JPH0343764U - - Google Patents

Info

Publication number
JPH0343764U
JPH0343764U JP10428189U JP10428189U JPH0343764U JP H0343764 U JPH0343764 U JP H0343764U JP 10428189 U JP10428189 U JP 10428189U JP 10428189 U JP10428189 U JP 10428189U JP H0343764 U JPH0343764 U JP H0343764U
Authority
JP
Japan
Prior art keywords
thick film
film resistor
conductive path
connection part
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10428189U
Other languages
English (en)
Other versions
JP2509489Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989104281U priority Critical patent/JP2509489Y2/ja
Publication of JPH0343764U publication Critical patent/JPH0343764U/ja
Application granted granted Critical
Publication of JP2509489Y2 publication Critical patent/JP2509489Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【図面の簡単な説明】
第1図は、この考案の好適な実施例を示す平面
図、第2図は第1図の矢視A−A線方向断面図で
ある。 1……基板、2……導電路、21……厚膜抵抗
の接続部、22……チツプ素子の接続部、23…
…スリツト、3……厚膜抵抗、4……チツプ素子
、5……半田。

Claims (1)

    【実用新案登録請求の範囲】
  1. 基板と、該基板上に形成した各導電路と、該各
    導電路間に橋絡して形成した厚膜抵抗と、該厚膜
    抵抗の上部に重畳して載置しかつ端部を前記導電
    路に半田付けしたチツプ素子とを備えた混成集積
    回路基板に於いて、前記導電路は厚膜抵抗の接続
    部とチツプ素子の接続部を分離する各スリツトを
    設けたことを特徴とする混成集積回路基板。
JP1989104281U 1989-09-05 1989-09-05 混成集積回路基板 Expired - Lifetime JP2509489Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989104281U JP2509489Y2 (ja) 1989-09-05 1989-09-05 混成集積回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989104281U JP2509489Y2 (ja) 1989-09-05 1989-09-05 混成集積回路基板

Publications (2)

Publication Number Publication Date
JPH0343764U true JPH0343764U (ja) 1991-04-24
JP2509489Y2 JP2509489Y2 (ja) 1996-09-04

Family

ID=31653078

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989104281U Expired - Lifetime JP2509489Y2 (ja) 1989-09-05 1989-09-05 混成集積回路基板

Country Status (1)

Country Link
JP (1) JP2509489Y2 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55154502U (ja) * 1979-04-20 1980-11-07
JPS58131650U (ja) * 1982-02-27 1983-09-05 日本メクトロン株式会社 可撓性回路基板
JPS6240462U (ja) * 1985-08-29 1987-03-11

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55154502U (ja) * 1979-04-20 1980-11-07
JPS58131650U (ja) * 1982-02-27 1983-09-05 日本メクトロン株式会社 可撓性回路基板
JPS6240462U (ja) * 1985-08-29 1987-03-11

Also Published As

Publication number Publication date
JP2509489Y2 (ja) 1996-09-04

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