JPH0343732U - - Google Patents
Info
- Publication number
- JPH0343732U JPH0343732U JP10468989U JP10468989U JPH0343732U JP H0343732 U JPH0343732 U JP H0343732U JP 10468989 U JP10468989 U JP 10468989U JP 10468989 U JP10468989 U JP 10468989U JP H0343732 U JPH0343732 U JP H0343732U
- Authority
- JP
- Japan
- Prior art keywords
- metal substrate
- semiconductor element
- bonding pad
- electrically connected
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/754—
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10468989U JPH0343732U (OSRAM) | 1989-09-06 | 1989-09-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10468989U JPH0343732U (OSRAM) | 1989-09-06 | 1989-09-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0343732U true JPH0343732U (OSRAM) | 1991-04-24 |
Family
ID=31653476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10468989U Pending JPH0343732U (OSRAM) | 1989-09-06 | 1989-09-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0343732U (OSRAM) |
-
1989
- 1989-09-06 JP JP10468989U patent/JPH0343732U/ja active Pending