JPH0342982Y2 - - Google Patents

Info

Publication number
JPH0342982Y2
JPH0342982Y2 JP1986163602U JP16360286U JPH0342982Y2 JP H0342982 Y2 JPH0342982 Y2 JP H0342982Y2 JP 1986163602 U JP1986163602 U JP 1986163602U JP 16360286 U JP16360286 U JP 16360286U JP H0342982 Y2 JPH0342982 Y2 JP H0342982Y2
Authority
JP
Japan
Prior art keywords
mold
plunger
lower mold
equal pressure
pressure cylinder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1986163602U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6370310U (US07655688-20100202-C00086.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986163602U priority Critical patent/JPH0342982Y2/ja
Publication of JPS6370310U publication Critical patent/JPS6370310U/ja
Application granted granted Critical
Publication of JPH0342982Y2 publication Critical patent/JPH0342982Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP1986163602U 1986-10-27 1986-10-27 Expired JPH0342982Y2 (US07655688-20100202-C00086.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986163602U JPH0342982Y2 (US07655688-20100202-C00086.png) 1986-10-27 1986-10-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986163602U JPH0342982Y2 (US07655688-20100202-C00086.png) 1986-10-27 1986-10-27

Publications (2)

Publication Number Publication Date
JPS6370310U JPS6370310U (US07655688-20100202-C00086.png) 1988-05-11
JPH0342982Y2 true JPH0342982Y2 (US07655688-20100202-C00086.png) 1991-09-09

Family

ID=31091950

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986163602U Expired JPH0342982Y2 (US07655688-20100202-C00086.png) 1986-10-27 1986-10-27

Country Status (1)

Country Link
JP (1) JPH0342982Y2 (US07655688-20100202-C00086.png)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5623059U (US07655688-20100202-C00086.png) * 1979-07-31 1981-03-02

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5623059U (US07655688-20100202-C00086.png) * 1979-07-31 1981-03-02

Also Published As

Publication number Publication date
JPS6370310U (US07655688-20100202-C00086.png) 1988-05-11

Similar Documents

Publication Publication Date Title
EP0497700B1 (en) Rotary molding machine
JPH0342982Y2 (US07655688-20100202-C00086.png)
US5366368A (en) Multi-plunger manual transfer mold die
KR960006777B1 (ko) 취입 금형(blow mold)의 체결장치
JPS6233317Y2 (US07655688-20100202-C00086.png)
JP3055724B2 (ja) 金型装置
CN210389885U (zh) 一种包胶塑件悬浮模具
KR102078722B1 (ko) 반도체 패키지 제조 장치
JPH0122732B2 (US07655688-20100202-C00086.png)
CN212046116U (zh) 一种扣手自动脱模的窨井盖模压模具
CN219650365U (zh) 一种密封罩模具
JPH0369688B2 (US07655688-20100202-C00086.png)
CN211866576U (zh) 压铸机
CN214982828U (zh) 一种多功能式注塑模具
CN221249625U (zh) 一种具有防压模结构的注塑装置
CN216096268U (zh) 一种分体式板块成型模具
JPS6235630A (ja) 樹脂封止形半導体装置成形用モ−ルド金型
JPH0432756Y2 (US07655688-20100202-C00086.png)
JPH0329131Y2 (US07655688-20100202-C00086.png)
JPS59110124A (ja) レジンモ−ルド装置
KR910000877Y1 (ko) 코어찍힘 방지장치
KR960004091B1 (ko) 매뉴얼 트랜스퍼 몰드다이의 제품취출장치
JPH0642336Y2 (ja) 半導体素子の樹脂封止装置
JPS635227Y2 (US07655688-20100202-C00086.png)
JP3002226U (ja) 半導体素子の樹脂封止装置