JPH0341956U - - Google Patents
Info
- Publication number
- JPH0341956U JPH0341956U JP10187089U JP10187089U JPH0341956U JP H0341956 U JPH0341956 U JP H0341956U JP 10187089 U JP10187089 U JP 10187089U JP 10187089 U JP10187089 U JP 10187089U JP H0341956 U JPH0341956 U JP H0341956U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- pulse
- circuit
- plate
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 239000002470 thermal conductor Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- 230000017525 heat dissipation Effects 0.000 claims 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 238000010292 electrical insulation Methods 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 230000005855 radiation Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Description
図面は実施例を示し、第１図は分解状態斜視図
で各回路素子間の配線を省略してあり、第２図は
組立状態斜視図、第３図は組立状態側面図である
。
１…配線機構、２…熱良導体板、４…樹脂材、
６…放射用レンズ機構部分、７…ネジ、８…間座
、１０…パルス発生回路、１５…レーザダイオー
ド。
The drawings show an embodiment; FIG. 1 is an exploded perspective view with wiring between circuit elements omitted, FIG. 2 is an assembled perspective view, and FIG. 3 is an assembled side view. 1... Wiring mechanism, 2... Good thermal conductor plate, 4... Resin material,
6... Radiation lens mechanism part, 7... Screw, 8... Spacer, 10... Pulse generation circuit, 15... Laser diode.
Claims (1)
群を並列に設けたパルス発生回路により得られる
パルス幅の狭いパルス電流をレーザダイオードに
与えることによつてレーザパルスを得るようにし
たレーザパルス発生装置であつて、 ａ 前記パルス発生回路の各回路素子を配線基
板の裏面側に配置し、前記レーザダイオードを前
記パルス発生回路の中央付近に位置付けるととも
に前記レーザパルスの発光部分を前記配線基板の
表面側に向けて配置した回路基板部と、 ｂ 前記裏面側と対向し、前記配線基板との間
に間隔を設けて熱良導体板を配置した放熱対向板
部と、 ｃ 前記配線基板と前記熱良導体板との間の間
隙に、電気絶縁性と熱良導性とをもつ樹脂材を充
填した熱均等化部と を具備することを特徴とする装置。 (2) 実用新案登録請求範囲請求項第１項記載の
装置であつて、 ａ 前記配線基板として両面に導体板を設けた
ものを用い、前記表面側の前記導体板を接地可能
な回路側に接続して構成した回路基板部形成手段
と、 ｂ 前記熱良導体板をアルミニウム板にすると
ともに、前記配線基板との間に支柱を設けて前記
配線基板と前記アルミニウム板とを固定して構成
する放熱対向板部形成手段と、 ｃ 前記樹脂材としてアルミナ粉末入りエポキ
シ樹脂を充填して構成する熱均等化部形成手段と を具備することを特徴とする装置。[Claims for Utility Model Registration] (1) A laser pulse is obtained by applying a pulse current with a narrow pulse width obtained by a pulse generation circuit including a series group of a plurality of avalanche transistors in parallel to a laser diode. A laser pulse generator according to the present invention, wherein: a) each circuit element of the pulse generating circuit is arranged on the back side of a wiring board, the laser diode is positioned near the center of the pulse generating circuit, and the light emitting part of the laser pulse is a circuit board section disposed toward the front surface side of the wiring board; b. a heat dissipation opposing plate section facing the back surface side and having a good thermal conductor plate disposed with a space between the wiring board; and c. the wiring board. A device comprising: a thermal equalization section filled with a resin material having electrical insulation and thermal conductivity in a gap between the substrate and the thermally conductive plate. (2) The device according to claim 1 of the Utility Model Registration Claim, wherein: (a) the wiring board is provided with conductor plates on both sides, and the conductor plate on the front side is placed on the circuit side that can be grounded. a circuit board part forming means configured by connecting; b) a heat dissipation device configured by using an aluminum plate as the thermally good conductor plate and fixing the wiring board and the aluminum plate by providing a support between the wiring board and the wiring board; An apparatus characterized by comprising: a means for forming an opposing plate part; and c) a means for forming a heat equalizing part formed by filling an epoxy resin containing alumina powder as the resin material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10187089U JPH0744040Y2 (en) | 1989-08-31 | 1989-08-31 | Laser pulse generator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10187089U JPH0744040Y2 (en) | 1989-08-31 | 1989-08-31 | Laser pulse generator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0341956U true JPH0341956U (en) | 1991-04-22 |
| JPH0744040Y2 JPH0744040Y2 (en) | 1995-10-09 |
Family
ID=31650793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10187089U Expired - Fee Related JPH0744040Y2 (en) | 1989-08-31 | 1989-08-31 | Laser pulse generator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0744040Y2 (en) |
-
1989
- 1989-08-31 JP JP10187089U patent/JPH0744040Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0744040Y2 (en) | 1995-10-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI229725B (en) | Backlight module and heat dissipation structure thereof | |
| US6318886B1 (en) | High flux led assembly | |
| CA2098330A1 (en) | Electrical Device Cooling System Using a Heat Sink Attached to a Circuit Board Containing Heat Conductive Layers and Channels | |
| JPH0341956U (en) | ||
| TWI607675B (en) | Dc/dc power module and dc/dc power system assembly | |
| JP2916626B2 (en) | Forced cooling laser pulse generator | |
| JPH0617168Y2 (en) | Matrix display panel | |
| JPH077109A (en) | Package mounting structure | |
| JPH07111378A (en) | Packaging structure of double-sided packaging board | |
| JPH0715963B2 (en) | Semiconductor device | |
| JPS6398699U (en) | ||
| JPS6214700Y2 (en) | ||
| JPH02143872A (en) | Optical printer head | |
| CN207652765U (en) | A kind of radiating circuit plate | |
| CN210696954U (en) | Heat abstractor and double faced mirror | |
| CN212970577U (en) | Combined heat radiation assembly | |
| JP5295202B2 (en) | Heat dissipation structure | |
| JPS61241162A (en) | End type thermal head | |
| JPH0341510Y2 (en) | ||
| JPH0452954Y2 (en) | ||
| JPH0415892U (en) | ||
| JPS61161745A (en) | Semiconductor device | |
| JPH02220854A (en) | Thermal head | |
| WO2013153667A1 (en) | Heat dissipation structure | |
| JPH056701Y2 (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |