JPH0345033Y2 - - Google Patents
Info
- Publication number
- JPH0345033Y2 JPH0345033Y2 JP14146186U JP14146186U JPH0345033Y2 JP H0345033 Y2 JPH0345033 Y2 JP H0345033Y2 JP 14146186 U JP14146186 U JP 14146186U JP 14146186 U JP14146186 U JP 14146186U JP H0345033 Y2 JPH0345033 Y2 JP H0345033Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat dissipation
- heat pipe
- fin
- pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000017525 heat dissipation Effects 0.000 claims description 80
- 238000010521 absorption reaction Methods 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 4
- 230000005855 radiation Effects 0.000 description 14
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14146186U JPH0345033Y2 (enExample) | 1986-09-17 | 1986-09-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14146186U JPH0345033Y2 (enExample) | 1986-09-17 | 1986-09-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6349184U JPS6349184U (enExample) | 1988-04-02 |
| JPH0345033Y2 true JPH0345033Y2 (enExample) | 1991-09-24 |
Family
ID=31049266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14146186U Expired JPH0345033Y2 (enExample) | 1986-09-17 | 1986-09-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0345033Y2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011153776A (ja) * | 2010-01-28 | 2011-08-11 | Mitsubishi Electric Corp | 冷却装置 |
-
1986
- 1986-09-17 JP JP14146186U patent/JPH0345033Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6349184U (enExample) | 1988-04-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5331510A (en) | Electronic equipment and computer with heat pipe | |
| US6256201B1 (en) | Plate type heat pipe method of manufacturing same and cooling apparatus using plate type heat pipe | |
| CN1069445C (zh) | 散热片组件及其制造方法 | |
| US20040188132A1 (en) | Printed Circuit Board with Isolated Metallic Substrate Comprising an Integrated Cooling System | |
| EP0969354A3 (en) | Heat sink device for electronic devices | |
| US7621316B2 (en) | Heat sink with heat pipes and method for manufacturing the same | |
| KR100436970B1 (ko) | 이동체의박스내에있는전기부품의냉각장치 | |
| JPH1065385A (ja) | 基板ケース構造体 | |
| US7411790B2 (en) | Heat sink with built-in heat pipes for semiconductor packages | |
| JPH0731027B2 (ja) | ヒートパイプおよび放熱装置 | |
| KR970707581A (ko) | 열적 및 전기적 강화 플라스틱 핀 그리드 어레이(ppga) 패키지(thermally and electrically enhanced plastic pin grid array (ppga) package) | |
| US20070000645A1 (en) | Heat exchange module for electronic components | |
| US20050173096A1 (en) | Heat dissipating device | |
| JP4370179B2 (ja) | ヒートパイプ式ヒートシンク | |
| JPWO1999053256A1 (ja) | 板型ヒートパイプとその実装構造 | |
| US20050180110A1 (en) | Heat dissipation structure | |
| JPH0374864A (ja) | 基板冷却装置 | |
| JP3332858B2 (ja) | 板型ヒートパイプとそれを用いた冷却構造 | |
| JP4011272B2 (ja) | 半導体冷却装置 | |
| JP3982947B2 (ja) | ヒートシンクの固定構造 | |
| JP2847670B2 (ja) | 放熱効果の優れた半導体素子用ヒートシンク | |
| KR200338520Y1 (ko) | 방열성능이 향상된 인쇄회로기판 | |
| JP4002249B2 (ja) | 発熱部品冷却用放熱装置 | |
| JPS6369298A (ja) | プリント板の放熱構造 | |
| JP2768018B2 (ja) | 半導体素子実装体 |