JPH0343762U - - Google Patents
Info
- Publication number
- JPH0343762U JPH0343762U JP10369789U JP10369789U JPH0343762U JP H0343762 U JPH0343762 U JP H0343762U JP 10369789 U JP10369789 U JP 10369789U JP 10369789 U JP10369789 U JP 10369789U JP H0343762 U JPH0343762 U JP H0343762U
- Authority
- JP
- Japan
- Prior art keywords
- flexible circuit
- circuit boards
- terminals
- terminal
- welded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003466 welding Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10369789U JPH0343762U (cs) | 1989-09-04 | 1989-09-04 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10369789U JPH0343762U (cs) | 1989-09-04 | 1989-09-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0343762U true JPH0343762U (cs) | 1991-04-24 |
Family
ID=31652520
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10369789U Pending JPH0343762U (cs) | 1989-09-04 | 1989-09-04 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0343762U (cs) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007194459A (ja) * | 2006-01-20 | 2007-08-02 | Sumitomo Electric Ind Ltd | フレキシブル回路基板 |
JP2016528726A (ja) * | 2013-07-24 | 2016-09-15 | エルジー ディスプレイ カンパニー リミテッド | 軟性印刷回路基板の構造体 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63127595A (ja) * | 1986-11-17 | 1988-05-31 | オムロン株式会社 | プリント基板の接続方法 |
JPS63250890A (ja) * | 1987-04-08 | 1988-10-18 | シャープ株式会社 | 多層プリント基板の製造方法 |
-
1989
- 1989-09-04 JP JP10369789U patent/JPH0343762U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63127595A (ja) * | 1986-11-17 | 1988-05-31 | オムロン株式会社 | プリント基板の接続方法 |
JPS63250890A (ja) * | 1987-04-08 | 1988-10-18 | シャープ株式会社 | 多層プリント基板の製造方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007194459A (ja) * | 2006-01-20 | 2007-08-02 | Sumitomo Electric Ind Ltd | フレキシブル回路基板 |
JP4696924B2 (ja) * | 2006-01-20 | 2011-06-08 | 住友電気工業株式会社 | フレキシブル回路基板 |
JP2016528726A (ja) * | 2013-07-24 | 2016-09-15 | エルジー ディスプレイ カンパニー リミテッド | 軟性印刷回路基板の構造体 |
US9872389B2 (en) | 2013-07-24 | 2018-01-16 | Lg Display Co., Ltd. | Flexible printed circuit board structure |