JPH0345653U - - Google Patents
Info
- Publication number
- JPH0345653U JPH0345653U JP10729789U JP10729789U JPH0345653U JP H0345653 U JPH0345653 U JP H0345653U JP 10729789 U JP10729789 U JP 10729789U JP 10729789 U JP10729789 U JP 10729789U JP H0345653 U JPH0345653 U JP H0345653U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- outer frame
- taking out
- terminal
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000000605 extraction Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10729789U JPH0345653U (en:Method) | 1989-09-12 | 1989-09-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10729789U JPH0345653U (en:Method) | 1989-09-12 | 1989-09-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0345653U true JPH0345653U (en:Method) | 1991-04-26 |
Family
ID=31655990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10729789U Pending JPH0345653U (en:Method) | 1989-09-12 | 1989-09-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0345653U (en:Method) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006245362A (ja) * | 2005-03-04 | 2006-09-14 | Mitsubishi Electric Corp | 半導体装置およびこれに用いられる電極端子 |
| JP2015142018A (ja) * | 2014-01-29 | 2015-08-03 | 三菱電機株式会社 | 電力用半導体装置 |
| WO2018020729A1 (ja) * | 2016-07-27 | 2018-02-01 | 株式会社日立製作所 | 半導体モジュールおよび半導体モジュールの製造方法 |
-
1989
- 1989-09-12 JP JP10729789U patent/JPH0345653U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006245362A (ja) * | 2005-03-04 | 2006-09-14 | Mitsubishi Electric Corp | 半導体装置およびこれに用いられる電極端子 |
| JP2015142018A (ja) * | 2014-01-29 | 2015-08-03 | 三菱電機株式会社 | 電力用半導体装置 |
| WO2018020729A1 (ja) * | 2016-07-27 | 2018-02-01 | 株式会社日立製作所 | 半導体モジュールおよび半導体モジュールの製造方法 |
| JPWO2018020729A1 (ja) * | 2016-07-27 | 2019-03-07 | 株式会社日立製作所 | 半導体モジュールおよび半導体モジュールの製造方法 |