JPH0343701A - Method for peeling color filter - Google Patents
Method for peeling color filterInfo
- Publication number
- JPH0343701A JPH0343701A JP1178697A JP17869789A JPH0343701A JP H0343701 A JPH0343701 A JP H0343701A JP 1178697 A JP1178697 A JP 1178697A JP 17869789 A JP17869789 A JP 17869789A JP H0343701 A JPH0343701 A JP H0343701A
- Authority
- JP
- Japan
- Prior art keywords
- color filter
- solid
- state image
- ashing
- image sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 27
- 238000004380 ashing Methods 0.000 claims abstract description 25
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000001301 oxygen Substances 0.000 claims abstract description 15
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000004506 ultrasonic cleaning Methods 0.000 claims abstract description 8
- 239000007789 gas Substances 0.000 claims description 9
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 6
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims 1
- 229910001882 dioxygen Inorganic materials 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 3
- 230000002411 adverse Effects 0.000 abstract description 3
- 229910052710 silicon Inorganic materials 0.000 abstract description 3
- 239000010703 silicon Substances 0.000 abstract description 3
- 239000011347 resin Substances 0.000 description 15
- 229920005989 resin Polymers 0.000 description 15
- 238000004043 dyeing Methods 0.000 description 5
- 239000000975 dye Substances 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 235000010724 Wisteria floribunda Nutrition 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 239000001045 blue dye Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000001046 green dye Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000001044 red dye Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 102000004190 Enzymes Human genes 0.000 description 1
- 108090000790 Enzymes Proteins 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- JOSWYUNQBRPBDN-UHFFFAOYSA-P ammonium dichromate Chemical compound [NH4+].[NH4+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O JOSWYUNQBRPBDN-UHFFFAOYSA-P 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- SURLGNKAQXKNSP-DBLYXWCISA-N chlorin Chemical compound C\1=C/2\N/C(=C\C3=N/C(=C\C=4NC(/C=C\5/C=CC/1=N/5)=CC=4)/C=C3)/CC\2 SURLGNKAQXKNSP-DBLYXWCISA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000007447 staining method Methods 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Optical Filters (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、カラーフィルタの剥離方法に関し、さらに詳
しくは、基板及びその付属部品に悪影響を及ぼすことの
ないカラーフィルタの剥離方法に関するものである。[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a method for peeling off a color filter, and more particularly, to a method for removing a color filter without adversely affecting a substrate and its attached parts. .
〈従来技術〉
従来、固体撮像素子もしくはガラス板などの基板に、カ
ラーフィルタを形成する方法としては、“染色法”が一
般に知られている。<Prior Art> Conventionally, a "staining method" is generally known as a method for forming a color filter on a solid-state image sensor or a substrate such as a glass plate.
この染色法によるカラーフィルタの製造方法を第２図（
ａ）を用いて説明すると、上記基板が固体撮像素子１４
である場合は、固体撮像素子１４の表面の凹凸に対し、
必要に応して平坦１Ｊ１６を透明性、平坦性、密着性の
優れた樹脂をコートして形成する。次いで被染色性のレ
ジストをコートし、露光、現像して染色所望域をパター
ン化し、該パターン域を所定の分光特性を有する染料で
染色し着色樹脂層１１とする０次に防染性を有する樹脂
をコートし、露光、現像し、中間Ｊｉｉ１３を形成する
。Figure 2 shows the method for manufacturing color filters using this dyeing method (
To explain using a), the substrate is a solid-state image sensor 14.
In this case, for the unevenness of the surface of the solid-state image sensor 14,
If necessary, the flat 1J16 is formed by coating with a resin having excellent transparency, flatness, and adhesion. Next, a dyeable resist is coated, exposed and developed to pattern the desired dyeing area, and the patterned area is dyed with a dye having predetermined spectral characteristics to form the colored resin layer 11, which has zero-order dye resistance. A resin is coated, exposed and developed to form intermediate Jii13.
その後、被染色性のレジストのコート以降の工程をくり
返し、すべての着色樹脂層１、１１″１１゛と中間層１
３．１３°を形成後、着色樹脂層１、 １１’、１１’
”保護のため、透明樹脂をコートしてオーバーコート層
１２を設け、カラーフィルタ１７が製造される。ここで
カラーフィルタ１７とは、着色樹脂層１、 １１’、１
１”、中間層１３．１３°、オーバーコートＩ！１１２
を言う。After that, repeat the process after coating with dyeable resist to coat all the colored resin layers 1, 11"11" and the intermediate layer 1.
3. After forming 13°, colored resin layers 1, 11', 11'
"For protection, the overcoat layer 12 is coated with a transparent resin, and the color filter 17 is manufactured. Here, the color filter 17 refers to the colored resin layers 1, 11', 1.
1”, intermediate layer 13.13°, overcoat I!112
say.
しかし、近年カラーフィルタには、高い信頼性と精度が
要求されているため、レジストの塗布ムラ、現像ムラ、
染色ムラやゴミの付着等による傷のために、カラーフィ
ルタ製造工程の歩留りは極めて低いのが現状である。However, in recent years, color filters are required to have high reliability and precision, so there are problems such as uneven resist coating, uneven development, etc.
Currently, the yield rate of the color filter manufacturing process is extremely low due to scratches caused by uneven dyeing and adhesion of dust.
従って上記のムラ、傷等の不都合が生じた場合には、−
旦固体撮像素子（例えばチャージカップルドデバイス二
以下単にＣＣＤという）等の基板からカラーフィルタを
剥離し、再使用することが望まれる。Therefore, if the above-mentioned problems such as unevenness and scratches occur, -
It is desirable to remove the color filter from the substrate of a solid-state image sensor (for example, a charge coupled device (hereinafter simply referred to as CCD)) and reuse it.
その剥離方法としては、従来濃硫酸などを用いた酸処理
法、水酸化ナトリウム、水酸化カリウムなどの塩基性水
溶液に全体を浸漬する方法が知られている。これらの処
理方法は、カラーフィルタを容易に剥離することができ
るが、ＣＣＤ表面を浸食したり、アル呉ニウム配線を溶
解させるために、全数を再使用することは困難である。Conventionally known methods for removing the film include an acid treatment method using concentrated sulfuric acid or the like, and a method of immersing the entire film in a basic aqueous solution such as sodium hydroxide or potassium hydroxide. Although these processing methods can easily peel off the color filter, it is difficult to reuse all the color filters because they erode the CCD surface or dissolve the aluminum wiring.
また、特開昭６１−１４８４０２号公報では、紫外線を
照射したのち、１００〜１５０°Ｃに加熱したジメチル
スルホキシド、シクロヘキサノン等の有機溶剤中に５〜
２０分浸漬する剥離方法が、更に、特開昭６２１２４１
７４号公報では基板を２５０〜３００°Ｃに加熱したの
ち、エチレンジアミン、１，２−プロパンジアミン等の
ポリアミン類に５０〜１２０’ｃにて１０〜１２０分浸
漬する剥離方法が知られている。これらは、ＣＣＤの基
板表面からカラーフィルタを十分に再現性良く剥離する
ことができないといった問題点があった。In addition, in JP-A No. 61-148402, after irradiating with ultraviolet rays, 5 to
A peeling method of soaking for 20 minutes is further disclosed in Japanese Patent Application Laid-Open No. 621241.
No. 74 discloses a peeling method in which the substrate is heated to 250 to 300°C and then immersed in a polyamine such as ethylenediamine or 1,2-propanediamine at 50 to 120°C for 10 to 120 minutes. These methods have a problem in that the color filter cannot be peeled off from the surface of the CCD substrate with sufficient reproducibility.
〈発明が解決しようとする課題〉
本発明の目的は、上記の問題点を解消し、基板及びその
付属品に悪影響を及ぼすことのないカラーフィルタの剥
離方法を提供するものである。<Problems to be Solved by the Invention> An object of the present invention is to solve the above-mentioned problems and provide a method for removing a color filter without adversely affecting the substrate and its accessories.
く課題を解決するための手段〉
本発明は、固体撮像素子上のカラーフィルタを、酸素プ
ラズマ等を利用してアッシングするとともに、純水中に
て超音波洗浄を行なうカラーフィルタの剥離方法である
。Means for Solving the Problems> The present invention is a color filter peeling method in which a color filter on a solid-state image sensor is ashed using oxygen plasma or the like and ultrasonic cleaning is performed in pure water. .
さらに、カラーフィルタの下部に透明樹脂からなる平担
化層が形成されている場合、カラーフィルタの酸素プラ
ズマ等を利用したアッシング、超音波洗浄後、再びアッ
シングを行なって、平担化層を除去するカラーフィルタ
の剥離方法である。Furthermore, if a flattened layer made of transparent resin is formed at the bottom of the color filter, the flattened layer can be removed by ashing the color filter using oxygen plasma, etc., and after ultrasonic cleaning, ashing again. This is a color filter peeling method.
また、酸素プラズマの代わりに、酸素とＣＦ ｓの混合
ガスのプラズマ、もしくは、基板を１００°Ｃ及至３０
０℃に加熱した状態にてオゾンガスを吹き付けて、アッ
シングする剥離方法である。In addition, instead of oxygen plasma, plasma of a mixed gas of oxygen and CFs, or substrate heating at 100°C and 30°C
This is a peeling method in which ashing is performed by spraying ozone gas while heated to 0°C.
く作用〉
上記のように、酸素プラズマを用いてカラーフィルタを
アッシングするとともに、アッシング処理によって発生
した残渣を、純水中にて超音波洗浄を行なうことで容易
に除去でき、短時間で、シリコン基板上の固体撮像素子
にダメージを与えることなく、カラーフィルタを剥離す
ることができる。As mentioned above, in addition to ashing the color filter using oxygen plasma, the residue generated by the ashing process can be easily removed by ultrasonic cleaning in pure water. The color filter can be peeled off without damaging the solid-state image sensor on the substrate.
さらに、アッシングのガスに酸素とＣＦ、の混合ガスを
用いれば、アッシング速度が増大するとともに、アッシ
ング残渣を軽減することができる。Furthermore, if a mixed gas of oxygen and CF is used as the ashing gas, the ashing speed can be increased and the amount of ashing residue can be reduced.
また、基板を１００”Ｃ及至３００”Ｃに加熱し、オゾ
ンガスを吹き付けてアッシングを行なえば、プラズマに
よる電気的ダメージを皆無にできるため、プラズマ処理
のできない素子にも本発明の剥離方法が適用可能である
。Furthermore, by heating the substrate to 100"C to 300"C and performing ashing by spraying ozone gas, electrical damage caused by plasma can be completely eliminated, so the peeling method of the present invention can be applied to elements that cannot be subjected to plasma treatment. It is.
固体撮像素子上に、透明な樹脂を用いて表面に平坦化層
を設け、その上にカラーフィルタを形成した場合には、
始めに、カラーフィルタをアッシングして除去し、純水
中で超音波洗浄を行なって残渣を除去したのち、再びア
ッシング処理を行なって固体撮像素子上の平坦化層を除
去することで、カラーフィルタから生したアッシング残
渣によって、平坦化層のアッシングが阻害されることな
く、カラーフィルタの剥離が行なえる。When a flattening layer is provided on the surface of a solid-state image sensor using transparent resin, and a color filter is formed on top of the flattening layer,
First, the color filter is removed by ashing, and the residue is removed by ultrasonic cleaning in pure water.The color filter is then removed by ashing again to remove the flattened layer on the solid-state image sensor. The color filter can be peeled off without the ashing of the flattening layer being inhibited by the ashing residue generated from the ashing.
〈実施例１〉
本実施例に使用するカラーフィルタ付き固体撮像素子の
製造方法及び剥離方法の一実施例を第１図（ａ）１〜）
を用いて説明する。<Example 1> An example of the manufacturing method and peeling method of the solid-state image sensor with a color filter used in this example is shown in FIG. 1 (a) 1-)
Explain using.
固体撮像素子４を形成したシリコン基板上に、１０重量
％の重クロム酸アンモニウムを含むゼラチン水溶液から
なる染色性フォトレジストを、５μｍの膜厚となるよう
にスピンコードし、１ｔａＩｉｌ小投影露光装置にコン
■製）を用いて露光、現像し所定のパターンを形成した
。その後、染色液中に浸漬し、水洗、乾燥し、着色樹脂
層２を形成した。染料としては、
１）赤色染料としては、例えばスミノール・シーリング
・スカーレット・Ｇ（住友化学■製商品名）２）緑色染
料としては、例えばスミノール・シーリング・ブリリア
ント・グリーン・５Ｇ （住友化学■製商品名）
３）青色染料としては、例えば、カヤノール・シーリン
グ・ブルー・ＧＷ （日本化薬味製商品名）等が知られ
ている。On the silicon substrate on which the solid-state image sensor 4 was formed, a dyeable photoresist made of an aqueous gelatin solution containing 10% by weight of ammonium dichromate was spin-coded to a film thickness of 5 μm, and then applied to a 1taIil small projection exposure device. A predetermined pattern was formed by exposure and development using a commercially available product (manufactured by Kon ■). Thereafter, it was immersed in a dyeing solution, washed with water, and dried to form a colored resin layer 2. As dyes, 1) Red dyes include, for example, Suminol Ceiling Scarlet G (product name manufactured by Sumitomo Chemical ■); 2) Green dyes include, for example, Suminol Ceiling Brilliant Green 5G (product name manufactured by Sumitomo Chemical ■). 3) Known blue dyes include, for example, Kayanol Sealing Blue GW (trade name, manufactured by Nippon Kakami Co., Ltd.).
また、着色樹脂層１を他の染料による染色から保護する
為、ネガ型透明フォトレジストＦＶＲ（富士薬品工業■
製）を塗布し、露光、現像して中間層３を形成した。赤
色染料、緑色染料、青色染料により、全ての着色樹脂層
１，１°８ビと中間層３，３゛を形成後、着色樹脂層１
，１°、１°゛を保護する為、ネガ型透明フォトレジス
トＦＶＲ（富士薬品工業■製）を塗布し、露光、現像し
てオーバーコート層２を形成し〔第１図（ａ））、カラ
ーフィルタ７を作成した。In addition, in order to protect the colored resin layer 1 from dyeing with other dyes, a negative transparent photoresist FVR (Fuji Pharmaceutical Co., Ltd.
Co., Ltd.) was coated, exposed and developed to form the intermediate layer 3. After forming all colored resin layers 1, 1° 8-bi and intermediate layers 3, 3' with red dye, green dye, and blue dye, colored resin layer 1
, 1°, and 1°, a negative transparent photoresist FVR (manufactured by Fuji Pharmaceutical Co., Ltd.) was applied, exposed and developed to form an overcoat layer 2 [Fig. 1(a)], Color filter 7 was created.
このカラーフィルタ７付き固体撮像素子４を、平行平板
型プラズマアッシング装置にセントし、酸素プラズマに
てカラーフィルタ７をアッシングした。処理条件は、○
ｔ １００ ＳＣＣＭ、 、 ＯＴｏｒｒ、Ｒｆ
電力３００ Ｗ、処理時間は３０分間である。その後、
純水中に浸漬し、１０分間超音波洗浄を行なった〔第１
図Ｑ）））。This solid-state image sensor 4 with color filter 7 was placed in a parallel plate type plasma ashing device, and color filter 7 was ashed with oxygen plasma. Processing conditions are ○
t 100 SCCM, , OTorr, Rf
The power was 300 W and the treatment time was 30 minutes. after that,
It was immersed in pure water and subjected to ultrasonic cleaning for 10 minutes [first
Figure Q))).
その結果、固体撮像素子４の表面、および配線等を損傷
することなく、カラーフィルタ７の剥離を行なうことが
できた。固体撮像素子４の電気的ダメージも問題のない
レベルであった。As a result, the color filter 7 could be removed without damaging the surface of the solid-state image sensor 4, the wiring, etc. Electrical damage to the solid-state image sensor 4 was also at a level that caused no problems.
〈実施例２〉
実施例１と同様に作製したカラーフィルタ付き固体撮像
素子を、同一のアッシング装置にセットし、酵素とＣＦ
４の混合ガスにてカラーフィルタをアッシングした。処
理条件は、０□ １００ ＳＣＣＭ 、 ＣＦ４
２０ＳＣＣＭ、 ０．５Ｔｏｒｒ、 Ｒｆ電力３０
０Ｗであり、処理時間は１０分間である０次いで、実施
例１と同様に洗浄を行なった。<Example 2> A solid-state image sensor with a color filter manufactured in the same manner as in Example 1 was set in the same ashing device, and enzyme and CF
The color filter was ashed with the mixed gas of step 4. Processing conditions are 0□ 100 SCCM, CF4
20SCCM, 0.5Torr, Rf power 30
The power was 0W and the treatment time was 10 minutes.Next, cleaning was performed in the same manner as in Example 1.
本実施例においても、固体撮像素子にダメージを与える
ことなく、カラーフィルタの剥離がｊテなえ、実施例１
よりもより短時間で処理できた。In this example as well, the color filter could not be peeled off without causing damage to the solid-state image sensor.
could be processed in a shorter time.
〈実施例３〉
本実施例を第２図（ａ）〜（Ｃ）を用いて詳細に説明す
る。<Example 3> This example will be described in detail using FIGS. 2(a) to (C).
固体撮像素子１４を形成したシリコン基板上に、ネガ型
透明レジストＦｖＲ（富士薬品工業■製）を塗布し、固
体撮像素子１４の表面に平坦化層１６を形成した０次い
で、実施例１と同様の操作を行なって、固体撮像素子１
４上に、カラーフィルタ１７を作製した（第２図（ａ）
参照）。A negative transparent resist FvR (manufactured by Fuji Pharmaceutical Co., Ltd.) was applied onto the silicon substrate on which the solid-state image sensor 14 was formed, and a flattening layer 16 was formed on the surface of the solid-state image sensor 14.Then, the same process as in Example 1 was performed. The solid-state image sensor 1 is
4, a color filter 17 was fabricated (Fig. 2(a)
reference).
この、カラーフィルタ１７付の固体撮像素子１４を、オ
ゾンアッシング装７０Ａ−２４００（クロリンエンジニ
アズ■製）を用い、カラーフィルタ１７をアッシングし
た。処理条件は、○ア４１ ／ ｍ ｉｎ（オゾン濃度
８０００ｐｐｉ 、？Ｈ＝度２００’Ｃ１処理時間３０
分間である。その後、実施例１と同様に洗浄した〔第２
図（ｂ）参照〕、さらに、オゾンアッシング装置にて、
１５分間処理し、平坦化層１６を除去した〔第２図（Ｃ
）参照〕。This solid-state image sensor 14 with a color filter 17 was subjected to ashing using an ozone ashing device 70A-2400 (manufactured by Chlorin Engineers ■). The processing conditions are ○A41/min (ozone concentration 8000ppi, ?H=degrees 200'C1 processing time 30
It is a minute. Thereafter, it was washed in the same manner as in Example 1.
Refer to figure (b)], and further, with an ozone ashing device,
After processing for 15 minutes, the planarization layer 16 was removed [Fig. 2 (C)
)reference〕.
その結果、固体撮像素子１４に損傷を与えることなく、
カラーフィルタ１７及び下地の平坦化層１６を剥離する
ことができた。As a result, without damaging the solid-state image sensor 14,
The color filter 17 and the underlying flattening layer 16 could be peeled off.
〈発明の効果〉
本発明によれば、従来回収の難しかった、カラーフィル
タを形成した固体撮像素子基板から、素子に損傷を与え
ることなく、カラーフィルタを剥離することが可能とな
った。その結果、カラーフィルタが不良の基板から、カ
ラーフィルタを剥離し、再びカラーフィルタを形成する
ことで、カラーフィルタネ良固体撮像素子の再使用が可
能となり、カラーフィルタ付き固体撮像素子のコストを
第１図（ａ）、（ｂ）は、本発明のカラーフィルタ剥離
方法の一実施例であり、第２図（ａ）〜（Ｃ）は、本発
明のカラーフィルタ剥離方法の他の実施例である。<Effects of the Invention> According to the present invention, it has become possible to peel off a color filter from a solid-state image sensor substrate on which a color filter is formed, which has been difficult to recover in the past, without damaging the element. As a result, by peeling off the color filter from a substrate with a defective color filter and forming a color filter again, it is possible to reuse a solid-state image sensor with a defective color filter, thereby reducing the cost of a solid-state image sensor with a color filter. Figures 1 (a) and (b) show one embodiment of the color filter peeling method of the present invention, and Figures 2 (a) to (C) show other embodiments of the color filter peeling method of the present invention. be.
、１°、１°゛６着色樹脂層 ２、オーバーコート層 ３．３’、中間層 ４、固体撮像素子 ５、受光部 ７、カラーフィルタ １、１１”、１１”、着色樹脂層 １２、 オーバーコート層 １３″、 中間層 固体撮像素子 受光部 平坦化層 カラーフィルタ 特 許 出 願 人 凸版印刷株式会社 代表者 鈴木和夫 第１図（ｂ） 第 ２ 図 、ａン 第２ 図（ｂ） 第２図（ｃ）, 1°, 1°゛6 colored resin layer 2. Overcoat layer 3.3', middle layer 4. Solid-state image sensor 5. Light receiving part 7. Color filter 1, 11", 11", colored resin layer 12. Overcoat layer 13″, middle class solid-state image sensor Light receiving section planarization layer color filter Special Person asking for permission Toppan Printing Co., Ltd. Representative: Kazuo Suzuki Figure 1(b) Figure 2, a Second Figure (b) Figure 2(c)
Claims (4)
いて、前記カラーフィルタを酸素プラズマによってアッ
シングしたのち、純水中で超音波洗浄を行なうカラーフ
ィルタの剥離方法。(1) A method for peeling off a color filter on a solid-state image sensor, in which the color filter is ashed with oxygen plasma and then ultrasonically cleaned in pure water.
離方法において、前記カラーフィルタを酸素プラズマに
よってアッシングしたのち、純水中で超音波洗浄を行な
い、再び酸素プラズマ中にて平坦化層をアッシングして
、除去するカラーフィルタの剥離方法。(2) In the method of peeling off the flattening layer on the solid-state image sensor and the color filter, after the color filter is ashed with oxygen plasma, ultrasonic cleaning is performed in pure water, and the flattening layer is removed again in oxygen plasma. How to remove color filters by ashing.
との混合ガスからなるプラズマによって、アッシングす
ることを特徴とする請求項（１）又は（２）に記載のカ
ラーフィルタの剥離方法。(3) The color filter peeling method according to claim (1) or (2), characterized in that ashing is performed using plasma made of a mixed gas of oxygen gas and CF_4 gas instead of oxygen plasma.
したカラーフィルタ付き固体撮像素子上に、オゾンガス
を吹きつけ、アッシングすることを特徴とする請求項（
１）又は（２）に記載のカラーフィルタの剥離方法。(4) Instead of oxygen plasma, ozone gas is blown onto the solid-state image sensor with a color filter heated to 100 to 300°C to perform ashing.
The color filter peeling method described in 1) or (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17869789A JPH0754363B2 (en) | 1989-07-11 | 1989-07-11 | Color filter peeling method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17869789A JPH0754363B2 (en) | 1989-07-11 | 1989-07-11 | Color filter peeling method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0343701A true JPH0343701A (en) | 1991-02-25 |
| JPH0754363B2 JPH0754363B2 (en) | 1995-06-07 |
Family
ID=16052975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17869789A Expired - Lifetime JPH0754363B2 (en) | 1989-07-11 | 1989-07-11 | Color filter peeling method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0754363B2 (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| JPH0754363B2 (en) | 1995-06-07 |
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