JPH0341934U - - Google Patents
Info
- Publication number
- JPH0341934U JPH0341934U JP10331989U JP10331989U JPH0341934U JP H0341934 U JPH0341934 U JP H0341934U JP 10331989 U JP10331989 U JP 10331989U JP 10331989 U JP10331989 U JP 10331989U JP H0341934 U JPH0341934 U JP H0341934U
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- flexible substrate
- curved portion
- bonding pads
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10331989U JPH0341934U (,) | 1989-09-01 | 1989-09-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10331989U JPH0341934U (,) | 1989-09-01 | 1989-09-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0341934U true JPH0341934U (,) | 1991-04-22 |
Family
ID=31652165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10331989U Pending JPH0341934U (,) | 1989-09-01 | 1989-09-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0341934U (,) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022168478A1 (ja) * | 2021-02-05 | 2022-08-11 | 株式会社村田製作所 | モジュール |
-
1989
- 1989-09-01 JP JP10331989U patent/JPH0341934U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022168478A1 (ja) * | 2021-02-05 | 2022-08-11 | 株式会社村田製作所 | モジュール |
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