the like. The amount of these organic phosphite compounds added is 0.01 to 10 parts by weight per 100 parts by weight of vinyl chloride resin.
Preferably it is 0.1 to 5 parts by weight. Nonionic, anionic, and cationic surfactants are used as antifogging agents, such as polyoxyalkylene ethers, partial esters of polyhydric alcohols, partial esters of alkylene oxide adducts of polyhydric alcohols, and higher alcohols. Examples include alkali metal sulfate ester salts, alkylaryl sulfonates, quaternary ammonium salts, and aliphatic amine derivatives. Specifically, polyoxyethylene lauryl ether, -stearyl ether, -
Nonyl phenyl ether, polyethylene glycol monopalmitate, polyethylene glycol monostearate, polyoxyethylene sorbitan monolaurate, polyoxyethylene sorbitan monopalmitate, glycerin monolaurate, glycerin monopalmitate, glycerin monostearate, Glycerin monooleate, pentaerythritol monolaurate, sorbitan monopalmitate, sorbitan monobehenate, sorbitan distearate, diglycerin monooleate, triglycerin diolate, sodium lauryl sulfate, sodium dodecylbenzenesulfonate, butylnaphthalenesulfonic acid Examples include basic pyridinium salts of sodium, cetyltrimethylammonium chloride, alkyldimethylbenzylammonium chloride, dodecylamine hydrochloride, laurylamide ethyl laurate phosphate, triethylcetylammonium iodide, oleyl aminodiethylamine hydrochloride, and dodecylpyridinium sulfate. It will be done. The amount of these antifogging agents added is 100% of vinyl chloride resin.
0.01 to 10 parts by weight, preferably 0.1 parts by weight
~5 parts by weight. If an ultraviolet absorber is added to the composition of the present invention, the photostability can be improved, so it is possible to select and use these as appropriate depending on the purpose of use. These include benzophenone type, benzotriazole type, salicylate type, substituted acronitrile type, piperidine type and the like. Further, commonly used stabilizing aids can be added to the composition of the present invention. Such stabilizing aids include, for example, 2,6-di-t-butyl-
p-cresol, dilauryl thiodipropionate, diphenylthiourea, phenylindole,
Thiodiglycol bis(aminocrotonate),
Pentaerythritol, tris(hydroxyethyl)isocyanurate, sorbitol, mannitol, anilinodithiotriazine, melamine, dipentaerythritol, dipentaerythritol adipate, pt-butylbenzoic acid, dehydroacetic acid, zinc dehydroacetate, nonylphenoxy Examples include polyethoxyphosphoric acid, benzoic acid, cinnamic acid, dibenzoylmethane, stearoylbenzoylmethane, and benzoylpentanoylmethane. Others as necessary, such as pigments, fillers, surface treatment agents, lubricants, fluorescent agents, antifungal agents, bactericidal agents, metal deactivators, red deterioration agents, ultraviolet absorbers, processing aids, and mold release agents. , reinforcing agents, and the like. As the vinyl chloride resin used in the present invention,
Vinyl chloride homopolymer and vinyl chloride-vinyl acetate copolymer, vinyl chloride-ethylene vinyl acetate copolymer, vinyl chloride-ethylene copolymer, vinyl chloride-propylene copolymer, vinyl chloride-styrene copolymer, vinyl chloride -isobutylene copolymer, vinyl chloride-vinylidene chloride copolymer, vinyl chloride-styrene-maleic anhydride terpolymer, vinyl chloride-styrene-acrylonitrile copolymer, vinyl chloride-butadiene copolymer, vinyl chloride- Isoprene copolymer, vinyl chloride-chlorinated propylene copolymer, vinyl chloride-vinylidene chloride-vinyl acetate terpolymer, vinyl chloride-acrylic acid ester copolymer, vinyl chloride-maleic acid ester copolymer, chloride Vinyl chloride copolymers such as vinyl-methacrylic acid ester copolymers and vinyl chloride-acrylonitrile copolymers, and the above resins and α-olefin polymers such as polyethylene, polypropylene, polybutene, poly-3-methylbutene, or ethylene-vinyl acetate. Copolymers, polyolefins such as ethylene-propylene copolymers and their copolymers, polystyrene, acrylic resins, copolymers of styrene and other monomers (e.g. maleic anhydride, butadiene, acrylonitrile, etc.), acrylonitrile Blended products with -butadiene-styrene copolymer, acrylic acid ester-butadiene-styrene copolymer, methacrylic acid ester-butadiene-styrene copolymer, etc. can be mentioned. Examples of the present invention will be given below to clarify the effects of the present invention. Example 1 The following formulation was also subjected to a kneading test using a two-roll mill, and the onset time of adhesion on the roll at 180°C and the staining of the roll 20 minutes after the mill test were measured. In addition, a film with a thickness of 0.1 mm was prepared using the same formulation, and was exposed outdoors for one year to evaluate its weather resistance.
In addition, the appearance of spots was observed when this film was stored at 70° C. and 90% relative humidity for 10 days. The results are shown in Table-1. Incidentally, the occurrence of bumps was evaluated on a 5-level scale, with 1 indicating no abnormality and the higher the number, the more bumps had occurred. In addition, roll dirt was evaluated on a scale of 1 to 1.
5 indicates that there is no abnormality, and as the number increases, the dirt becomes more severe. 5 indicates that a thin white film has been formed on the entire surface, and 10 indicates that a thick cloudy film has been formed. . Composition Part by weight Polyvinyl chloride 100 Di-2-ethylhexyl phthalate 50 Tricresyl phosphate 5 Zinc stearate 0.8 Barium stearate 0.4 Zinc octylate 0.3 Barium p-tert-butylbenzoate 0.3 Octyl diphenyl phosphite 0.6 Sorbitan mono Palmitate 2 Epoxy resin (manufactured by Asahi Denka; EP-13) 3 Liquid polybutadiene (Table 1) 0.1
【表】【table】
【表】
実施例 2
下記の配合物を用い、実施例1と同様にしてロ
ール上への粘着の開始時間及びロールの汚れを測
定した。また、同じ配合により厚さ0.1mmのフイ
ルムを作成し、6ケ月間屋外暴露した後のフイル
ムのかすみ度を測定した。かすみ度はフイルムへ
の微細なゴミの付着により増大し、光線の透過率
を低下させるので、農業用フイルムにおいてはか
すみ度が小さい方が好ましい。それらの結果を表
−2に示す。
配 合 重量部
ポリ塩化ビニル 100
ジ−2−エチルヘキシルフタレート 50
トリキシルホスフエート 7
エポキシ樹脂(シエル社製;エピコート828) 3
ソルビタンモノパルミテート 3
エチレンビスステアリルアミド 0.5
オクチル酸亜鉛 0.3
バリウム−p−t−ブチルベンゾエート 0.3
テトラ(トリデシル)・ビスフエノール 1.5
A・ジホスフアイト液状ポリブタジエン(表−
2) (表−2)[Table] Example 2 Using the following formulation, the onset time of adhesion onto the roll and the staining of the roll were measured in the same manner as in Example 1. Further, a film with a thickness of 0.1 mm was prepared using the same formulation, and the degree of haze of the film was measured after being exposed outdoors for 6 months. Since the degree of haze increases due to the attachment of fine dust to the film and reduces the transmittance of light rays, it is preferable that the degree of haze is small in agricultural films. The results are shown in Table-2. Mixture parts by weight Polyvinyl chloride 100 Di-2-ethylhexyl phthalate 50 Trixyl phosphate 7 Epoxy resin (manufactured by Ciel; Epicote 828) 3 Sorbitan monopalmitate 3 Ethylene bisstearylamide 0.5 Zinc octylate 0.3 Barium-pt -Butylbenzoate 0.3 Tetra(tridecyl)bisphenol 1.5 A.diphosphite Liquid polybutadiene (Table-
2) (Table-2)
【表】【table】
【表】
実施例 3
下記の配合物により厚さ0.1mmのフイルムを作
成し、190℃での熱安定性を測定した。また、こ
のフイルムについて、実施例1と同様にしてブツ
の発生状態を観察した。それらの結果を表−3に
示す。
配 合 重量部
ポリ塩化ビニル 100
ジ−2−エチルヘキシルフタレート 40
トリクリジルホスフエート 3
エポキシ樹脂(旭電化製;EP−13) 2
ステアリン酸アミド 1
ステアリン酸カルシウム 1
ステアリン酸亜鉛 1
オクチルジフエニルホスフアイト 0.5
液状ポリブタジエン(表−3) 0.1[Table] Example 3 A film with a thickness of 0.1 mm was prepared from the following formulation, and its thermal stability at 190°C was measured. Further, regarding this film, the state of occurrence of spots was observed in the same manner as in Example 1. The results are shown in Table 3. Mixture parts by weight Polyvinyl chloride 100 Di-2-ethylhexyl phthalate 40 Triclidyl phosphate 3 Epoxy resin (manufactured by Asahi Denka; EP-13) 2 Stearic acid amide 1 Calcium stearate 1 Zinc stearate 1 Octyl diphenyl phosphite 0.5 Liquid Polybutadiene (Table-3) 0.1
【表】【table】
Claims (1)
90重量部、(b)有機酸の亜鉛塩0.01〜10重量部、(c)
有機酸の第a又はa族金属塩0.01〜10重量
部、(d)エポキシ樹脂0.01〜10重量部及び(e)平均分
子量500〜10000の液状ポリブタジエン又はその変
性品0.005〜3重量部を添加してなる、塩化ビニ
ル樹脂組成物。1 100 parts by weight of vinyl chloride resin, (a) 20 to 20 parts of plasticizer
90 parts by weight, (b) 0.01 to 10 parts by weight of zinc salt of organic acid, (c)
Adding 0.01 to 10 parts by weight of a Group A or Group A metal salt of an organic acid, (d) 0.01 to 10 parts by weight of an epoxy resin, and (e) 0.005 to 3 parts by weight of liquid polybutadiene or a modified product thereof having an average molecular weight of 500 to 10,000. A vinyl chloride resin composition.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21585183A JPS60108452A (en) | 1983-11-16 | 1983-11-16 | Vinyl chloride resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21585183A JPS60108452A (en) | 1983-11-16 | 1983-11-16 | Vinyl chloride resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60108452A JPS60108452A (en) | 1985-06-13 |
JPH0345745B2 true JPH0345745B2 (en) | 1991-07-12 |
Family
ID=16679321
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21585183A Granted JPS60108452A (en) | 1983-11-16 | 1983-11-16 | Vinyl chloride resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60108452A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003301119A (en) * | 2002-04-11 | 2003-10-21 | Mizusawa Ind Chem Ltd | Stabilizer for chlorine-containing polymer and chlorine- containing polymer composition |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5298046A (en) * | 1975-12-29 | 1977-08-17 | Hooker Chemicals Plastics Corp | Polyvinyl chloride composition |
-
1983
- 1983-11-16 JP JP21585183A patent/JPS60108452A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5298046A (en) * | 1975-12-29 | 1977-08-17 | Hooker Chemicals Plastics Corp | Polyvinyl chloride composition |
Also Published As
Publication number | Publication date |
---|---|
JPS60108452A (en) | 1985-06-13 |
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