JPH034175A - Probe - Google Patents
ProbeInfo
- Publication number
- JPH034175A JPH034175A JP13744289A JP13744289A JPH034175A JP H034175 A JPH034175 A JP H034175A JP 13744289 A JP13744289 A JP 13744289A JP 13744289 A JP13744289 A JP 13744289A JP H034175 A JPH034175 A JP H034175A
- Authority
- JP
- Japan
- Prior art keywords
- probe
- inspected
- contact
- contact surface
- conductor pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 title claims abstract description 108
- 239000004020 conductor Substances 0.000 claims abstract description 34
- 238000012360 testing method Methods 0.000 claims description 32
- 239000000758 substrate Substances 0.000 claims description 6
- 238000007689 inspection Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000000691 measurement method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野1
本発明は、基板上にある導体パターンの導通状態を検査
する導通検査装置のプローブに関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field 1] The present invention relates to a probe for a continuity testing device that tests the continuity state of a conductor pattern on a substrate.
[従来の技術1
従来、基板上にある導体パターンの導通状態を検査する
導通検査装置のプローブとしては、例えば、互いに電気
的に絶縁され近接した2つのプローブを211用いる、
いわゆる4jl子測定法のプローブがあり、被検査部に
前記圧いに電気的に絶縁され近接した2つのニードル型
プローブを2組同時に接触させて、被測定導体パターン
間の電圧測定を行なうことにより、予しめ設定された電
圧値と比較しで、前記導体パターンの導通状態を検査す
るようにしたものが本出願人により提案されている(特
開昭62−282277)、又、実開昭61−1001
37には、前記導体パターンと接触するプローブの先端
が、ニードル状で、このニードル型プローブは、導体パ
ターンの被検査部に弾性的に付勢されて接触し、導体パ
ターンの電気特性を検査する、いわゆるニードル型プロ
ーブである。[Prior Art 1] Conventionally, as a probe of a continuity testing device for testing the continuity state of a conductor pattern on a substrate, for example, two probes 211 that are electrically insulated from each other and close to each other are used.
There is a probe that uses the so-called 4JL measurement method, in which two sets of two needle-type probes that are electrically insulated and close to each other are brought into contact with the part to be tested at the same time, and the voltage between the conductor patterns to be measured is measured. The present applicant has proposed a device in which the conductivity state of the conductor pattern is tested by comparing it with a preset voltage value (Japanese Patent Application Laid-Open No. 62-282277), -1001
37, the tip of the probe that comes into contact with the conductor pattern is needle-shaped, and the needle-shaped probe is elastically biased and comes into contact with the portion to be inspected of the conductor pattern to test the electrical characteristics of the conductor pattern. This is a so-called needle type probe.
[発明が解決しようとした課題1
このような前記2つの従来の技術の様に先端が点状のニ
ードル型プローブでは、前記導体パターンの被検査部に
接触させる際には、前記被検査部内に非導電部である穴
が存在する場合、プローブの先端と検査すべき被検査部
との位置決めが不正確であると前記ニードル型プローブ
の先端が前記穴内に落札たり、又、穴の外縁の丸味にか
かると、前記ニードル型プローブの先端が、被検査部か
ら外れたり、プローブの本末の接触部と異なる部分で接
触するなど、接触抵抗が不安定になり、そのため、正し
い導通検査が出来なかった。これを解決するため、前記
ニードル型プローブの被検査部に対する位ra調整をよ
り高精度にする必要があり、このため、位置決め装置が
複雑になる課題があった。又、ニードル型プローブの先
端と前記被検査部が接触する面積が0.2mm2以下だ
と、位置ずれのために接触状態が不安定となったり、接
触抵抗が不安定になる課題があった。[Problem to be Solved by the Invention 1] In a needle type probe having a dotted tip as in the above two conventional techniques, when the probe is brought into contact with the part to be inspected of the conductor pattern, it is difficult to If there is a hole that is a non-conductive part, if the positioning of the tip of the probe and the part to be inspected is inaccurate, the tip of the needle-type probe may fall into the hole, or the outer edge of the hole may become rounded. When this happens, the tip of the needle-type probe comes off the part to be tested or comes into contact with a different part from the contact part at the end of the probe, resulting in unstable contact resistance, which makes it impossible to perform a proper continuity test. . In order to solve this problem, it is necessary to adjust the position ra of the needle type probe with respect to the part to be inspected with higher precision, which causes the problem that the positioning device becomes complicated. Further, if the area of contact between the tip of the needle probe and the inspected portion is less than 0.2 mm2, there is a problem that the contact state becomes unstable due to positional deviation, and the contact resistance becomes unstable.
本発明は、被検査部とプローブとの被検査部上での接触
面が、該接触面の長手方向と長手方向と直交する方向の
各々で長さが異なる接触面を有する構造としたため、被
検査部と前記ブa−ブの位置決めがある程度ずれても、
前記プローブと被検査部との接触が良好に行なえ、導通
検査に悪影響を及ぼすこと無く、前記基板上にある導体
パターンの導通検査が正しく出来るプローブを提供する
ことを目的としている。The present invention has a structure in which the contact surface between the part to be inspected and the probe on the part to be inspected has a contact surface having different lengths in the longitudinal direction of the contact surface and in the direction perpendicular to the longitudinal direction. Even if the positioning of the inspection part and the tube a-b deviates to some extent,
It is an object of the present invention to provide a probe that allows good contact between the probe and a part to be inspected, and allows correct continuity testing of a conductor pattern on the substrate without adversely affecting the continuity testing.
[課題を解決する為の手段1
かかる目的を達成するために、基板上にある導体パター
ンの導通状態を検査する導通検査装置における前記プロ
ーブは、前記導体パターンの被検査部とプローブとの被
検査部上での接触面が、該接触面の長手方向と長手方向
と直交する方向の各々で長さが異なる接触面を有する。[Means for Solving the Problems 1] In order to achieve the above object, the probe in the continuity testing device that tests the continuity state of the conductor pattern on the board is configured to detect the connection between the part to be tested of the conductor pattern and the probe. The contact surface on the part has a contact surface having different lengths in each of the longitudinal direction of the contact surface and the direction perpendicular to the longitudinal direction.
また、前記プローブは、前記被検査部とプローブとの被
検査部上での接触面が、プローブの長手方向中心軸に対
し、角度を有し、伸びる接触面を有する。Further, the probe has an extending contact surface between the inspected section and the probe on the inspected section, which has an angle with respect to the longitudinal center axis of the probe.
更に、前記被検査部とプローブとの被検査部上での接触
面の面積が0.2mm”以上である。Furthermore, the area of the contact surface between the inspected section and the probe on the inspected section is 0.2 mm'' or more.
【作用1
本発明のプローブを用いた場合、前記基板上にある導体
パターンの被検査部とプローブとの被検査部上での接触
面が、該接触面の長手方向と長手方向と直交する方向の
各々で長さが異なる接触面で接触させるので、導通検査
時に、前記被検査部と前記プローブの接触面が増え、か
つ確実に接触させるものである。[Operation 1] When the probe of the present invention is used, the contact surface between the tested part of the conductor pattern on the substrate and the probe on the tested part is in the longitudinal direction of the contact surface and in the direction perpendicular to the longitudinal direction. Since the probes are brought into contact with each other through contact surfaces having different lengths, the number of contact surfaces between the part to be tested and the probe is increased during a continuity test, and the probes are brought into contact reliably.
「実施例J
以下、図面に基いて本発明の1実施例である4端子測定
法に用いるプローブの1組を例として説明する。Embodiment J Hereinafter, one set of probes used in a four-terminal measurement method, which is an embodiment of the present invention, will be explained with reference to the drawings.
第1図は、本発明の第1の実施例であるプローブの錯視
図であり、第2図−(a)は、f51図プローブの先端
の拡大図、第2図−(b)は、#1図プa−プの先端と
被検査部の接触状態を示す平面図、第2図−(c)は、
第1図プローブが少なくとも被検査部の平坦面と接触す
る断面図である。#S1図において、被検査部2は、プ
リント配線基板12の導体パターン2aのターミナルに
相当し、銅や金、アルミニウムなどの厚膜導電部材で形
成されており、被検査部2の中に有る非導電部である穴
3は、メモリ等の能動部品のリードあるいは、コンデン
サ、抵抗等の受動部品のリードを挿入する為に、貫通孔
などで形成されており、又、絶縁材で形成された保持板
6と導電部5を介して接続された、はぼ平行な幅を有す
るプローブ1は全体が導電性材料で形成され、先端に曲
げ部1a及び1bを備えており、第2図−(、)及び第
2図−(b)に示す如く、前記被検査部2とプローブ1
との被検査部2上での接触面4が、該接触面4の長手方
向と長手方向と直交する方向の各々で長さが異なる接触
面4で接触する。FIG. 1 is an optical illusion diagram of the probe according to the first embodiment of the present invention, FIG. 2 (a) is an enlarged view of the tip of the f51 probe, and FIG. Figure 1-(c) is a plan view showing the contact state between the tip of the probe and the part to be inspected, and Figure 2-(c) is
FIG. 1 is a cross-sectional view in which the probe contacts at least a flat surface of a portion to be inspected. # In the diagram S1, the part to be inspected 2 corresponds to the terminal of the conductor pattern 2a of the printed wiring board 12, and is made of a thick film conductive material such as copper, gold, or aluminum. The hole 3, which is a non-conductive part, is formed as a through hole, etc., for inserting the lead of an active component such as a memory, or the lead of a passive component such as a capacitor or resistor, and is also made of an insulating material. The probe 1, which has a substantially parallel width and is connected to the holding plate 6 via the conductive part 5, is entirely made of a conductive material and has bent parts 1a and 1b at its tip, as shown in FIG. , ) and as shown in FIG. 2-(b), the part to be inspected 2 and the probe 1
The contact surface 4 on the inspected part 2 contacts with the contact surface 4 having different lengths in each of the longitudinal direction of the contact surface 4 and the direction orthogonal to the longitudinal direction.
↓
なお、この接触4は、導体パターン2aの導通状態を検
査する際に、被検査部2とプローブ1との被検査部2上
での接触面である。更に、第2図−(b)においで、矩
形状の接触面4ではなく、被検査部2とプローブ1との
接触面4の長手方向と直交する方向の長さが極めて短く
、線状に接触することどの非平坦面2″以外の平坦面2
″と少な(とも、前記接触面4の長手方向と長手方向と
直交する方向の各々で長さが異なって接触する。↓ Note that this contact 4 is a contact surface between the part to be tested 2 and the probe 1 on the part to be tested 2 when testing the conduction state of the conductor pattern 2a. Furthermore, in FIG. 2-(b), the length of the contact surface 4 between the part to be inspected 2 and the probe 1 in the direction orthogonal to the longitudinal direction is extremely short, and the contact surface 4 is not rectangular. Flat surfaces 2 other than any non-flat surfaces 2'' that come into contact
'' and small (both have different lengths in the longitudinal direction of the contact surface 4 and in a direction orthogonal to the longitudinal direction).
尚、第1図において、リード線7は導電部5を介して、
プローブ1と電気的に接続されており、保持体8はプロ
ーブヘッド(図示省略)へプローブ全体を固定するため
設けられている。In addition, in FIG. 1, the lead wire 7 is connected via the conductive part 5.
It is electrically connected to the probe 1, and the holder 8 is provided to fix the entire probe to a probe head (not shown).
$3図は、本発明の第1の実施例の変形を示す第2の実
施例であるプローブの斜視図であり、第4図は、第3図
プローブの先端の拡大図、第5図は、第3図プローブが
弾性体を介して、被検査部に接触する際の接触状態を示
す断面図であり、第6図は、第3図、第4図におけるプ
ローブの先端形状を変えた本発明の第3の実施例を示す
図であり、その接触状態の変化を示す断面図である。f
jS3図において、プローブ9は、前記被検査部2と接
触する、矩形状の接触面9aを有し、板状の弾性部9b
とからなり、前記弾性部9bと前記接触面9aとは、連
結部材9cにより連結されており、又、弾性部9bは、
保持体10に固定されており、プローブ9は、第1の実
施例と同様、導電性材料で形成されて、プローブ9の接
触面9aと被検査部2の導通電気信号をリード線11を
もって外部に取り出す構造となっている。そして、保持
体10は、プローブヘッド(図示省略)へ固定される。Figure 3 is a perspective view of a second embodiment of the probe, which is a modification of the first embodiment of the present invention. Figure 4 is an enlarged view of the tip of the probe shown in Figure 3. , Fig. 3 is a sectional view showing the contact state when the probe contacts the part to be inspected via an elastic body, and Fig. 6 is a cross-sectional view showing the state of contact when the probe contacts the part to be inspected via an elastic body. It is a figure which shows the 3rd Example of this invention, and is sectional drawing which shows the change of the contact state. f
jS3, the probe 9 has a rectangular contact surface 9a that comes into contact with the inspected section 2, and a plate-shaped elastic section 9b.
The elastic part 9b and the contact surface 9a are connected by a connecting member 9c, and the elastic part 9b is
The probe 9 is fixed to a holder 10, and the probe 9 is made of a conductive material as in the first embodiment, and conducts electrical signals between the contact surface 9a of the probe 9 and the part to be inspected 2 to the outside using a lead wire 11. The structure is such that it can be taken out. The holder 10 is then fixed to a probe head (not shown).
第5図において、前記不図示のプローブヘッドが降下し
、プローブ9がプリント配線基板12上に形成された導
体パタ矩形状に形成された接触面9aは、同図の如く、
被検査部2と密着せず、接触面9aの一方の端が浮上が
るため、第6図の破線で示す如(、予しめ与えた弾性付
勢力に応じて、弾性部9bがたわんでも、丁度、被検査
部2の平坦面2′に接触する当接面9dが平坦面2′に
接触する接触面9a’ を有する様、プローブ9の先端
に角度θを予じめ付けである。In FIG. 5, the probe head (not shown) is lowered, and the contact surface 9a of the probe 9 formed in the rectangular shape of the conductor pattern formed on the printed wiring board 12 is as shown in the same figure.
Since it does not come into close contact with the part to be inspected 2 and one end of the contact surface 9a rises, even if the elastic part 9b bends according to the elastic biasing force given in advance (as shown by the broken line in FIG. The tip of the probe 9 is preset at an angle θ so that the contact surface 9d that contacts the flat surface 2' of the part to be inspected 2 has a contact surface 9a' that contacts the flat surface 2'.
第7図は、7レキシプル基板13の表面に予しめ設けら
れた任意の幅で形成された銅や金、アルミニウムなどの
厚膜導電部材から成る配線パターン14bをプローブ1
4として用いる本発明のtjS4の実施例であるプロー
ブの斜視図であり、第8図は、第7図のプローブの一部
と被検査部2の接触状態を示す拡大図、tI%9図は、
第8図におけるプローブの接触面14a′の形状が異な
るtjS5の実施例を示す平面図である。FIG. 7 shows a wiring pattern 14b made of a thick film conductive material such as copper, gold, or aluminum formed in advance on the surface of a 7-lexiple board 13 with an arbitrary width, and connected to a probe 1.
FIG. 8 is an enlarged view showing a contact state between a part of the probe in FIG. 7 and the part to be inspected 2, and FIG. ,
9 is a plan view showing an embodiment of tjS5 in which the shape of the contact surface 14a' of the probe is different from that in FIG. 8. FIG.
以下本発明の第4の実施例について説明する。A fourth embodiment of the present invention will be described below.
第7図は、2本の配線パターン14bとひとつの被検査
11s2が接触しうるプローブの例を示しており、フレ
キシブル基@13の表面には、任意の幅で形成された銅
や金、アルミニウムなどの厚膜導電部材から成る配線パ
ターン14bが形成されており、前記7レキシプル基板
13の裏面をゴムやシリコンなどの弾性体17を介して
、絶縁物から成る保持体15に前記7レキシプル基@1
3を固定している。そして、7レキンプル基板13の被
検査部2との接触面14aは、前記被検査部2と接触す
る様、形成し、リード@16は、前記配線パターン14
bと電気的に接続されており、前記プリント配縁基板1
2に形成された被検査部21こ、配線パターン14bを
接触させ、プローブ14として使用することにより、第
8図に示す接触面14a′で被検査部2の導通検査が行
なわれる。又、前記保持体15は、プローブヘッド(図
示省略)へ固定されている。FIG. 7 shows an example of a probe in which two wiring patterns 14b and one test object 11s2 can come into contact. A wiring pattern 14b made of a thick film conductive material such as 1
3 is fixed. The contact surface 14a of the seven-layer board 13 with the part to be inspected 2 is formed so as to be in contact with the part to be inspected 2, and the lead @16 is connected to the wiring pattern 14.
b, and is electrically connected to the printed wiring board 1
By bringing the wiring pattern 14b into contact with the inspected section 21 formed in the test section 2 and using it as a probe 14, a continuity test of the inspected section 2 is performed at the contact surface 14a' shown in FIG. Further, the holder 15 is fixed to a probe head (not shown).
次に本発明の第5の実施例であるff19図は、第8図
に示す被検査部2との配線パターン14bの接触面14
a′に相当する部分をコの字状に対向する配線パターン
18及び19として用いることを示している。又、第7
図において、2本の配線パターン14bとひとつの被検
査部2が接触する例について説明したが、これに限るも
のではなく、ひとつの被検査部2に対し、接触する配線
パターンの数が1本でも可能である。Next, FIG. ff19, which is a fifth embodiment of the present invention, shows the contact surface 14 of the wiring pattern 14b with the part to be inspected 2 shown in FIG.
It is shown that the portion corresponding to a' is used as wiring patterns 18 and 19 facing each other in a U-shape. Also, the seventh
In the figure, an example in which two wiring patterns 14b and one inspected part 2 are in contact has been explained, but the present invention is not limited to this, and the number of wiring patterns in contact with one inspected part 2 is one. But it is possible.
なお、以上は被検査部2に穴3がある場合について説明
したが、前記被検査部2には穴3が無い場合にも適用で
きる。又、被検査部2がターミナルの例について説明し
たが、導体パターン2aについても、前記プローブ1.
9.14との導体パターン2a上での接触面が、該接触
面の長手方向と長手方向と直交する方向の各々で!3が
異なる接触面で接触させて、導通検査を実施出来る。In addition, although the case where the to-be-inspected part 2 has the hole 3 was demonstrated above, it is applicable also to the case where the said to-be-inspected part 2 does not have the hole 3. Further, although an example has been described in which the part to be inspected 2 is a terminal, the conductor pattern 2a is also similar to the probe 1.
The contact surface with 9.14 on the conductor pattern 2a is in the longitudinal direction of the contact surface and in the direction perpendicular to the longitudinal direction! 3 can be brought into contact with different contact surfaces to perform a continuity test.
以」−14i子測定法に用いるプローブを1組の近接す
る2つのプローブとして述べたが、ひとつのプローブを
独立に別々の場所にある被検査部2にプローブを接触さ
せる場合も同様に適用出来る。Hereinafter, the probes used in the 14i probe measurement method have been described as a set of two probes that are close to each other, but the same can be applied to the case where one probe is brought into contact with the inspected parts 2 at different locations. .
更に、前記導体パターンの導通状態を検査する際に、前
記被検査部とプローブとの被検査部上での接触面の長手
方向と長手方向と直交する方向の各々で長さが異なる接
触面を有することについて述べたが、前記接触面の面積
が0.2m112以上あれば、円形、正方形の接触面で
あっても良く、要は、点状でない接触状態を有すれば良
い。Furthermore, when testing the conductivity state of the conductive pattern, a contact surface between the part to be tested and the probe on the part to be tested has a contact surface having different lengths in the longitudinal direction and in a direction orthogonal to the longitudinal direction. However, as long as the area of the contact surface is 0.2 m112 or more, it may be a circular or square contact surface, and in short, it is sufficient to have a non-point-like contact state.
[発明の効果J
以上本発明によれば、請求項1により、基板上にある導
体パターンの導通状態を検査する導通検査装置のプロー
ブにおいて、前記導体パターンの被検査部と前記プロー
ブを接触させ、導体パターンの導通状態を検査する際に
、前記被検査部と前記プローブとの被検査部上での接触
面が、該接触面の長手方向と長手方向と直交する方向の
各々で長さが異なる接触面を有するので、ニードル型プ
ローブで代表される点状で被検査部と接触することによ
る接触抵抗の不安定さを、接触面が広くできるため、プ
ローブの先端と被検査部の位置がずれても、解消出来る
。又、本発明のプローブと被検査部が点接触から面接触
となり、このため、被検査部とのプローブの位置調整も
より簡単になる。[Effects of the Invention J] According to the present invention, according to claim 1, in a probe of a continuity testing device for testing the continuity state of a conductor pattern on a substrate, a portion to be inspected of the conductor pattern is brought into contact with the probe; When testing the conductivity state of a conductor pattern, a contact surface between the part to be tested and the probe on the part to be tested has different lengths in a longitudinal direction of the contact surface and in a direction perpendicular to the longitudinal direction. Since the contact surface has a wide contact surface, the instability of contact resistance caused by point-like contact with the part to be inspected, which is typical of needle-type probes, can be reduced, and the position of the tip of the probe and the part to be inspected can be misaligned. However, it can be resolved. Further, the probe of the present invention and the part to be inspected change from point contact to surface contact, which makes it easier to adjust the position of the probe with respect to the part to be inspected.
請求項2により、前記プローブが導体パターンの導通状
態を検査する際に、前記被検査部とプローブとの被検査
部上での接触面が、プローブの長手方向中心軸に対し、
角度を有し、伸びる接触面を有するので、被検査部の外
縁がだれていても、本発明のプローブが滑ること無く、
少なくとも前記被検査部の平坦面と接触し、かつ、被検
査部の中に穴が存在しても、前記プローブが前記穴に落
ちる等の検査ミス・もれが無くなり、基板上にある導体
パターンの正確な導通検査が可能となる。According to the second aspect, when the probe inspects the conduction state of the conductive pattern, the contact surface between the test target part and the probe on the test target part is set such that the contact surface between the test target part and the probe is relative to the longitudinal center axis of the probe.
Since it has an angled and extending contact surface, the probe of the present invention will not slip even if the outer edge of the part to be inspected is sagging.
At least the conductor pattern on the board is in contact with the flat surface of the part to be inspected, and even if there is a hole in the part to be inspected, there is no inspection error or leakage such as the probe falling into the hole. Accurate continuity testing becomes possible.
請求項3により、前記導体パターンの導通状態を検査す
る際に、前記被検査部とプローブとの被検査部上での接
触面の面積が0.2IIIIl12以上であるので、本
発明のプローブの接触面が、実用上、十分な程度に確保
出来、安定した導通検査が出来る。According to claim 3, when inspecting the conductive state of the conductor pattern, the area of the contact surface between the inspected section and the probe on the inspected section is 0.2III112 or more, so that the probe of the present invention makes contact. A sufficient surface area can be secured for practical use, and stable continuity testing can be performed.
第1図は、本発明の第1の実施例であるプローブの斜視
図、第2図−(a)は、第1図プローブの先端の拡大図
、第2図−(b)は、第1図プローブの先端と被検査部
の接触状態を示す平面図、tjS2図−(c)は、第1
図プローブが少なくとも被検査部の平坦面と接触する断
面図、第3図は、本発明の第2の実施例であるプローブ
の斜視図、第4図は、第3図プローブの先端の拡大図、
tjSs図は、第3図プローブが弾性体を介して、被検
査部に接触する際の接触状態を示す断面図、第6図は、
第3図、第4図におけるプローブの先端形状を変えた本
発明の第3の実施例である接触状態の変化を示す断面図
、#S7図は、本発明の第4の実施例であるプローブの
斜視図、第8図は、fjS7図のプローブの一部と被検
査部2の接触状態を示す拡大図、fjS9図は、第8図
におけるプローブの接触面14a′の形状が異なる本発
明のff15の実施例を示す平面図、第10図は、従来
のニードル型プローブの先端の拡大図、f:tSl1図
は、第10図ニードル型プローブが被検査部と接触する
断面図である。
1.9.14・φ・プローブ
2011拳・ニードル型プローブ
2・・・被検査部
2′ ・・・平坦面 2″′・・・非平坦面3・・
・穴
4.9a、 9a’ 、14a、 14a’ ・・・
接触面8.10.15・・・保持体
7.11.16・・・リードli 9b・・・弾性
部12・・・プリント配線基板
13・・・7レキシプル基板
14b ・・・配線パターンFIG. 1 is a perspective view of the probe according to the first embodiment of the present invention, FIG. 2-(a) is an enlarged view of the tip of the probe in FIG. FIG.
3 is a perspective view of the probe according to the second embodiment of the present invention; FIG. 4 is an enlarged view of the tip of the probe shown in FIG. 3. ,
The tjSs diagram is a cross-sectional view showing the contact state when the probe in Figure 3 contacts the part to be inspected via the elastic body, and Figure 6 is
FIGS. 3 and 4 are cross-sectional views showing changes in the contact state according to the third embodiment of the present invention in which the shape of the tip of the probe is changed, and FIG. #S7 is a probe according to the fourth embodiment of the present invention. FIG. 8 is an enlarged view showing the contact state between a part of the probe in FIG. fjS7 and the part to be inspected 2, and FIG. FIG. 10 is an enlarged view of the tip of a conventional needle-type probe, and FIG. f:tSl1 is a sectional view of the needle-type probe in FIG. 1.9.14・φ・Probe 2011 Fist/needle probe 2... Part to be inspected 2'... Flat surface 2'''... Non-flat surface 3...
・Hole 4.9a, 9a', 14a, 14a'...
Contact surface 8.10.15...Holding body 7.11.16...Lead li 9b...Elastic part 12...Printed wiring board 13...7 Lexiple board 14b...Wiring pattern
Claims (1)
通検査装置のプローブにおいて、前記導体パターンの被
検査部と前記プローブを接触させ、導体パターンの導通
状態を検査する際に、前記被検査部と前記プローブとの
被検査部上での接触面が、該接触面の長手方向と長手方
向と直交する方向の各々で長さが異なる接触面を有する
ことを特徴としたプローブ。 2、前記プローブが導体パターンの導通状態を検査する
際に、前記被検査部とプローブとの被検査部上での接触
面が、プローブの長手方向中心軸に対し、角度を有し、
伸びる接触面を有することを特徴とした特許請求の範囲
第1項記載のプローブ。 3、前記導体パターンの導通状態を検査する際に、前記
被検査部とプローブとの被検査部上での接触面の面積が
0.2mm^2以上であることを特徴とした特許請求の
範囲第1項又は第2項記載のプローブ。[Claims] 1. In a probe of a continuity testing device for testing the continuity state of a conductor pattern on a substrate, when testing the continuity state of the conductor pattern by bringing the probe into contact with a portion to be tested of the conductor pattern. The contact surface between the inspected section and the probe on the inspected section has a contact surface having different lengths in a longitudinal direction of the contact surface and in a direction perpendicular to the longitudinal direction. probe. 2. When the probe tests the conductivity state of the conductor pattern, a contact surface between the test target part and the probe on the test target part has an angle with respect to the longitudinal center axis of the probe;
Probe according to claim 1, characterized in that it has an elongated contact surface. 3. The scope of claims characterized in that when testing the conductivity state of the conductor pattern, the area of the contact surface between the part to be tested and the probe on the part to be tested is 0.2 mm^2 or more. The probe according to item 1 or 2.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13744289A JPH034175A (en) | 1989-06-01 | 1989-06-01 | Probe |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13744289A JPH034175A (en) | 1989-06-01 | 1989-06-01 | Probe |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH034175A true JPH034175A (en) | 1991-01-10 |
Family
ID=15198720
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13744289A Pending JPH034175A (en) | 1989-06-01 | 1989-06-01 | Probe |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH034175A (en) |
-
1989
- 1989-06-01 JP JP13744289A patent/JPH034175A/en active Pending
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