JPH0342701B2 - - Google Patents
Info
- Publication number
- JPH0342701B2 JPH0342701B2 JP60231702A JP23170285A JPH0342701B2 JP H0342701 B2 JPH0342701 B2 JP H0342701B2 JP 60231702 A JP60231702 A JP 60231702A JP 23170285 A JP23170285 A JP 23170285A JP H0342701 B2 JPH0342701 B2 JP H0342701B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode plate
- hollow insulator
- semiconductor device
- semiconductor element
- elastic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W76/138—
-
- H10W72/00—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60231702A JPS6290951A (ja) | 1985-10-16 | 1985-10-16 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60231702A JPS6290951A (ja) | 1985-10-16 | 1985-10-16 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6290951A JPS6290951A (ja) | 1987-04-25 |
| JPH0342701B2 true JPH0342701B2 (OSRAM) | 1991-06-28 |
Family
ID=16927660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60231702A Granted JPS6290951A (ja) | 1985-10-16 | 1985-10-16 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6290951A (OSRAM) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5040234B2 (ja) | 2006-09-26 | 2012-10-03 | 三菱電機株式会社 | 圧接型半導体装置 |
-
1985
- 1985-10-16 JP JP60231702A patent/JPS6290951A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6290951A (ja) | 1987-04-25 |
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