JPH0344847U - - Google Patents
Info
- Publication number
- JPH0344847U JPH0344847U JP10682789U JP10682789U JPH0344847U JP H0344847 U JPH0344847 U JP H0344847U JP 10682789 U JP10682789 U JP 10682789U JP 10682789 U JP10682789 U JP 10682789U JP H0344847 U JPH0344847 U JP H0344847U
- Authority
- JP
- Japan
- Prior art keywords
- dip switch
- lead
- utility
- base
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案のＤＩＰスイツチの斜視図であ
る。第２図は本考案のＤＩＰスイツチを半田デイ
ツプしている状態を示す断面図である。 １……ＤＩＰスイツチ、２……ボデイ、３……
リード、４……エポキシ樹脂又はシリコン樹脂、
５……半田槽、６……半田。
る。第２図は本考案のＤＩＰスイツチを半田デイ
ツプしている状態を示す断面図である。 １……ＤＩＰスイツチ、２……ボデイ、３……
リード、４……エポキシ樹脂又はシリコン樹脂、
５……半田槽、６……半田。
Claims (1)
- リードの根元に樹脂を塗布したことを特徴とす
るＤＩＰスイツチ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10682789U JPH0344847U (ja) | 1989-09-11 | 1989-09-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10682789U JPH0344847U (ja) | 1989-09-11 | 1989-09-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0344847U true JPH0344847U (ja) | 1991-04-25 |
Family
ID=31655547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10682789U Pending JPH0344847U (ja) | 1989-09-11 | 1989-09-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0344847U (ja) |
-
1989
- 1989-09-11 JP JP10682789U patent/JPH0344847U/ja active Pending